公开(公告)号：US08356405B2

公开(公告)日：2013-01-22

申请号：US12972244

申请日：2010-12-17

申请人： Chang Gun Oh ,  Ho Sik Park ,  Tae Kyun Bae

发明人： Chang Gun Oh ,  Ho Sik Park ,  Tae Kyun Bae

IPC分类号： H05K3/36

CPC分类号： H05K3/4682 ,  H05K3/0097 ,  H05K3/4647 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.

摘要翻译： 本发明公开了一种制造印刷电路板的方法，包括：提供包括绝缘层的载体，形成在绝缘层两侧的第一金属箔，分别形成在第一金属箔上并由热塑性树脂制成的粘合层， 和分别形成在粘合剂层上的第二金属箔; 在载体的两侧上施加具有用于形成金属柱的开口的抗蚀剂; 形成用于在所述开口中形成所述金属柱的金属镀层; 研磨抗蚀剂表面; 去除抗蚀剂并在载体的两侧形成绝缘层; 并研磨绝缘层的表面。 该方法的优点在于，载体的两侧同时层叠，可以防止在制造印刷电路板的过程中基板翘曲。

公开(公告)号：US20120097438A1

公开(公告)日：2012-04-26

申请号：US13009789

申请日：2011-01-19

申请人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

发明人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K1/11

CPC分类号： H05K3/4647 ,  H05K1/0366 ,  H05K2201/0195 ,  H05K2203/1189 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/51

摘要： Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

摘要翻译： 这里公开了一种制造印刷电路板的方法，包括：在其上形成有具有柱经的第一绝缘层的外表面上堆叠包括增强材料的第二绝缘层; 抛光所述第二绝缘层的上表面以暴露所述柱通孔的上侧; 在第二绝缘层上堆叠膜构件以覆盖柱经和压缩第二绝缘层; 抛光膜构件的上表面以暴露柱通孔的上侧; 以及在所述膜构件的上表面上形成连接到所述柱通孔的电路层。

公开(公告)号：US08720049B2

公开(公告)日：2014-05-13

申请号：US13009789

申请日：2011-01-19

申请人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

发明人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

IPC分类号： H05K3/20

CPC分类号： H05K3/4647 ,  H05K1/0366 ,  H05K2201/0195 ,  H05K2203/1189 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/51

摘要： Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

摘要翻译： 这里公开了一种制造印刷电路板的方法，包括：在其上形成有具有柱经的第一绝缘层的外表面上堆叠包括增强材料的第二绝缘层; 抛光所述第二绝缘层的上表面以暴露所述柱通孔的上侧; 在第二绝缘层上堆叠膜构件以覆盖柱经和压缩第二绝缘层; 抛光膜构件的上表面以暴露柱通孔的上侧; 以及在所述膜构件的上表面上形成连接到所述柱通孔的电路层。

公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。

公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。