公开(公告)号：US07429868B2

公开(公告)日：2008-09-30

申请号：US11196238

申请日：2005-08-04

申请人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/0433

摘要： A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

摘要翻译： 用于测试半导体器件的插座组件包括电连接到外部测试装置的插座板和覆盖插座板的插座引导件。 插座引导件具有开放部分以接收半导体器件，并允许半导体器件上的引脚与插座板上的连接引脚耦合。 间隔件可以插入在插座板和插座引导件之间，以保持半导体器件和插座板之间的预定距离。 以这种方式，即使当半导体器件具有不同的厚度时，也可以将每个半导体器件的球或引线按压到插座的连接销上至预定的深度。

公开(公告)号：US07408338B2

公开(公告)日：2008-08-05

申请号：US11713683

申请日：2007-03-05

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/28

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。

公开(公告)号：US20060214655A1

公开(公告)日：2006-09-28

申请号：US11196266

申请日：2005-08-04

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/28

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。

公开(公告)号：US07196508B2

公开(公告)日：2007-03-27

申请号：US11196266

申请日：2005-08-04

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。

公开(公告)号：US07253653B2

公开(公告)日：2007-08-07

申请号：US11235248

申请日：2005-09-27

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Jae Bong Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/04 ,  G01R31/2893

摘要： A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability. The test tray includes a frame, pockets mounted to the frame while being uniformly spaced apart from one another, each of the pockets including a seat on which a semiconductor device is to be seated, latches mounted to the frame to be arranged in pairs for respective pockets such that the latches of each latch pair face each other at opposite sides of an associated one of the pockets, respectively, each of the latches being movable between a first position where the latch holds a semiconductor device seated in the seat of the associated pocket and a second position where the latch releases the held state of the semiconductor device, and latch operating members each mounted to the frame, and adapted to move an associated one of the latches between the first position and the second position, each of the latch operating members being separate from the associated latch.

摘要翻译： 公开了一种用于测试半导体器件的处理器的测试盘，其能够降低更换载体模块所需的成本和时间，并且实现可加工性的提高。 测试托盘包括框架，在彼此均匀间隔地安装到框架上的袋子，每个凹穴包括座，半导体装置将要安置在其上，安装到框架的闩锁成对布置成相应的 每个闩锁组的闩锁分别在相关联的一个凹穴的相对侧彼此面对，每个闩锁可在第一位置和第二位置之间移动，该第一位置之间闩锁保持坐在相关联的口袋的座中的半导体器件 以及第二位置，其中所述闩锁释放所述半导体器件的保持状态，以及锁定每个安装到所述框架的操作构件，并且适于在所述第一位置和所述第二位置之间移动相关联的一个闩锁，所述闩锁操作 构件与相关联的闩锁分离。

公开(公告)号：US07464807B2

公开(公告)日：2008-12-16

申请号：US11200014

申请日：2005-08-10

申请人： Chul Ho Ham ,  Woo Young Lim ,  Young Geun Park ,  Ho Keun Song

发明人： Chul Ho Ham ,  Woo Young Lim ,  Young Geun Park ,  Ho Keun Song

IPC分类号： G01R31/28 ,  B65G37/00

CPC分类号： G01R31/2893

摘要： A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

摘要翻译： 提供了用于测试半导体器件的处理器的传送装置，其中可以调整多个拾取器头中的每一个之间的间距而不更换凸轮板。 传送装置可以包括基部，可移动地安装在基部上的多个拾取头，以及可移动地安装在基部上并具有形成在其中的多个倾斜凸轮槽的凸轮板。 每个拾取头通过其间延伸的连接部分连接到相应的凸轮槽，每个连接部分的端部可移动地联接到其相应的凸轮槽。 驱动单元使凸轮板往复运动，使得当连接部件的端部在凸轮槽内移动时，可以改变拾取头的位置。

公开(公告)号：US07170276B2

公开(公告)日：2007-01-30

申请号：US10657179

申请日：2003-09-09

申请人： Chan Ho Park ,  Hyun Joo Hwang ,  Jae Bong Seo ,  Young Geun Park ,  Ho Keun Song

发明人： Chan Ho Park ,  Hyun Joo Hwang ,  Jae Bong Seo ,  Young Geun Park ,  Ho Keun Song

IPC分类号： G01R31/02

CPC分类号： G01R31/2875 ,  G01R31/2862 ,  G01R31/2867 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

摘要翻译： 提供了一种用于补偿模块化IC测试处理器中的发热的装置，其包括邻近处理器的按压单元定位的至少一个支撑构件，并且其中形成有用于冷却流体流动的冷却流体流动通道，并且多个 的冷却流体喷射单元，用于通过冷却流体流动通道从冷却单元的相邻推杆之间的位置沿倾斜方向向模块化IC的表面喷射冷却流体，从而将冷却流体直接喷射到附接到 模块化IC在测试期间并提高热补偿的效率。

公开(公告)号：US07061101B2

公开(公告)日：2006-06-13

申请号：US10797073

申请日：2004-03-11

申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

IPC分类号： H01L29/74

CPC分类号： G01R31/2893

摘要： Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.

摘要翻译： 载体模块包括用于将半导体器件放置在其下侧上的载体模块体，其具有从半部装置所在的上部到下侧的通孔，载体模块主体上的壳体，安装在其中的辅助壳体 壳体的下部能够在上下方向上移动，通过安装在壳体内部的第一弹性构件与载体模块主体弹性接触，辅助壳体中的真空管与通孔连通 载体模块主体中的至少一个闩锁，载体模块主体的下部中的至少一对闩锁，用于在外侧或内侧上分开或关闭，用于保持或释放位于载体模块主体上的半导体器件，闩锁 按钮装配在载体模块主体的上部，以便能够在上/下方向上移动，并且通过一个连接销连接到闩锁上，该连接销通过一个外部的forc在上/下方向上移动 e，使闩锁移动;以及第二弹性构件，用于弹性地支撑载体模块主体上的闩锁按钮，由此当半导体器件与测试插座接触并进行测试时，将半导体器件保持在 在闩锁释放半导体器件的状态下通过载体模块体中的通孔形成的真空和真空管。

公开(公告)号：US06873169B1

公开(公告)日：2005-03-29

申请号：US10797072

申请日：2004-03-11

申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

IPC分类号： G01R1/04 ,  G01R31/02

CPC分类号： G01R1/0433

摘要： Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely holding, transferring, and bringing the semiconductor device into contact with the test socket, for testing.

摘要翻译： 一种用于半导体器件测试处理器的载体模块，包括载体模块主体，载体模块主体的下侧部分中的装置安置部分，在装置座部分的相对侧的至少一对第一闩锁，其布置成相对并移动 从或彼此靠近，用于保持或释放位于设备安置部分上的半导体器件的相对侧部分，至少一对可旋转地安装在第一闩锁的相对侧上的第二闩锁，用于保持下侧部分 并且释放与第一闩锁的释放动作互锁的半导体装置，安装在载体模块的上部中的闩锁按钮，以在上/下方向上移动并耦合到一端 的第一闩锁，用于上下移动以使第一闩锁移动;以及第一弹性构件和用于弹性支撑第一闩锁的第二弹性构件，第二闩锁的第二弹性构件 从而牢固地保持，传送和使半导体器件与测试插座接触以进行测试。

公开(公告)号：US07562923B2

公开(公告)日：2009-07-21

申请号：US10773325

申请日：2004-02-09

申请人： Jung Ug Han ,  Woo Young Lim ,  Ho Keun Song ,  Young Geun Park

发明人： Jung Ug Han ,  Woo Young Lim ,  Ho Keun Song ,  Young Geun Park

IPC分类号： B25J15/08

CPC分类号： H05K13/02 ,  Y10S294/902 ,  Y10S294/907

摘要： A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

摘要翻译： 用于传送其上安装有半导体器件的处理盘的托盘传送装置防止半导体器件与处理盘分散或分离。 托盘传送装置包括安装在用于支撑固定托盘的主框架上的固定装置，安装在主框架上用于校正固定托盘的位置的校正装置，安装在主框架上用于夹紧处理托盘的夹持装置， 以及至少一个传感器，用于检测夹板和处理盘。 固定托盘由固定装置固定，固定托盘的右/左倾斜由校正装置校正。 保持半导体的操作盘的上部被固定托盘的底部覆盖并被夹持装置夹持。