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    Heat spreader having holes for rivet-like adhesive connections
    3.
    发明授权
    Heat spreader having holes for rivet-like adhesive connections 有权
    具有铆钉状粘合剂连接孔的散热器

    公开(公告)号：US06538320B1

    公开(公告)日：2003-03-25

    申请号：US09892778

    申请日：2001-06-28

    申请人： Eric S. Tosaya ,  Edward S. Alcid

    发明人： Eric S. Tosaya ,  Edward S. Alcid

    IPC分类号： H01L2310

    CPC分类号： H01L21/50 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat spreader-package assembly is provided having a heat spreader mounted to a package board with an adhesive. The heat spreader has an upper portion and a plurality of sidewalls extending from the upper portion. The heat spreader has a flange that extends from the sidewalls continuously about a periphery of the upper portion and has a plurality of holes. The holes allow the uncured adhesive to flow therethrough. When the adhesive has cured, a head is formed from the adhesive on an upper side of the flange to establish a riveted connection.

    摘要翻译： 提供了一种散热器 - 包装组件，其具有用粘合剂安装到封装板的散热器。 散热器具有从上部延伸的上部和多个侧壁。 散热器具有从侧壁连续地围绕上部周边延伸的凸缘，并且具有多个孔。 这些孔允许未固化的粘合剂流过其中。 当粘合剂固化时，在法兰的上侧上由粘合剂形成头，以形成铆接连接。

    Method and apparatus for precoining BGA type packages prior to electrical characterization
    5.
    发明授权
    Method and apparatus for precoining BGA type packages prior to electrical characterization 有权
    在电气特性化之前预先包装BGA型封装的方法和装置

    公开(公告)号：US06399474B1

    公开(公告)日：2002-06-04

    申请号：US09892798

    申请日：2001-06-28

    申请人： Eric S. Tosaya

    发明人： Eric S. Tosaya

    IPC分类号： H01L2144

    CPC分类号： H05K3/3457 ,  G01R1/0408 ,  G01R1/0466 ,  G01R31/2886 ,  H01L21/4853 ,  H05K2201/10734 ,  H05K2203/0278 ,  Y10T29/41

    摘要： A method and apparatus for precoining a ball grid array (BGA) type package prior to electrical characterization of the package employs a heated pressing plate with a smooth, flat bottom. The heated pressing plate is controllably pressed against a plurality of solder balls attached to a chip scale package. The heated pressing planarizes the tops of the solder balls, thereby evening out height differences among the solder balls. With the height differences evened out, a grounding plate of a test fixture can be applied on the array of solder balls and reliably contact each of the solder balls that are to be grounded, regardless of their initial height differences.

    摘要翻译： 在电气表征包装之前预先涂布球栅阵列（BGA）型封装的方法和装置采用具有光滑平坦底部的加热压板。 加热的压板可控制地压靠在与芯片级封装件相连的多个焊球上。 加热按压使焊球的顶部平坦化，从而消除焊料球之间的高度差异。 随着高差的不同，测试夹具的接地板可以应用在焊球阵列上，并且可靠地接触待接地的每个焊球，而不管其初始高差如何。

    Extruded heat spreader
    6.
    发明授权
    Extruded heat spreader 有权
    挤压散热器

    公开(公告)号：US06483169B1

    公开(公告)日：2002-11-19

    申请号：US09892777

    申请日：2001-06-28

    申请人： Eric S. Tosaya ,  Edward S. Alcid

    发明人： Eric S. Tosaya ,  Edward S. Alcid

    IPC分类号： H01L3111

    CPC分类号： H01L23/367 ,  H01L2224/73253

    摘要： An extruded heat exchanger that reduces manufacturing costs and material waste, without compromising heat spreading effects. The heat exchanger has an upper surface that is thermally coupled to a heat sink. Two sidewalls extend only from opposite edges of the upper surface. A flange extends from each of the opposing sidewalls.

    摘要翻译： 一种挤压式热交换器，可以降低制造成本和材料浪费，而不会影响散热效果。 热交换器具有热耦合到散热器的上表面。 两个侧壁仅从上表面的相对边缘延伸。 凸缘从每个相对的侧壁延伸。

    Multilayer IC semiconductor package
    7.
    发明授权
    Multilayer IC semiconductor package 失效
    多层IC半导体封装

    公开(公告)号：US5414222A

    公开(公告)日：1995-05-09

    申请号：US108029

    申请日：1993-08-17

    申请人： Bidyut K. Sen ,  Eric S. Tosaya

    发明人： Bidyut K. Sen ,  Eric S. Tosaya

    IPC分类号： H01L23/498 ,  H05K1/00

    CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/3011

    摘要： An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least on of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to the first direction.

    摘要翻译： 改进的多层集成电路封装。 具有多层导电引线的封装具有连接到第二层引线的第一层中的引线的金属通孔。 该改进包括至少在通孔上具有横截面，使得通孔在第一方向上比在大致垂直于第一方向的第二方向上大得多。

    Multilayer IC semiconductor package
    8.
    发明授权
    Multilayer IC semiconductor package 失效
    多层IC半导体封装

    公开(公告)号：US5304743A

    公开(公告)日：1994-04-19

    申请号：US881955

    申请日：1992-05-12

    申请人： Bidyut K. Sen ,  Eric S. Tosaya

    发明人： Bidyut K. Sen ,  Eric S. Tosaya

    IPC分类号： H01L23/498 ,  H05K1/00

    CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/3011

    摘要： An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least one of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to said first direction.

    摘要翻译： 改进的多层集成电路封装。 具有多层导电引线的封装具有连接到第二层引线的第一层中的引线的金属通孔。 该改进包括具有横截面中的至少一个通孔，使得通孔在第一方向上比在大致垂直于所述第一方向的第二方向上大得多。

    Heat sink grounded to a grounded package lid
    9.
    发明授权
    Heat sink grounded to a grounded package lid 有权
    散热器接地到接地的封装盖上

    公开(公告)号：US06512675B1

    公开(公告)日：2003-01-28

    申请号：US09764132

    申请日：2001-01-19

    申请人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

    发明人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

    IPC分类号： H05K720

    CPC分类号： H01L23/3675 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.

    摘要翻译： 具有集成电路的集成电路封装被安装到系统板上。 系统板的接地线连接到封装，其表面具有接地引线。 将导电环氧树脂放置在接地引线上，并将封装盖粘合到封装板上并将封装盖接地。 散热器通过导电粘合剂或导电滑块安装到封装盖上，导电滑块从封装盖的凸缘延伸到散热器的凸缘以将散热器接地。