公开(公告)号：US20170047273A1

公开(公告)日：2017-02-16

申请号：US15334308

申请日：2016-10-26

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  JENG-JEN LI ,  KUN-HONG SHIH ,  KAIPENG CHIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/49537 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49506 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15321 ,  H05K1/021 ,  H05K1/186 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract translation: 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。

公开(公告)号：US20210105898A1

公开(公告)日：2021-04-08

申请号：US16592786

申请日：2019-10-04

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34 ,  H02M3/156

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

公开(公告)号：US20170201125A1

公开(公告)日：2017-07-13

申请号：US15399742

申请日：2017-01-06

Applicant: CYNTEC CO., LTD.

Inventor： HUEI-REN YOU ,  BAU-RU LU ,  KAIPENG CHIANG

IPC: H02J50/10 ,  H05K1/11 ,  H01F27/24 ,  H01F27/29 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: H02J50/10 ,  H01F17/04 ,  H01F27/24 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/048 ,  H05K1/0203 ,  H05K1/0262 ,  H05K1/117 ,  H05K1/141 ,  H05K1/184 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10545

Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

公开(公告)号：US20220007502A1

公开(公告)日：2022-01-06

申请号：US17477530

申请日：2021-09-17

Applicant: CYNTEC CO., LTD.

Inventor： KAIPENG CHIANG ,  DA-JUNG CHEN ,  BAU-RU LU ,  CHUN HSIEN LU

IPC: H05K1/02 ,  H05K1/14

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.