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公开(公告)号：US20210074687A1
公开(公告)日：2021-03-11
申请号：US16950142
申请日：2020-11-17
Applicant: Cree, Inc.
Inventor： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：USD790486S1
公开(公告)日：2017-06-27
申请号：US29503928
申请日：2014-09-30
Applicant: CREE, INC.
Designer： Jesse Reiherzer , Jeremy Nevins , Joseph Gates Clark , Michael John Bergmann
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公开(公告)号：US09450163B1
公开(公告)日：2016-09-20
申请号：US14721525
申请日：2015-05-26
Applicant: Cree, Inc.
Inventor： Theodore D. Lowes , Peter Scott Andrews , Jesse Reiherzer , Amber Christine Salter
CPC classification number: H01L33/642 , H01L24/48 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H05K1/181 , H05K3/3436 , H05K2201/10106 , H01L2224/45099
Abstract: An SMD includes a substrate and one or more electrical contacts on a first surface of the substrate. Each one of the electrical contacts are configured to couple to a corresponding electrical contact located on a surface of a carrier, and are located within a concentric area of the first surface that is less than about 50% of a total area of the first surface. By providing the electrical contacts within the concentric area, the mechanical stress experienced by the electrical contacts can be significantly reduced when compared to conventional SMDs including electrical contacts on the outer edges thereof. Accordingly, the failure rate of the SMD due to separation of one or more of the electrical contacts from the carrier may be reduced.
Abstract translation: SMD包括衬底和在衬底的第一表面上的一个或多个电触点。 电触头中的每一个被配置为耦合到位于载体表面上的对应的电触点，并且位于第一表面的同心区域内，小于第一表面的总面积的约50％。 通过在同心区域内设置电触头，与传统的包括其外边缘上的电触点的SMD相比，可以显着降低由电触点所经历的机械应力。 因此，可以减少由于一个或多个电触点与载体分离导致的SMD的故障率。
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公开(公告)号：US20200176507A1
公开(公告)日：2020-06-04
申请号：US16203709
申请日：2018-11-29
Applicant: Cree, Inc.
Inventor： Nikolas Hall , Derek Miller , Anoop Mathew , Colin Blakely , Luis Breva , Jesse Reiherzer , David Todd Emerson
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.
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公开(公告)号：US10312224B2
公开(公告)日：2019-06-04
申请号：US15401240
申请日：2017-01-09
Applicant: Cree, Inc.
Inventor： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
IPC: H01L25/075 , H01L27/15 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L25/00 , H01L33/46 , H01L33/00 , H01L33/38 , H01L33/44
Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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Patent Agency Ranking
公开(公告)号：USD826871S1
公开(公告)日：2018-08-28
申请号：US29511587
申请日：2014-12-11
Applicant: CREE, INC.
Designer： Jesse Reiherzer , Jeremy Nevins , Joseph Clark
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公开(公告)号：US20170294418A1
公开(公告)日：2017-10-12
申请号：US15401240
申请日：2017-01-09
Applicant: Cree, Inc.
Inventor： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/382 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/502 , H01L33/504 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0033 , H01L2933/0058
Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：USD735683S1
公开(公告)日：2015-08-04
申请号：US29453958
申请日：2013-05-03
Applicant: CREE, INC.
Designer： Jesse Reiherzer , Mike Bergmann , Joseph Gates Clark
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公开(公告)号：US20150194580A1
公开(公告)日：2015-07-09
申请号：US14661874
申请日：2015-03-18
Applicant: CREE, INC.
Inventor： THEODORE LOWES , Eric Tarsa , Sten Heikman , Bernd Keller , Jesse Reiherzer , Hormoz Benjamin
CPC classification number: H01L33/54 , F21V9/00 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/0002 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.
Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装还可以包括具有一个或多个LED的底座以及一个或多个LED和底座上的毯子转换材料层。 密封剂可以在底座上，LED上方，并且在密封剂内部反射的光将到达转换材料，并将其全向吸收和发射。 这允许反射光现在从密封剂中逸出。 这允许例如当与具有半球密封剂或透镜的传统封装相比时，有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，使得在不同应用中使用封装更具灵活性。
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10.发明申请LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES 有权带多个元件的LED封装光源和具有平面表面的封装公开(公告)号：US20130328073A1
公开(公告)日：2013-12-12
申请号：US13649067
申请日：2012-10-10
Applicant: CREE, INC.
Inventor： THEODORE LOWES , Eric J. Tarsa , Sten Heikman , Bernd Keller , Jesse Reiherzer , Hormoz Benjamin
CPC classification number: H01L33/54 , F21V9/00 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/0002 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.
Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有发射不同颜色的光的多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在基座上，LED上方，并且在密封剂内反射的光将到达转换材料以被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 LED封装可以具有更高的芯片面积与LED封装面积比。 通过使用具有平面表面的密封剂，LED封装在特征和LED封装比率之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。
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