LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES
    1.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES 审中-公开
    带多个元件的LED封装光源和具有平面表面的封装

    公开(公告)号:US20130328074A1

    公开(公告)日:2013-12-12

    申请号:US13770389

    申请日:2013-02-19

    Applicant: CREE, INC.

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.

    Abstract translation: 公开了紧凑且有效地发光的LED封装,并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座。 在具有多个LED的封装中,每个LED可以发射相同或不同波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 具有平坦表面的密封剂可以在基座上,至少一些LED上,平面表面引起光在封装内的全部内部反射。 密封剂内的TIR光可以到达转化材料,在那里它可以被全方位地吸收和发射。 与现有的具有半球密封剂的包装相比,TIR灯现在可以从密封剂中排出并且能够有效排放和更宽的排放特征。

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