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    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES
    2.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES 审中-公开
    带有多个单元光源的LED封装和具有弯曲和/或平面表面的包装

    公开(公告)号：US20150179903A1

    公开(公告)日：2015-06-25

    申请号：US14575805

    申请日：2014-12-18

    Applicant: CREE, INC.

    Inventor： ARTHUR PUN ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

    IPC: H01L33/54 ,  H01L33/44 ,  H01L33/60 ,  H01L33/48 ,  H01L33/08 ,  H01L33/50

    CPC classification number: H01L33/54 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 LED封装还针对允许根据本发明的LED封装的改进或定制的发光特性的特征或布置。 这些特征或布置中的一些包括但不限于光源尺寸与基座尺寸的较大比率，用于LED封装层的特定材料（例如，不同的硅氧烷），改进的反射层布置，改进的组成和 磷光体层的布置，调整密封剂的形状和/或改善层之间的结合。 这里仅公开了一些改进，其中一些导致LED封装具有比常规LED封装更高的发光强度的发光。

    COMPACT LED PACKAGE WITH REFLECTIVITY LAYER
    4.
    发明申请
    COMPACT LED PACKAGE WITH REFLECTIVITY LAYER 有权
    具有反射层的紧凑型LED封装

    公开(公告)号：US20140291715A1

    公开(公告)日：2014-10-02

    申请号：US14183218

    申请日：2014-02-18

    Applicant: CREE, INC.

    Inventor： JESSE REIHERZER ,  Jeremy Nevins ,  Michael John Bergmann ,  Joseph Gates Clark

    IPC: H01L33/60 ,  H01L33/54

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座，并且在具有多个LED的基座中，每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上，至少一些LED上，其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 封装还可以包括反射层，以最小化由光吸收引起的损耗，这进而可以增加整个封装的发射效率。

    LED package with multiple element light source and encapsulant having curved and/or planar surfaces
    6.
    发明授权
    LED package with multiple element light source and encapsulant having curved and/or planar surfaces 有权

    公开(公告)号：US10468565B2

    公开(公告)日：2019-11-05

    申请号：US14575805

    申请日：2014-12-18

    Applicant: CREE, INC.

    Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

    IPC: H01L33/54 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES
    7.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES 有权

    公开(公告)号：US20210249572A1

    公开(公告)日：2021-08-12

    申请号：US16664686

    申请日：2019-10-25

    Applicant: CREE, INC.

    Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

    IPC: H01L33/54 ,  H01L25/075

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

    Compact LED package with reflectivity layer
    8.
    发明授权
    Compact LED package with reflectivity layer 有权

    公开(公告)号：US10424702B2

    公开(公告)日：2019-09-24

    申请号：US14183218

    申请日：2014-02-18

    Applicant: CREE, INC.

    Inventor： Jesse Reiherzer ,  Jeremy Nevins ,  Michael John Bergmann ,  Joseph Gates Clark

    IPC: H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L23/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

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