公开(公告)号：US20160103153A1

公开(公告)日：2016-04-14

申请号：US14972705

申请日：2015-12-17

Applicant: Cascade Microtech, Inc.

Inventor： Koby Duckworth ,  Eric Hill

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

Abstract translation: 探针头组件，探针头组件的组件，包括探针头组件和/或其部件的测试系统及其操作方法。 探针头组件被配置为将多个测试信号传送到和/或从被测设备，并且包括空间变换器，接触组件和立管，空间变换器与接触组件空间上分离并传送多个 在空间变压器和接触组件之间测试信号。 接触组件可以包括限定孔的框架，并且具有与被测器件的阈值差的阈值差的热膨胀系数，附接到框架的柔性电介质体，由框架保持张力， 并且延伸穿过该孔，以及多个导电探针。 多个导电探针可以包括双面探针尖端。

公开(公告)号：US09989558B2

公开(公告)日：2018-06-05

申请号：US14972705

申请日：2015-12-17

Applicant: Cascade Microtech, Inc.

Inventor： Koby Duckworth ,  Eric Hill

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.