System and Method for Performing High Flow Rate Dispensation of a Chemical onto a Photolithographic Component
    2.
    发明申请
    System and Method for Performing High Flow Rate Dispensation of a Chemical onto a Photolithographic Component 审中-公开
    用于将化学品的高流速分配执行到光刻部件上的系统和方法

    公开(公告)号:US20090166319A1

    公开(公告)日:2009-07-02

    申请号:US12374039

    申请日:2007-07-19

    IPC分类号: B44C1/22 G03F7/26

    摘要: A system and method for performing high flow rate dispensation of a chemical onto a photolithographic component are disclosed. The system and method includes providing a photolithographic component in a manufacturing tool. The photolithographic is positioned at a predetermined distance from a nozzle dispensing a chemical. Dispensation of a chemical at a high flow rate onto a photolithographic component, the rate of flow operable to reduce harmful effects from occurring on the surface of the photolithographic substrate.

    摘要翻译: 公开了一种用于将化学物质高流量分配到光刻部件上的系统和方法。 该系统和方法包括在制造工具中提供光刻部件。 光刻法定位在与喷出化学品的喷嘴预定的距离处。 将化学物质以高流速分配到光刻部件上,流动速率可操作以减少在光刻基片的表面上发生的有害影响。