摘要:
A composition with improved shelf life for filling small gaps in a semiconductor device is provided. The composition comprises an end-capped silicone polymer. The molecular weight of the end-capped silicone polymer is not varied during storage. In addition, the dissolution rate (DR) of the composition in an alkaline developing solution is maintained at a desired level during storage. That is, the composition is highly stable during storage. Therefore, the composition is suitable for use in a node separation process for the fabrication of a semiconductor capacitor.
摘要:
A composition with improved shelf life for filling small gaps in a semiconductor device is provided. The composition comprises an end-capped silicone polymer. The molecular weight of the end-capped silicone polymer is not varied during storage. In addition, the dissolution rate (DR) of the composition in an alkaline developing solution is maintained at a desired level during storage. That is, the composition is highly stable during storage. Therefore, the composition is suitable for use in a node separation process for the fabrication of a semiconductor capacitor.
摘要:
A compound for filling small gaps in a semiconductor device, a composition for filling small gaps in a semiconductor device, and a method of fabricating a semiconductor capacitor, the compound including hydrolysates prepared by hydrolysis, in the presence of an acid catalyst, of compounds represented by Formulae 1, 2, and 3: [RO]3Si—[CH2]nR′ (1) wherein, in Formula 1, n is an integer from 0 to about 10, and R and R′ are each independently a hydrogen atom, a C1-C12 alkyl group, or a C6-C20 aryl group; HOOC[CH2]nR2Si—O—SiR′2[CH2]nCOOH (2) wherein, in Formula 2, each n is independently an integer from 0 to about 10, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group; and R3Si—O—X (3) wherein, in Formula 3, X is R′ or SiR′3, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group, or a polycondensate prepared by polycondensation of the hydrolysates represented by Formulae 1, 2, and 3.
摘要:
A compound for filling small gaps in a semiconductor device, a composition for filling small gaps in a semiconductor device, and a method of fabricating a semiconductor capacitor, the compound including hydrolysates prepared by hydrolysis, in the presence of an acid catalyst, of compounds represented by Formulae 1, 2, and 3: [RO]3Si—[CH2]nR′ (1) wherein, in Formula 1, n is an integer from 0 to about 10, and R and R′ are each independently a hydrogen atom, a C1-C12 alkyl group, or a C6-C20 aryl group; HOOC[CH2]nR2Si—O—SiR′2[CH2]nCOOH (2) wherein, in Formula 2, each n is independently an integer from 0 to about 10, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group; and R3Si—O—X (3) wherein, in Formula 3, X is R′ or SiR′3, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group, or a polycondensate prepared by polycondensation of the hydrolysates represented by Formulae 1, 2, and 3.
摘要:
The present invention provides a method for manufacturing a membrane-electrode assembly for a polymer electrolyte fuel cell, in which the glass transition temperature of an electrolyte membrane is reduced using a hydrophilic solvent, and a membrane-electrode assembly for a polymer electrolyte fuel cell, manufactured by the method. In the method of the invention, the glass transition temperature of the electrolyte membrane to which a catalyst is transferred is reduced compared to that in a conventional method for manufacturing a membrane-electrode assembly for a polymer electrolyte fuel cell using the decal process. Thus, even to an electrolyte membrane material having a relatively high glass transition temperature, the catalyst may be transferred at a rate of 100% at a temperature of about 120° C., at which hot pressing is carried out. Thus, the problems associated with electrolyte membrane deterioration occurring in conventional methods can be solved.
摘要:
Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.
摘要:
Disclosed herein are an apparatus and a method for measuring activity of a plating solution. The apparatus for measuring activity of a plating solution may include: a plating bath containing the plating solution for plating a plating object; a first electrode which is impregnated in the plating solution and has a plated body to measure current that flows in the plating solution and on the surface of the body in accordance with applied signal voltage; a second electrode which is impregnated in the plating solution to induce current from the first electrode or discharge current to the first electrode; a third electrode which controls the signal voltage applied to the first electrode to be constantly maintained; an impedance measurement unit which calculates an impedance value from the current measured in the first electrode; and a processing unit which displays a change of the calculated impedance value depending on a time.
摘要:
A manufacturing method of ground-buried solid type insulation transformer is disclosed. According to the transformer manufactured by the method, electric shock to be given to human and animal that make contact with outer case due to electric field produced from winding wire within solid type insulation transformer, can be avoided, and even in case it is buried underground and it is used underwater for a long time, corrosion thereof can be avoided. The manufacturing method of ground-buried solid type insulation transformer comprises 9 processes in total.
摘要:
An oven, effectively and rapidly cooling a door by passing a sufficient quantity of cooling air through the door, is disclosed. The oven includes an outer case, an inner case, a door opening and closing the inner case, and a blower chamber having a cooling fan and provided at the upper side of the inner case. The door includes an inner plate and a frame to form an opened lower end. The frame has holes formed in the upper side to flowing air discharged by the cooling fan between the inner plate and an outer plate. A vent hole communicating with the blower chamber is provided in the upper end of the cooking chamber to pass hot air of the cooking chamber through the vent hole. Around the vent hole, a partition member is provided for preventing the hot air from being mixed with air discharged by cooling fan.