公开(公告)号：USD826871S1

公开(公告)日：2018-08-28

申请号：US29511587

申请日：2014-12-11

Applicant: CREE, INC.

Designer： Jesse Reiherzer ,  Jeremy Nevins ,  Joseph Clark

公开(公告)号：US20150179903A1

公开(公告)日：2015-06-25

申请号：US14575805

申请日：2014-12-18

Applicant: CREE, INC.

Inventor： ARTHUR PUN ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L33/44 ,  H01L33/60 ,  H01L33/48 ,  H01L33/08 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 LED封装还针对允许根据本发明的LED封装的改进或定制的发光特性的特征或布置。 这些特征或布置中的一些包括但不限于光源尺寸与基座尺寸的较大比率，用于LED封装层的特定材料（例如，不同的硅氧烷），改进的反射层布置，改进的组成和 磷光体层的布置，调整密封剂的形状和/或改善层之间的结合。 这里仅公开了一些改进，其中一些导致LED封装具有比常规LED封装更高的发光强度的发光。

公开(公告)号：USD892066S1

公开(公告)日：2020-08-04

申请号：US29655949

申请日：2018-07-09

Applicant: CREE, INC.

Designer： Jesse Reiherzer ,  Jeremy Nevins ,  Joseph Clark

公开(公告)号：US10468565B2

公开(公告)日：2019-11-05

申请号：US14575805

申请日：2014-12-18

Applicant: CREE, INC.

Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

公开(公告)号：US20210249572A1

公开(公告)日：2021-08-12

申请号：US16664686

申请日：2019-10-25

Applicant: CREE, INC.

Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L25/075

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.