Gap-filling composition with excellent shelf life by end-capping
    1.
    发明申请
    Gap-filling composition with excellent shelf life by end-capping 有权
    间隙填充组合物,通过封端具有优良的保存期限

    公开(公告)号:US20100190310A1

    公开(公告)日:2010-07-29

    申请号:US12659908

    申请日:2010-03-25

    IPC分类号: H01L21/02 C08L83/06

    摘要: A composition with improved shelf life for filling small gaps in a semiconductor device is provided. The composition comprises an end-capped silicone polymer. The molecular weight of the end-capped silicone polymer is not varied during storage. In addition, the dissolution rate (DR) of the composition in an alkaline developing solution is maintained at a desired level during storage. That is, the composition is highly stable during storage. Therefore, the composition is suitable for use in a node separation process for the fabrication of a semiconductor capacitor.

    摘要翻译: 提供了一种用于填充半导体器件中的小间隙的具有改善的保质期的组合物。 组合物包含封端的硅氧烷聚合物。 封端硅氧烷聚合物的分子量在储存期间不变化。 此外,组合物在碱性显影液中的溶解速率(DR)在储存期间保持在期望的水平。 也就是说,组合物在储存期间高度稳定。 因此,该组合物适用于制造半导体电容器的节点分离工艺。

    Gap-filling composition with excellent shelf life by end-capping
    2.
    发明授权
    Gap-filling composition with excellent shelf life by end-capping 有权
    间隙填充组合物,通过封端具有优良的保存期限

    公开(公告)号:US08642437B2

    公开(公告)日:2014-02-04

    申请号:US12659908

    申请日:2010-03-25

    IPC分类号: H01L21/12 C08L83/06

    摘要: A composition with improved shelf life for filling small gaps in a semiconductor device is provided. The composition comprises an end-capped silicone polymer. The molecular weight of the end-capped silicone polymer is not varied during storage. In addition, the dissolution rate (DR) of the composition in an alkaline developing solution is maintained at a desired level during storage. That is, the composition is highly stable during storage. Therefore, the composition is suitable for use in a node separation process for the fabrication of a semiconductor capacitor.

    摘要翻译: 提供了一种用于填充半导体器件中的小间隙的具有改善的保质期的组合物。 组合物包含封端的硅氧烷聚合物。 封端硅氧烷聚合物的分子量在储存期间不变化。 此外,组合物在碱性显影液中的溶解速率(DR)在储存期间保持在期望的水平。 也就是说,组合物在储存期间高度稳定。 因此,该组合物适用于制造半导体电容器的节点分离工艺。

    Compound for filling small gaps in a semiconductor device, composition including the compound, and method of fabricating a semiconductor capacitor
    3.
    发明授权
    Compound for filling small gaps in a semiconductor device, composition including the compound, and method of fabricating a semiconductor capacitor 有权
    用于填充半导体器件中的小间隙的化合物,包含该化合物的组合物以及制造半导体电容器的方法

    公开(公告)号:US08188576B2

    公开(公告)日:2012-05-29

    申请号:US13038608

    申请日:2011-03-02

    IPC分类号: H01L23/58

    CPC分类号: C08G77/04 Y10T428/31663

    摘要: A compound for filling small gaps in a semiconductor device, a composition for filling small gaps in a semiconductor device, and a method of fabricating a semiconductor capacitor, the compound including hydrolysates prepared by hydrolysis, in the presence of an acid catalyst, of compounds represented by Formulae 1, 2, and 3: [RO]3Si—[CH2]nR′  (1) wherein, in Formula 1, n is an integer from 0 to about 10, and R and R′ are each independently a hydrogen atom, a C1-C12 alkyl group, or a C6-C20 aryl group; HOOC[CH2]nR2Si—O—SiR′2[CH2]nCOOH  (2) wherein, in Formula 2, each n is independently an integer from 0 to about 10, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group; and R3Si—O—X  (3) wherein, in Formula 3, X is R′ or SiR′3, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group, or a polycondensate prepared by polycondensation of the hydrolysates represented by Formulae 1, 2, and 3.

    摘要翻译: 一种用于填充半导体器件中的小间隙的化合物,用于填充半导体器件中的小间隙的组合物以及制造半导体电容器的方法,所述化合物包括通过水解制备的水解产物,在酸催化剂存在下,表示的化合物 通式1,2和3:[RO] 3Si- [CH 2] n R'(1)其中,在式1中,n为0至约10的整数,R和R'各自独立地为氢原子, C 1 -C 12烷基或C 6 -C 20芳基; HOOC [CH2] nR2Si-O-SiR'2 [CH2] nCOOH(2)其中,在式2中,每个n独立地为0至约10的整数,并且R和R'各自独立地为C 1 -C 12烷基 或C 6 -C 20芳基; 和R3Si-O-X(3)其中,在式3中,X为R'或SiR'3,R和R'各自独立地为C1-C12烷基或C6-C20芳基,或缩聚物 通过由式1,2和3表示的水解产物的缩聚。

    COMPOUND FOR FILLING SMALL GAPS IN A SEMICONDUCTOR DEVICE, COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF FABRICATING A SEMICONDUCTOR CAPACITOR
    4.
    发明申请
    COMPOUND FOR FILLING SMALL GAPS IN A SEMICONDUCTOR DEVICE, COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF FABRICATING A SEMICONDUCTOR CAPACITOR 有权
    用于在半导体器件中填充小GAPS的化合物,包括该化合物的组合物,以及制造半导体电容器的方法

    公开(公告)号:US20110151640A1

    公开(公告)日:2011-06-23

    申请号:US13038608

    申请日:2011-03-02

    CPC分类号: C08G77/04 Y10T428/31663

    摘要: A compound for filling small gaps in a semiconductor device, a composition for filling small gaps in a semiconductor device, and a method of fabricating a semiconductor capacitor, the compound including hydrolysates prepared by hydrolysis, in the presence of an acid catalyst, of compounds represented by Formulae 1, 2, and 3: [RO]3Si—[CH2]nR′  (1) wherein, in Formula 1, n is an integer from 0 to about 10, and R and R′ are each independently a hydrogen atom, a C1-C12 alkyl group, or a C6-C20 aryl group; HOOC[CH2]nR2Si—O—SiR′2[CH2]nCOOH  (2) wherein, in Formula 2, each n is independently an integer from 0 to about 10, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group; and R3Si—O—X  (3) wherein, in Formula 3, X is R′ or SiR′3, and R and R′ are each independently a C1-C12 alkyl group or a C6-C20 aryl group, or a polycondensate prepared by polycondensation of the hydrolysates represented by Formulae 1, 2, and 3.

    摘要翻译: 一种用于填充半导体器件中的小间隙的化合物,用于填充半导体器件中的小间隙的组合物以及制造半导体电容器的方法,所述化合物包括通过水解制备的水解产物,在酸催化剂存在下,表示的化合物 通式1,2和3:[RO] 3Si- [CH 2] n R'(1)其中,在式1中,n为0至约10的整数,R和R'各自独立地为氢原子, C 1 -C 12烷基或C 6 -C 20芳基; HOOC [CH2] nR2Si-O-SiR'2 [CH2] nCOOH(2)其中,在式2中,每个n独立地为0至约10的整数,并且R和R'各自独立地为C 1 -C 12烷基 或C 6 -C 20芳基; 和R3Si-O-X(3)其中,在式3中,X为R'或SiR'3,R和R'各自独立地为C1-C12烷基或C6-C20芳基,或缩聚物 通过由式1,2和3表示的水解产物的缩聚。

    Printable, flexible and stretchable diamond for thermal management
    6.
    发明授权
    Printable, flexible and stretchable diamond for thermal management 有权
    可打印,灵活和可拉伸的金刚石进行热管理

    公开(公告)号:US08470701B2

    公开(公告)日:2013-06-25

    申请号:US12418071

    申请日:2009-04-03

    IPC分类号: H01L21/20

    摘要: Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

    摘要翻译: 公开了各种散热部件和制造散热部件的方法,其中与一个或多个发热部件热接触的金刚石能够散热,从而提供热调节部件。 导热金刚石以能够提供有效和最大的热传递的图案提供,远离可能易受高温损坏的部件。 这些器件和方法用于冷却易于产生显着热量的柔性电子器件,集成电路和其他复杂电子器件。 还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

    Apparatus and method for measuring activity of plating solution
    7.
    发明申请
    Apparatus and method for measuring activity of plating solution 审中-公开
    电镀液活性测定装置及方法

    公开(公告)号:US20110241709A1

    公开(公告)日:2011-10-06

    申请号:US12805215

    申请日:2010-07-19

    IPC分类号: G01N27/06 G01R27/08

    CPC分类号: G01N27/10

    摘要: Disclosed herein are an apparatus and a method for measuring activity of a plating solution. The apparatus for measuring activity of a plating solution may include: a plating bath containing the plating solution for plating a plating object; a first electrode which is impregnated in the plating solution and has a plated body to measure current that flows in the plating solution and on the surface of the body in accordance with applied signal voltage; a second electrode which is impregnated in the plating solution to induce current from the first electrode or discharge current to the first electrode; a third electrode which controls the signal voltage applied to the first electrode to be constantly maintained; an impedance measurement unit which calculates an impedance value from the current measured in the first electrode; and a processing unit which displays a change of the calculated impedance value depending on a time.

    摘要翻译: 本文公开了一种用于测量电镀液的活性的装置和方法。 用于测量电镀液活性的装置可以包括:含有电镀对象电镀​​液的镀液; 第一电极,其被浸渍在电镀液中,并且具有电镀体,以根据施加的信号电压来测量在电镀溶液中流动的电流和身体的表面; 浸渍在所述电镀溶液中以从所述第一电极感应电流或者将所述第一电极放电至所述第一电极的第二电极; 控制施加到第一电极的信号电压被持续保持的第三电极; 阻抗测量单元,其从在第一电极中测量的电流计算阻抗值; 以及处理单元,其根据时间显示所计算的阻抗值的变化。

    Oven
    10.
    发明授权
    Oven 有权
    烤箱

    公开(公告)号:US07721728B2

    公开(公告)日:2010-05-25

    申请号:US11232862

    申请日:2005-09-23

    IPC分类号: F24C15/04

    摘要: An oven, effectively and rapidly cooling a door by passing a sufficient quantity of cooling air through the door, is disclosed. The oven includes an outer case, an inner case, a door opening and closing the inner case, and a blower chamber having a cooling fan and provided at the upper side of the inner case. The door includes an inner plate and a frame to form an opened lower end. The frame has holes formed in the upper side to flowing air discharged by the cooling fan between the inner plate and an outer plate. A vent hole communicating with the blower chamber is provided in the upper end of the cooking chamber to pass hot air of the cooking chamber through the vent hole. Around the vent hole, a partition member is provided for preventing the hot air from being mixed with air discharged by cooling fan.

    摘要翻译: 公开了一种通过将足够量的冷却空气通过门来有效且快速地冷却门的烤箱。 烤箱包括外壳,内壳,门打开和关闭内壳,以及具有冷却风扇并设置在内壳的上侧的鼓风机室。 门包括内板和框架以形成打开的下端。 框架具有形成在上侧的孔,其中冷却风扇在内板和外板之间排出的流动空气。 在烹饪室的上端设置有与鼓风机室连通的通气孔,以通过烹饪室的热空气通过通气孔。 在通气孔周围设置有用于防止热空气与由冷却风扇排出的空气混合的分隔构件。