公开(公告)号：US10066126B2

公开(公告)日：2018-09-04

申请号：US14988891

申请日：2016-01-06

申请人： Cabot Microelectronics Corporation

发明人： Kevin P. Dockery ,  Helin Huang ,  Matthew Carnes ,  Glenn Whitener

IPC分类号： C09K13/00 ,  C09G1/02 ,  C09K13/06 ,  C09G1/04 ,  H01L21/321

摘要： Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.

公开(公告)号：US20170190936A1

公开(公告)日：2017-07-06

申请号：US14988891

申请日：2016-01-06

申请人： Cabot Microelectronics Corporation

发明人： Kevin P. Dockery ,  Helin Huang ,  Matthew Carnes ,  Glenn Whitener

IPC分类号： C09G1/02 ,  H01L21/321

CPC分类号： C09G1/02 ,  C09G1/04 ,  C09K13/00 ,  C09K13/06 ,  H01L21/31053 ,  H01L21/3212

摘要： Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.