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1.发明授权Micro-optoelectromechanical system packages for a light modulator and methods of making the same 有权用于光调制器的微光机电系统封装及其制造方法公开(公告)号：US07307773B2
公开(公告)日：2007-12-11
申请号：US11029316
申请日：2005-01-04
CPC分类号： H01L31/0203 , H01L2224/48091 , H04N5/7458 , H01L2924/00014
摘要： A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid, gel or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.
摘要翻译： 用于光调制器的微光电机电系统（MOEMS）封装包括密封的调制器封装，其包含密封在第一透明盖下的光调制器; 包含密封调制器封装件的次级较大封装，所述二次封装包括密封件和第二透明盖; 以及设置在第一透明盖和第二透明盖之间的光学材料，其中光学材料是固体，凝胶或液体。 用于光调制器的替代的微光电机电系统（MOEMS）封装包括密封的调制器封装，其包含密封在第一透明盖下的光调制器; 包含密封调制器封装的二次，较大封装; 以及设置在具有调制器封装的二次封装内的干燥剂或吸气材料。
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公开(公告)号：US08497577B2
公开(公告)日：2013-07-30
申请号：US11870306
申请日：2007-10-10
IPC分类号： H01L23/12
CPC分类号： B81B7/007 , H01L2924/16235
摘要： An apparatus includes a Micro Electrical Mechanical System (MEMS) having electrical contacts and a MEMS device in electrical communication with the electrical contacts. A lid is oriented over the MEMS device and not the electrical contacts. The lid has a base region and a top region, the base region being wider in dimension than the top region and oriented in closer proximity to the MEMS device than the top region.
摘要翻译： 一种装置包括具有电触头的微机电系统（MEMS）和与电触头电连通的MEMS装置。 盖子定位在MEMS器件上，而不是电触头。 盖子具有基部区域和顶部区域，基底区域的尺寸比顶部区域宽，并且被定向成比顶部区域更靠近MEMS装置。
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公开(公告)号：US07541209B2
公开(公告)日：2009-06-02
申请号：US11251412
申请日：2005-10-14
申请人： Charles C Haluzak , Chien-Hua Chen , David M Craig
发明人： Charles C Haluzak , Chien-Hua Chen , David M Craig
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81B2207/092 , H05K3/3442 , H05K2201/10454 , H05K2201/1053 , Y02P70/613
摘要： A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.
摘要翻译： 形成具有边缘互连焊盘的器件封装的方法包括形成覆盖至少一个电连接到下层的导电通孔的MEMS器件的阵列。 该方法继续通过镶嵌工艺沉积与MEMS器件阵列共面的衬底上的导电材料，该导电材料耦合到至少一个导电通孔。 该方法还包括用钝化层覆盖MEMS器件阵列和导电材料。
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公开(公告)号：US07300812B2
公开(公告)日：2007-11-27
申请号：US10976452
申请日：2004-10-29
IPC分类号： H01L21/00
CPC分类号： B81B7/007 , H01L2924/16235
摘要： This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.
摘要翻译： 本公开涉及用于形成和使用它们的盖子和方法。 这些盖子的一个实施例使得由盖子保护的MEMS更小。 这些盖子中的另一个使得能够测试一组结合的有盖MEMS。 此外，还公开了用于形成和使用这些盖的方法。 这些过程中的一个从位于组件MEMS上的盖子前体形成盖子。
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5.发明授权Assembly with a ring and bonding pads formed of a same material on a substrate 有权装配有一个环和在基片上由相同材料形成的焊盘公开(公告)号：US07262498B2
公开(公告)日：2007-08-28
申请号：US11038374
申请日：2005-01-18
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
摘要翻译： 组件包括衬底，耦合到衬底的器件; 形成在所述基板上的环; 以及形成在基板上的一个或多个接合焊盘，其中环和焊盘由相同的材料形成。
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6.发明申请公开(公告)号：US20110025782A1
公开(公告)日：2011-02-03
申请号：US12896980
申请日：2010-10-04
申请人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
发明人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
IPC分类号： B41J2/14
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1637
摘要： A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.
摘要翻译： 微流体装置包括粘合在一起的第一和第二基底。 第一基板具有第一和第二相对表面。 模具袋形成在第一相对表面中，并且通孔从模腔延伸到第二相对表面。 第二基板结合到第一基板的第二相对表面，由此形成在第二基板中的通道的出口基本上与通孔对准。 第二基板的通道具有比出口大的入口。
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公开(公告)号：US07766462B2
公开(公告)日：2010-08-03
申请号：US11677340
申请日：2007-02-21
申请人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
发明人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2202/03 , Y10T29/49401
摘要： A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.
摘要翻译： 形成流体喷射装置的方法包括形成一对第一玻璃层并形成第二玻璃层。 每个第一玻璃层包括第一侧和第二侧，第二侧限定第一流体流动结构。 第二玻璃层包括与第一侧相对的第一侧和第二侧，每个相应的第一侧和第二侧限定第二流体流动结构。 第二玻璃层被粘合在相应的第一玻璃层之间的夹持位置中，其中第二玻璃层的每个相应的第二流体流动结构与相应的第一玻璃层的相应的第一流体流动结构流体连通，以限定流体流动路径 用于喷射流体。
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8.发明授权Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering 失效使用抗静电材料和选择性等离子体溅射制备微机电系统装置公开(公告)号：US07443001B2
公开(公告)日：2008-10-28
申请号：US11541993
申请日：2006-10-02
IPC分类号： H01L21/00 , H01L21/302
CPC分类号： B81C1/00849 , B81C2201/112 , B81C2203/0145
摘要： A method for preparing a microelectromechanical system (MEMS) device for subsequent processing is disclosed. The method includes establishing an anti-stiction material on exposed surfaces of the MEMS device. The exposed surfaces include at least an interior surface of a chamber and an external surface of the MEMS device. The anti-stiction material is selectively removed from at least a portion of the external surface via a plasma sputtering process under controlled conditions.
摘要翻译： 公开了一种用于制备用于后续处理的微机电系统（MEMS）装置的方法。 该方法包括在MEMS器件的暴露表面上建立抗静电材料。 暴露的表面包括至少室的内表面和MEMS装置的外表面。 在受控条件下，通过等离子体溅射工艺，从外表面的至少一部分选择性地除去抗静电材料。
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公开(公告)号：US20080280398A1
公开(公告)日：2008-11-13
申请号：US12177033
申请日：2008-07-21
IPC分类号： H01L21/50
CPC分类号： B81C1/00285 , B81B2201/042 , G02B26/0833
摘要： A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
摘要翻译： 一种形成MEMS（微机电系统）的方法包括：通过限定在其中包含多个MEMS致动器的空腔的MEMS盖形成环境端口; 以及将盖装置结合到MEMS盖以密封环境端口。
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10.发明申请公开(公告)号：US20080259125A1
公开(公告)日：2008-10-23
申请号：US11738654
申请日：2007-04-23
申请人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
发明人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1637
摘要： A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet.
摘要翻译： 微流体装置包括粘合在一起的第一和第二玻璃基板。 第一玻璃基板具有第一和第二相对表面。 模具袋形成在第一相对表面中，并且通孔从模腔延伸到第二相对表面。 第二玻璃基板被接合到第一玻璃基板的第二相对表面，由此形成在第二玻璃基板中的通道的出口基本上与通孔对准。 第二玻璃基板的通道具有比出口大的入口。
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