公开(公告)号：US20130328074A1

公开(公告)日：2013-12-12

申请号：US13770389

申请日：2013-02-19

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: H01L27/15

CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座。 在具有多个LED的封装中，每个LED可以发射相同或不同波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 具有平坦表面的密封剂可以在基座上，至少一些LED上，平面表面引起光在封装内的全部内部反射。 密封剂内的TIR光可以到达转化材料，在那里它可以被全方位地吸收和发射。 与现有的具有半球密封剂的包装相比，TIR灯现在可以从密封剂中排出并且能够有效排放和更宽的排放特征。

公开(公告)号：US20130329425A1

公开(公告)日：2013-12-12

申请号：US13649052

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  ERIC J. TARSA ,  STEN HEIKMAN ,  BERND KELLER ,  JESSE REIHERZER ,  HORMOZ BENJAMIN

IPC: F21V9/00

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：US20150233544A1

公开(公告)日：2015-08-20

申请号：US14185123

申请日：2014-02-20

Applicant: CREE, INC.

Inventor： DEBORAH KIRCHER ,  THEODORE LOWES ,  PAUL T. FINI ,  BERND KELLER

IPC: F21V9/16 ,  F21K99/00 ,  H01L33/50

CPC classification number: F21V9/30 ,  F21K9/64 ,  F21K9/90 ,  F21V29/502 ,  H01L33/507 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Lighting components and fixtures having optical elements with multiple portions are disclosed. A wavelength conversion element can be mounted over a source, the wavelength conversion element including wavelength conversion material remote to the source, such as on or near the outside surface of a conversion element. The element can be filled with a transparent and thermally conductive material which thermally couples the remote conversion material and the source, aiding in thermal dissipation and improving fixture efficacy. An optical element can be formed by using an embossing plate to form a first portion, partially curing the first portion, removing the embossing plate, and introducing material to form a second portion.

Abstract translation: 公开了具有多个部分的光学元件的照明部件和固定装置。 波长转换元件可以安装在源上，波长转换元件包括远离源的波长转换材料，诸如在转换元件的外表面上或附近。 该元件可以用透明导热材料填充，其热耦合远程转换材料和源，有助于散热并提高固定效能。 光学元件可以通过使用压花板来形成第一部分，部分地固化第一部分，去除压纹板，以及引入材料以形成第二部分。

公开(公告)号：US20150194580A1

公开(公告)日：2015-07-09

申请号：US14661874

申请日：2015-03-18

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  Eric Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: H01L33/54 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装还可以包括具有一个或多个LED的底座以及一个或多个LED和底座上的毯子转换材料层。 密封剂可以在底座上，LED上方，并且在密封剂内部反射的光将到达转换材料，并将其全向吸收和发射。 这允许反射光现在从密封剂中逸出。 这允许例如当与具有半球密封剂或透镜的传统封装相比时，有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，使得在不同应用中使用封装更具灵活性。

公开(公告)号：US20130328073A1

公开(公告)日：2013-12-12

申请号：US13649067

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： THEODORE LOWES ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: H01L33/50 ,  H01L33/54

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有发射不同颜色的光的多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在基座上，LED上方，并且在密封剂内反射的光将到达转换材料以被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 LED封装可以具有更高的芯片面积与LED封装面积比。 通过使用具有平面表面的密封剂，LED封装在特征和LED封装比率之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。