公开(公告)号：US20210249572A1

公开(公告)日：2021-08-12

申请号：US16664686

申请日：2019-10-25

Applicant: CREE, INC.

Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L25/075

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

公开(公告)号：US10468565B2

公开(公告)日：2019-11-05

申请号：US14575805

申请日：2014-12-18

Applicant: CREE, INC.

Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

公开(公告)号：US20220139852A1

公开(公告)日：2022-05-05

申请号：US17085386

申请日：2020-10-30

Applicant: Cree, Inc.

Inventor： Arthur Pun

IPC: H01L23/00 ,  H01L29/20 ,  H01L29/16 ,  H01L21/02

Abstract: A transistor device structure may include a submount, a transistor device on the carrier submount, and a metal bonding layer between the submount and the transistor die, the metal bonding stack providing mechanical attachment of the transistor die to the submount. The metal bonding stack may include gold, tin and nickel. A weight percentage of a combination of nickel and tin in the metal bonding layer is greater than 50 percent and a weight percentage of gold in the metal bonding layer is less than 25 percent.