摘要:
An item setting apparatus for changing over a screen corresponding to a desired tab by selecting the desired tab from plural tabs and setting items displayed on the screen based on a user's operation, comprises an item information holding section to hold item information about indication of items of plural tabs having plural items; a group information holding section to separate items into plural groups and hold group information about that to which group each item belongs; a display item editing section to edit items displayed on a screen of a tab; and a tab display control section to control to display items correctively by a group unit on a screen of a tab selected by a user by using the group information.
摘要:
Disclosed is a computer readable storage medium storing a program to make a computer realize functions of an image storage unit to store image data for generating a tint block image, a tint block image generation unit to generate the tint block image based on the image data, a script generation unit to generate a script for forming the tint block image based on the tint block image generated by the generation unit, a script adding unit to add the script to print data and a print data input unit to input the print data in which the script is added by the adding unit to an image forming apparatus.
摘要:
Disclosed is a computer readable storage medium storing a program to make a computer realize functions of an image storage unit to store image data for generating a tint block image, a tint block image generation unit to generate the tint block image based on the image data, a script generation unit to generate a script for forming the tint block image based on the tint block image generated by the generation unit, a script adding unit to add the script to print data and a print data input unit to input the print data in which the script is added by the adding unit to an image forming apparatus.
摘要:
The display information is compared with the displayed information on what items are already displayed at what positions on the editable tab screen capable of editing the items stored therein, wherein the aforementioned display information includes the display item information on which of the items contained in the fixed tabs are to be displayed on the editable tab screen and the display position information on the positions of the items to be found on the editable tab screen. If a change has been discovered, a step is taken to determine the method of change processing for displaying the editable tab screen according to the result of comparison. The editable tab screen selected by the user is displayed according to the method of change processing based on the result of comparison.
摘要:
The editable tab selectably displayed as well as the fixed tabs is selected by the user, whereby an editable tab screen is created and displayed using the display item information on which item should be displayed on the editable tab screen, the display position information on the position of the item to be displayed on the editable tab screen, and the item information of item included in the fixed tab.
摘要:
Execution is provided of at least: the first processing for making the installer software store the group information that relates to information which classifies a plurality of apparatuses into groups and specifies the apparatuses belonging to each group or the address information indicating the location storing this group information, at the time of building the installer software for installing the universal control software that provides universal control of a plurality of the apparatuses; the second processing for notifying about the group information or address information to prompt the group setting of a plurality of the apparatuses when installing the universal control software using installer software; and the third processing for selecting an apparatus as the object of control from among the apparatuses specified by group information acquired from the storage location having been notified or specified by the address information, when universal control software is executed.
摘要:
A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a semiconductor wafer sink rate different in polishing from that of the other abrasive cloth for one of a polishing cloth (14) on an upper surface plate (12) and a polishing cloth (15) on a lower surface plate (13) so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer (W), or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.
摘要:
A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head. A polishing method is used in a polishing apparatus having a plurality of polishing stations for polishing materials to be polished and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations successively, each of the polishing stations including a platen having a polishing pad affixed to a surface of the platen, the arm including a plurality of polishing heads, each of which holds the material being polished and brings one surface of the material being polished into contact with the polishing pad, the material to be polished being polished by the polishing pad with relative movement between the polishing head and the platen. The polishing method comprises the steps of fitting a spindle for supporting the polishing head in a horizontally rotatable manner into each of fitting portions formed in each of a plurality of spindle housings provided in the arm; rotating the material being polished and the polishing pad relatively while keeping the material being polished and the polishing pad contacted with each other; and adjusting an axial position of the polishing head and changing a position of the polishing head relative to the arm by an adjusting mechanism provided on the spindle, whereby the materials to be polished are each polished while being adjusted in position thereof
摘要:
In a device processing method, a laser beam is applied to a wafer along division lines from the back side of the wafer, thereby forming a division start point inside the wafer along the division lines at a depth not reaching the finished thickness of each device. A protective member is attached to the front side of the wafer before or after performing the division start points are formed. An external force is applied through the protective member to the wafer, thereby dividing the wafer along the division lines to obtain the individual devices. The back side of the wafer is ground to remove the modified layers, and a silicon nitride film is formed on at least the side surface of each device. The silicon nitride film has a gettering effect and is formed on the side surface of each device, which surface is formed by a cleavage plane.
摘要:
In a wafer processing method, the back side of a wafer having a plurality of devices on the front side thereof is ground, thereby reducing the thickness of the wafer to a predetermined thickness. The back side of the wafer is polished after performing the back grinding step, thereby removing a grinding strain, and a silicon nitride film is formed on the back side of the wafer. The thickness of the silicon nitride film to be formed in the silicon nitride film forming step is set to 6 to 100 nm. Thus, the silicon nitride film having a thickness of 6 to 100 nm is formed on the polished back side of the wafer from which a grinding strain has been removed. Accordingly, each device constituting the wafer can ensure a sufficient die strength and a sufficient gettering effect.