摘要:
Disclosed is a semiconductor package having a bump ball as an external connection terminal, the bump ball including a core layer containing copper, a copper alloy, aluminum, an aluminum alloy or a combination thereof and a shell layer surrounding the core layer and containing tin, a tin alloy or a combination thereof.
摘要:
A system and method for performing high flow rate dispensation of a chemical onto a photolithographic component are disclosed. The system and method includes providing a photolithographic component in a manufacturing tool. The photolithographic is positioned at a predetermined distance from a nozzle dispensing a chemical. Dispensation of a chemical at a high flow rate onto a photolithographic component, the rate of flow operable to reduce harmful effects from occurring on the surface of the photolithographic substrate.
摘要:
The present invention relates to apparatus and method of providing a multimedia advertising service through a mobile communication network. In the present invention, a content server downloads ad contents to a mobile terminal along with content-displaying condition and the mobile terminal having received the ad contents displays the received ad contents according to the content-displaying condition when an event specified by the content-displaying condition occurs. Afterwards, a content-displayed history is uploaded to the content server by the mobile terminal.