摘要:
An oxide semiconductor thin film transistor structure includes a substrate, a gate electrode disposed on the substrate, a semiconductor insulating layer disposed on the substrate and the gate electrode, an oxide semiconductor layer disposed on the semiconductor insulating layer, a patterned semiconductor layer disposed on the oxide semiconductor layer, and a source electrode and a drain electrode respectively disposed on the patterned semiconductor layer. The source electrode and the drain electrode are made of a metal layer.
摘要:
A thin film transistor is provided. The thin film transistor includes a substrate, a gate, a gate insulating layer, a source and a drain, a channel layer, and first and second patterned passivation layers. The gate is disposed on the substrate. The gate insulating layer is disposed on the gate. The source and the drain are disposed on the gate insulating layer. The channel layer is disposed above or under the source and the drain, wherein a portion of the channel layer is exposed between the source and the drain. The first patterned passivation layer is disposed on the portion of the channel layer, wherein the first patterned passivation layer includes metal oxide, and the first patterned passivation layer has a thickness ranging from 50 angstroms to 300 angstroms. The second patterned passivation layer covers the first patterned passivation layer, the gate insulating layer, and the source and the drain.
摘要:
A thin film transistor is provided. The thin film transistor includes a substrate, a gate, a gate insulating layer, a source and a drain, a channel layer, and first and second patterned passivation layers. The gate is disposed on the substrate. The gate insulating layer is disposed on the gate. The source and the drain are disposed on the gate insulating layer. The channel layer is disposed above or under the source and the drain, wherein a portion of the channel layer is exposed between the source and the drain. The first patterned passivation layer is disposed on the portion of the channel layer, wherein the first patterned passivation layer includes metal oxide, and the first patterned passivation layer has a thickness ranging from 50 angstroms to 300 angstroms. The second patterned passivation layer covers the first patterned passivation layer, the gate insulating layer, and the source and the drain.
摘要:
A semiconductor structure and a fabricating method thereof are provided. The fabricating method includes forming a gate, a source, and a drain on a substrate and forming an oxide semiconductor material between the gate and the source and drain. The oxide semiconductor material is formed by performing a deposition process, and nitrogen gas is introduced before the deposition process is completely performed, so as to form oxide semiconductor nitride on the oxide semiconductor material.
摘要:
A semiconductor structure and a fabricating method thereof are provided. The fabricating method includes forming a gate, a source, and a drain on a substrate and forming an oxide semiconductor material between the gate and the source and drain. The oxide semiconductor material is formed by performing a deposition process, and nitrogen gas is introduced before the deposition process is completely performed, so as to form oxide semiconductor nitride on the oxide semiconductor material.
摘要:
An electronic device including a display unit and a photoelectric conversion board is provided. The display unit includes a display surface and a back surface which are opposite to each other, and an edge of the photoelectric conversion board is rotatably connected to the back surface of the display unit. The photoelectric conversion board includes a substrate, a first photoelectric conversion unit, and a second photoelectric conversion unit. The substrate has a first surface and a second surface which are opposite to each other, the first photoelectric conversion unit is disposed on the first surface, the second photoelectric conversion unit is disposed on the second surface, and an absorption band of the first photoelectric conversion unit is different from an absorption band of the second photoelectric conversion unit.
摘要:
A system for power management electrically connected to a solar cell is provided. The system for power management includes a photo-sensor, a controller electrically connected to the photo-sensor, and a power manager. The photo-sensor detects an illumination (illuminance or irradiance) of an environment where the solar cell is located. A look-up table of illumination vs. maximum output power is built in the controller, wherein a corresponding maximum output power is determined by the controller according to the illumination detected by the photo-sensor. The power manager is electrically connected to the controller and the solar cell. The power manager controls the output current of the solar cell so as to equalize an output power of solar cell and the corresponding maximum output power. A method for power management is also provided.
摘要:
An electronic device including a display unit and a photoelectric conversion board is provided. The display unit includes a display surface and a back surface which are opposite to each other, and an edge of the photoelectric conversion board is rotatably connected to the back surface of the display unit. The photoelectric conversion board includes a substrate, a first photoelectric conversion unit, and a second photoelectric conversion unit. The substrate has a first surface and a second surface which are opposite to each other, the first photoelectric conversion unit is disposed on the first surface, the second photoelectric conversion unit is disposed on the second surface, and an absorption band of the first photoelectric conversion unit is different from an absorption band of the second photoelectric conversion unit.
摘要:
An electronic apparatus and a display thereof are disclosed. The display includes a back plate, a photoelectric converting module, and a display module. The back plate has an inner surface and an open is formed on the back plate. The back plate has an inner edge around the open. The inner edge is concave toward the direction back to inner surface to form a supporting part. The photoelectric converting module is disposed on the supporting part without protruding out of the inner surface. The photoelectric converting module has a light-receiving surface exposed to the open. The display module is disposed on the inner surface of the back plate and the display module covers the photoelectric converting module. The display module has a display surface back to the photoelectric converting module.
摘要:
A three-dimensional display device includes a display panel and a barrier structure. The barrier structure is located at one side of the display panel. Besides, the barrier structure includes a plurality of barrier patterns and a plurality of transparent slits. The barrier patterns and the transparent slits are arranged alternately. In particular, the barrier patterns include a photoelectric conversion structure.