利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.016 秒)

    Electronic device including space-apart radiation regions and a process for forming the same
    1.
    发明申请
    Electronic device including space-apart radiation regions and a process for forming the same 有权
    包括空间分开的辐射区域的电子设备及其形成方法

    公开(公告)号：US20070181944A1

    公开(公告)日：2007-08-09

    申请号：US11644751

    申请日：2006-12-22

    申请人： Charles Macpherson ,  Gordana Srdanov ,  Gang Yu

    发明人： Charles Macpherson ,  Gordana Srdanov ,  Gang Yu

    IPC分类号： H01L29/76

    CPC分类号： H01L51/56 ,  H01L27/3246 ,  H01L27/3283 ,  H01L51/0004 ,  H01L51/52

    摘要： An electronic device can include a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. In another aspect, a process for forming the electronic device can include patterning an insulating layer.

    摘要翻译： 电子设备可以包括第一辐射区域，与第一辐射区域间隔开的第二辐射区域和绝缘区域。 绝缘区域可以具有与第一侧相对的第一侧和第二侧。 第一辐射区域可以紧邻第一侧面，并且第二辐射区域可以紧邻第二侧面。 在绝缘区域内，在第一和第二辐射区域之间不会有其他辐射区域，并且绝缘区域可以包括包括多个开口的绝缘层。 另一方面，用于形成电子器件的方法可以包括图案化绝缘层。

    Electronic device including a guest material within a layer and a process for forming the same
    2.
    发明申请
    Electronic device including a guest material within a layer and a process for forming the same 有权
    包括层内的客体材料的电子设备及其形成方法

    公开(公告)号：US20060145167A1

    公开(公告)日：2006-07-06

    申请号：US11026732

    申请日：2004-12-30

    申请人： Charles Macpherson ,  Gordana Srdanov ,  Matthew Stainer ,  Gang Yu

    发明人： Charles Macpherson ,  Gordana Srdanov ,  Matthew Stainer ,  Gang Yu

    IPC分类号： H01L21/00 ,  H01L33/00

    CPC分类号： H01L51/0007 ,  H01L27/3211 ,  H01L51/0005 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0052 ,  H01L51/56

    摘要： A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译： 一种用于形成电子器件的方法包括在衬底上形成第一层并将第一液体组合物置于第一层的第一部分上。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚，并且包括第一客体材料，并且第二部分不超过40nm厚。