公开(公告)号：US20130341634A1

公开(公告)日：2013-12-26

申请号：US13909927

申请日：2013-06-04

Applicant: CREE, INC.

Inventor： STEN HEIKMAN ,  JAMES IBBETSON

IPC: H01L33/10 ,  H01L33/32

CPC classification number: H01L33/10 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46

Abstract: A high efficiency LED chip is disclosed that comprises an active LED structure comprising an active layer between two oppositely doped layers. A first reflective layer can be provided adjacent to one of the oppositely doped layers, with the first layer comprising a material with a different index of refraction than the active LED structure. The difference in IR between the active LED structure and the first reflective layer increases TIR of light at the junction. In some embodiments the first reflective layer can comprise an IR lower than the semiconductor material, increasing the amount of light that can experience TIR. Some embodiments of LED chips according to the present invention can also comprise a second reflective layer or metal layer on and used in conjunction with the first reflective layer such that light passing through the first reflective layer can be reflected by the second reflective layer.

Abstract translation: 公开了一种高效率LED芯片，其包括在两个相对掺杂的层之间包括有源层的有源LED结构。 第一反射层可以与相对掺杂的层之一相邻地设置，第一层包括与有源LED结构不同的折射率的材料。 有源LED结构和第一反射层之间的IR差异增加了接合处的光的TIR。 在一些实施例中，第一反射层可以包括低于半导体材料的IR，增加可以体验TIR的光量。 根据本发明的LED芯片的一些实施例还可以包括第二反射层或金属层，并且与第一反射层结合使用，使得穿过第一反射层的光可被第二反射层反射。

公开(公告)号：US20130329425A1

公开(公告)日：2013-12-12

申请号：US13649052

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC J. TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: F21V9/00

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：US20160211420A1

公开(公告)日：2016-07-21

申请号：US14602040

申请日：2015-01-21

Applicant: CREE, INC.

Inventor： MATTHEW DONOFRIO ,  PRITISH KAR ,  STEN HEIKMAN ,  HARSHAD GOLAKIA ,  RAJEEV ACHARYA ,  YUVARAJ DORA

IPC: H01L33/46 ,  H01L33/38 ,  H01L33/00 ,  H01L33/14

CPC classification number: H01L33/46 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/38 ,  H01L33/42 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.

Abstract translation: 公开了简化的LED芯片架构或芯片构造，其可以使用更少的步骤导致更简单的制造过程。 LED结构可以具有比常规LED芯片更少的层，其中层以不同的方式布置以有效地制造和操作。 LED芯片可以包括有源LED结构。 电介质反射层包含在相邻掺杂层之一附近。 金属反射层在介电反射层上，其中电介质和金属反射层延伸超过所述有源区的边缘。 通过延伸电介质层，LED芯片可以通过反射更多的LED光以期望的方向发射而以更高的效率发射。 通过将金属反射层延伸超过有源区的边缘，金属反射层可以用作电流扩散层和势垒，除了反射LED光以期望的方向发射。 LED芯片还可以包括自制和自限制特征，其简化制造期间的蚀刻工艺。

公开(公告)号：US20130328074A1

公开(公告)日：2013-12-12

申请号：US13770389

申请日：2013-02-19

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: H01L27/15

CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座。 在具有多个LED的封装中，每个LED可以发射相同或不同波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 具有平坦表面的密封剂可以在基座上，至少一些LED上，平面表面引起光在封装内的全部内部反射。 密封剂内的TIR光可以到达转化材料，在那里它可以被全方位地吸收和发射。 与现有的具有半球密封剂的包装相比，TIR灯现在可以从密封剂中排出并且能够有效排放和更宽的排放特征。