System for monitoring oxidant concentration of slurry in a chemical mechanical polishing process
    2.
    发明授权
    System for monitoring oxidant concentration of slurry in a chemical mechanical polishing process 有权
    在化学机械抛光过程中监测浆料氧化剂浓度的系统

    公开(公告)号:US06856394B2

    公开(公告)日:2005-02-15

    申请号:US10104330

    申请日:2002-03-22

    申请人: Chi-Feng Cheng

    发明人: Chi-Feng Cheng

    IPC分类号: G01N21/53 G01N21/59

    CPC分类号: G01N21/534

    摘要: A system for monitoring oxidant concentration in a chemical mechanical polishing process, including a spectrometer and a central controller. The spectrometer is coupled to a conduit for supplying slurry between a slurry supply tub and a polishing table. The spectrometer is used to detect the oxidant concentration of the slurry. The central controller is coupled to the spectrometer, the slurry supply tub and the polishing table. The central controller is used to adjust the composition of the slurry in the slurry supply tub and the polishing condition of the polishing table according to the oxidant concentration of the slurry obtained from a signal transmitted by the spectrometer.

    摘要翻译: 一种用于监测化学机械抛光工艺中的氧化剂浓度的系统,包括光谱仪和中央控制器。 光谱仪耦合到用于在浆料供应槽和抛光台之间供应浆料的导管。 光谱仪用于检测浆料的氧化剂浓度。 中央控制器耦合到光谱仪,浆料供应桶和抛光台。 中央控制器用于根据由光谱仪传输的信号获得的浆料的氧化剂浓度来调节浆料供应桶中的浆料的组成和抛光台的抛光状态。

    Light guide structure for light guide plate
    4.
    发明授权
    Light guide structure for light guide plate 失效
    导光板导光结构

    公开(公告)号:US06814457B2

    公开(公告)日:2004-11-09

    申请号:US10211831

    申请日:2002-08-05

    IPC分类号: F21V704

    摘要: The present invention relates to an improvement for a light guide structure for light guide plate so as to resolve the problems of illumination and degree of uniformity of the conventional light guide plate. The light guide plate of the present invention has line-shaped passages which are located in parallel with the direction of light from the light emitting diodes. The depth of the passages becomes deeper gradually from one end to the other, wherein the source of light is located close to the shallow end, thereby the light from the light emitting diodes is transmitted to the remote areas that are located far from the source of light. The present invention increases the total illumination and the degree of uniformity, and the efficiency of the light emitting diode is also increased.

    摘要翻译: 本发明涉及一种用于导光板的导光结构的改进,以解决常规导光板的照明问题和均匀度问题。 本发明的导光板具有与来自发光二极管的光的方向平行的线状通路。 通道的深度从一端到另一端逐渐变深,其中光源位于靠近浅端的位置,从而来自发光二极管的光被传送到远离源极的远端区域 光。 本发明增加了总照明度和均匀度,并且发光二极管的效率也增加。

    High efficiency light emitting diode apparatus
    6.
    发明授权
    High efficiency light emitting diode apparatus 有权
    高效率发光二极管装置

    公开(公告)号:US07950829B2

    公开(公告)日:2011-05-31

    申请号:US12421114

    申请日:2009-04-09

    IPC分类号: F21V29/00

    摘要: The high efficiency light emitting diode apparatus mainly comprises a connector, a heat dissipating body, a light generator, a central venting portion, and a transparent casing. This connector has a flow guider, a flow chamber and a vent. The light generator contains several LEDs. The heat dissipating body includes an inner passage and an outer passage. The central venting portion has a central channel. An inner flow path and an outer flow path are formed. So, the heat dissipating effect of the flow paths is excellent. The structure forming two flow paths can enhance the heat dissipating effect. The auxiliary element can strengthen the overall illuminating effect. Plus, the auxiliary element can make the light more uniformly.

    摘要翻译: 高效率发光二极管装置主要包括连接器,散热体,光发生器,中央通风部分和透明外壳。 该连接器具有流动导向器,流动室和通风口。 光发生器包含几个LED。 散热体包括内通道和外通道。 中央通风部分具有中心通道。 形成内流路和外流路。 因此,流路的散热效果优异。 形成两个流路的结构可以增强散热效果。 辅助元件可以增强整体照明效果。 此外,辅助元件可以使光线更均匀。

    Defect reduction using pad conditioner cleaning
    8.
    发明申请
    Defect reduction using pad conditioner cleaning 审中-公开
    缺陷减少使用垫调节剂清洁

    公开(公告)号:US20050079811A1

    公开(公告)日:2005-04-14

    申请号:US10681099

    申请日:2003-10-09

    申请人: Chi-Feng Cheng

    发明人: Chi-Feng Cheng

    IPC分类号: B24B37/04 B24B53/007 B24B1/00

    CPC分类号: B24B37/24 B24B53/017

    摘要: A device for cleaning a pad conditioner that comprises a cleaning agent supply for providing a cleaning agent for cleaning a pad conditioner including a conditioning surface, a pad including an abrasive surface, and a pump rotating the pad with respect to the pad conditioner for rubbing the abrasive surface of the pad against the conditioning surface of the pad conditioner.

    摘要翻译: 一种用于清洁垫调节器的装置,包括清洁剂供应源,用于提供用于清洁包括调理表面的垫调节剂的清洁剂,包括研磨表面的垫,以及相对于垫调节器旋转垫的泵,用于摩擦 垫的研磨表面抵靠垫调节剂的调节表面。

    Wafer carrier structure for chemical-mechanical polisher
    9.
    发明授权
    Wafer carrier structure for chemical-mechanical polisher 有权
    化学机械抛光机的晶圆载体结构

    公开(公告)号:US06682409B2

    公开(公告)日:2004-01-27

    申请号:US09861756

    申请日:2001-05-21

    申请人: Chi-Feng Cheng

    发明人: Chi-Feng Cheng

    IPC分类号: B24B100

    CPC分类号: B24B37/30 B24B57/02

    摘要: A wafer carrier structure for a chemical-mechanical polishing device. The wafer carrier structure includes a holder and a slurry supply pipeline. The slurry supply pipeline is attached to the side of the holder such that a portion of the supply pipeline near the outlet end is either parallel or perpendicular to the sidewall of the holder.

    摘要翻译: 用于化学机械抛光装置的晶片载体结构。 晶片载体结构包括保持器和浆料供应管线。 浆料供应管道附接到保持器的侧面,使得靠近出口端的供应管道的一部分平行或垂直于保持器的侧壁。

    Method of forming damascene structure
    10.
    发明授权
    Method of forming damascene structure 有权
    形成镶嵌结构的方法

    公开(公告)号:US06468897B1

    公开(公告)日:2002-10-22

    申请号:US09863919

    申请日:2001-05-23

    IPC分类号: H01L214763

    摘要: A method of forming a damascene structure. A dielectric layer is formed over a substrate. The dielectric layer is a silicon oxynitride layer having a refractivity between 1.55 and 1.74. An opening is formed in the dielectric layer. A metallic layer that covers the substrate and completely fills the opening is formed. A chemical-mechanical polishing operation is conducted to remove excess metallic material outside the opening using the dielectric layer as a polishing stop layer. The dielectric layer has a polishing rate less than that of the metallic layer.

    摘要翻译: 一种形成镶嵌结构的方法。 介电层形成在衬底上。 介电层是折射率在1.55和1.74之间的氮氧化硅层。 在电介质层中形成开口。 形成覆盖基板并完全填充开口的金属层。 进行化学机械抛光操作以使用电介质层作为抛光停止层来除去开口外的多余的金属材料。 电介质层的研磨速度比金属层的抛光速度小。