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    Barium titanate-based semiconductor ceramic
    2.
    发明授权
    Barium titanate-based semiconductor ceramic 失效
    钛酸钡系半导体陶瓷

    公开(公告)号：US6071842A

    公开(公告)日：2000-06-06

    申请号：US305363

    申请日：1999-05-05

    申请人： Chihiro Takahashi ,  Shigeki Sato

    发明人： Chihiro Takahashi ,  Shigeki Sato

    IPC分类号： C04B35/468 ,  H01C7/02

    CPC分类号： H01C7/025 ,  C04B35/4682

    摘要： A barium titanate-based semiconducting ceramic, which contains BaTiO.sub.3 as a main component thereof, and Ba.sub.2 TiSi.sub.2 O.sub.8 and Ba.sub.n Ti.sub.m O.sub.n+2m (1.ltoreq.n.ltoreq.4, 2.ltoreq.m.ltoreq.13, n.ltoreq.m), respectively, as trace-phase compositions, wherein the ratio of the contents of about Ba.sub.2 TiSi.sub.2 O.sub.8 and Ba.sub.n Ti.sub.m O.sub.n+2m (Ba.sub.2 TiSi.sub.2 O.sub.8 /Ba.sub.n Ti.sub.m O.sub.n+2m) as the trace-phase compositions is in the range of about 0.5 to 80.0. This semiconductive ceramic exhibits excellent voltage resistance and ensures high reliability as a product element. Moreover, it has a suitable room temperature resistivity .rho.25 for functioning as a product element.

    摘要翻译： 以BaTiO3为主要成分的钛酸钡类半导体陶瓷和BaTiO 2 O 8和BanTimOn + 2m（1≤n≤2，m = 13，n = m） 作为痕量相组成，其中作为痕量相组合物的约Ba2TiSi2O8和BanTimOn + 2m（Ba2TiSi2O8 / BanTimOn + 2m）的含量比在约0.5至80.0的范围内。 该半导体陶瓷表现出优异的耐电压性，并确保作为产品元件的高可靠性。 此外，它具有用作产品元件的合适的室温电阻率rho 25。

    Glass material, living tissue replacement, and orthodontic part
    3.
    发明授权
    Glass material, living tissue replacement, and orthodontic part 失效
    玻璃材料，活组织置换和正畸部分

    公开(公告)号：US5795151A

    公开(公告)日：1998-08-18

    申请号：US669319

    申请日：1996-07-09

    申请人： Toru Nonami ,  Chihiro Takahashi ,  Tatsuji Sano

    发明人： Toru Nonami ,  Chihiro Takahashi ,  Tatsuji Sano

    IPC分类号： A61L27/00 ,  A61C7/14 ,  A61C13/20 ,  A61K6/027 ,  A61K6/06 ,  A61L27/02 ,  C03C3/083 ,  C03C3/085 ,  C03C8/02 ,  C03C10/04 ,  C03C10/08 ,  A61C3/00 ,  A61C8/00

    CPC分类号： C03C4/0021 ,  A61K6/0044 ,  A61K6/0094 ,  A61K6/0215 ,  A61K6/0235 ,  A61K6/024 ,  A61K6/0276 ,  A61L27/025 ,  C03C3/085 ,  C03C8/02 ,  A61C13/20 ,  A61C7/14

    摘要： A glass material of the invention contains SiO.sub.2, MgO, Al.sub.2 O.sub.3, and TiO.sub.2 as main components in amounts of 40-65% by weight of SiO.sub.2, 9-30% by weight of MgO, 8-31% by weight of Al.sub.2 O.sub.3, and 6-15% by weight of TiO.sub.2, and satisfies expression I: {100-(A+S+T)}/S.gtoreq.0.340 wherein A, S and T are contents in % by weight of Al.sub.2 O.sub.3, SiO.sub.2, and TiO.sub.2, respectively, and Expression II: (S+M)/4>100-(S+M+A+T) wherein M is a content in % by weight of MgO, and is substantially free of fluorine. It is used in the preparation of a living tissue replacement or orthodontic part. A living tissue replacement and orthodontic part which experience a minimal loss of material properties in a deleterious environment as in the oral cavity and should have a complex shape as in the case of a dental crown repair, high strength and aesthetic appearance can be briefly prepared in a safe manner without using a special manufacturing apparatus.

    摘要翻译： PCT No.PCT / JP95 / 02419 Sec。 371日期：1996年7月9日 102（e）日期1996年7月9日PCT提交1995年11月28日PCT公布。 出版物WO96 / 16683 日期：1996年6月6日本发明的玻璃材料含有SiO 2，MgO，Al 2 O 3和TiO 2作为主要组分，其量为40-65重量％的SiO 2，9-30重量％的MgO，8-31重量％ 的Al 2 O 3和6〜15重量％的TiO 2，满足表达式I：{100-（A + S + T）} / S> = 0.340其中A，S和T为Al2O3重量％ SiO 2和TiO 2，以及表达式II：（S + M）/ 4> 100-（S + M + A + T）其中M是以MgO的重量％计的含量，并且基本上不含氟。 它用于制备活组织置换或正畸部分。 在口腔中的有害环境中经历物理性质损失最小的活组织置换和正畸部分可以如牙冠修复，高强度和美学外观的情况下具有复杂的形状，可以简单地制备 没有使用特殊的制造设备的安全的方式。

    Microanalysis Chip Adhesive Sheet, Microanalysis Chip, And Manufacturing Method Thereof
    6.
    发明申请
    Microanalysis Chip Adhesive Sheet, Microanalysis Chip, And Manufacturing Method Thereof 审中-公开
    微量分析芯片粘合片，微量分析芯片及其制造方法

    公开(公告)号：US20110130307A1

    公开(公告)日：2011-06-02

    申请号：US12991062

    申请日：2009-05-13

    申请人： Chihiro Takahashi ,  Ryo Sakai ,  Masatoshi Yamada

    发明人： Chihiro Takahashi ,  Ryo Sakai ,  Masatoshi Yamada

    IPC分类号： C40B40/10 ,  C08F20/06 ,  C40B40/14 ,  C40B40/06 ,  C40B50/18

    CPC分类号： G01N33/543 ,  G01N33/54386

    摘要： Disclosed is a microanalysis chip adhesive sheet with an adhesive surface, which can be inexpensively but easily bonded to a substrate at a relatively low temperature, with which fabrication of analysis chips is simplified, and which has the capability of fixing a selective bonding substance to the sheet surface. The microanalysis chip is characterized in that a microanalysis chip adhesive sheet, which comprises a plastic sheet provided with an adhesive layer formed from an adhesive that contains a polymer in which monomer structural units that contain carboxyl radicals or acid anhydride radicals constitute 5-25% by weight of the [total] monomer structural units in the polymer, and a substrate, which has protrusions and recesses on the surface thereof, are bonded together so that the surface of the substrate having the projections and concavities and the adhesive layer of the aforementioned microanalysis chip adhesive sheet are on the inside. Gaps at the concave parts of the substrate between the substrate and the adhesive layer of the aforementioned microanalysis chip adhesive sheet form a flow path, a part of which is the aforementioned adhesive layer, and a selective bonding substance is fixed to the adhesive layer surface.

    摘要翻译： 公开了一种具有粘合剂表面的微量分析芯片粘合片，其可以在相对较低的温度下廉价但容易地结合到基底上，从而简化了分析芯片的制造，并且具有将选择性粘合物质固定到 片材表面。 微量分析芯片的特征在于，一种微量分析芯片粘合片，其包括设置有由粘合剂形成的粘合剂层的塑料片，所述粘合剂层包含聚合物，其中含有羧基或酸酐基的单体结构单元构成5-25％ 聚合物中的[总]单体结构单元的重量和在其表面具有突起和凹部的基板被粘合在一起，使得具有突起和凹部的基板的表面和上述微量分析的粘合层 芯片粘合片在里面。 基板与上述微量分析片粘合片的粘合层之间的基板的凹部的间隙形成流路，其一部分为上述粘合层，选择性粘合物质固定在粘合层表面。