公开(公告)号：US20160103153A1

公开(公告)日：2016-04-14

申请号：US14972705

申请日：2015-12-17

Applicant: Cascade Microtech, Inc.

Inventor： Koby Duckworth ,  Eric Hill

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

Abstract translation: 探针头组件，探针头组件的组件，包括探针头组件和/或其部件的测试系统及其操作方法。 探针头组件被配置为将多个测试信号传送到和/或从被测设备，并且包括空间变换器，接触组件和立管，空间变换器与接触组件空间上分离并传送多个 在空间变压器和接触组件之间测试信号。 接触组件可以包括限定孔的框架，并且具有与被测器件的阈值差的阈值差的热膨胀系数，附接到框架的柔性电介质体，由框架保持张力， 并且延伸穿过该孔，以及多个导电探针。 多个导电探针可以包括双面探针尖端。

公开(公告)号：US10281518B2

公开(公告)日：2019-05-07

申请号：US14625385

申请日：2015-02-18

Applicant: Cascade Microtech, Inc.

Inventor： Kazuki Negishi ,  Eric Hill

IPC: G01R1/04 ,  G01R31/26 ,  G01R31/28

Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

公开(公告)号：US09989558B2

公开(公告)日：2018-06-05

申请号：US14972705

申请日：2015-12-17

Applicant: Cascade Microtech, Inc.

Inventor： Koby Duckworth ,  Eric Hill

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

公开(公告)号：US20150241472A1

公开(公告)日：2015-08-27

申请号：US14625385

申请日：2015-02-18

Applicant: Cascade Microtech, Inc.

Inventor： Kazuki Negishi ,  Eric Hill

IPC: G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  G01R1/067

CPC classification number: G01R31/2601 ,  G01R31/2889

Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

Abstract translation: 电子器件晶圆动态测试的系统和方法。 该系统包括探针头组件，探针侧接触结构，卡盘和卡盘侧接触结构。 探头组件包括被配置为电接触被测器件（DUT）的第一侧的探针。 探针侧接触结构包括探针侧接触区域。 卡盘包括被配置为支撑包括DUT的基板并且电接触DUT的第二侧的导电支撑表面。 探针头组件和卡盘被配置为相对于彼此平移以选择性地建立探针和DUT之间的电接触。 卡盘侧接触结构包括与导电支撑表面电连通并与探针侧接触结构相对的卡盘侧接触区域。 这些方法可以包括操作系统或系统的方法。