摘要:
The invention relates to an elastic fluorohydrocarbon resin. This resin is obtained by graft copolymerization of a first segment which is one of fluorine-containing elastomeric and crystalline polymers with a second segment which is the other of these polymers. The first segment is prepared by copolymerizing at least one first unsaturated monomer that has peroxy bond with at least one second fluorine-containing monomer. When the first monomer is dissolved in a first solvent prior to the copolymerization, the copolymerization can be safely conducted with higher yield. This first solvent is selected from a carboxylic ester of t-butanol, methylene chloride, 1,1,1-trichloroethane, and first, second, third and fourth compounds which are respectively represented by R.sup.1 COOR.sup.2, C.sub.2 H.sub.x Cl.sub.y F.sub.z, C.sub.3 H.sub.x Cl.sub.y F.sub.z, and C.sub.4 H.sub.x Cl.sub.y F.sub.z. When the fluorine-containing elastomeric copolymer as the first segment is purified by contact with a barium salt prior to the graft copolymerization, the elastic fluorohydrocarbon resin becomes improved in thermal stability. When the fluorine-containing elastomeric copolymer having a water content of 0.1-50 wt % as the first segment is dispersed in a liquid medium containing t-butanol and water, it becomes unnecessary to dry this elastomeric copolymer prior to the graft copolymerization. When the fluorine-containing elastomeric copolymer as the first segment is dispersed in another liquid medium containing t-butanol, water, a carboxylic ester and barium hydroxide, the elastic fluorohydrocarbon resin becomes improved in thermal stability with higher graft copolymerization rate.
摘要:
The invention relates to an elastic fluorohydrocarbon resin. This resin is obtained by graft copolymerization of a first segment which is one of fluorine-containing elastomeric and crystalline polymers with a second segment which is the other of these polymers. The first segment is prepared by copolymerizing at least one first unsaturated monomer that has peroxy bond with at least one second fluorine-containing monomer. When the first monomer is dissolved in a first solvent prior to the copolymerization, the copolymerization can be safely conducted with higher yield. This first solvent is selected from a carboxylic ester of t-butanol, methylene chloride, 1,1,1-trichloroethane, and first, second, third and fourth compounds which are respectively represented by R.sup.1 COOR.sup.2, C.sub.2 H.sub.x Cl.sub.y F.sub.z, C.sub.3 H.sub.x Cl.sub.y F.sub.z, and C.sub.4 H.sub.x Cl.sub.y F.sub.z. When the fluorine-containing elastomeric copolymer as the first segment is purified by contact with a barium salt prior to the graft copolymerization, the elastic fluorohydrocarbon resin becomes improved in thermal stability. When the fluorine-containing elastomeric copolymer having a water content of 0.1-50 wt % as the first segment is dispersed in a liquid medium containing t-butanol and water, it becomes unnecessary to dry this elastomeric copolymer prior to the graft copolymerization. When the fluorine-containing elastomeric copolymer as the first segment is dispersed in another liquid medium containing t-butanol, water, a carboxylic ester and barium hydroxide, the elastic fluorohydrocarbon resin becomes improved in thermal stability with higher graft copolymerization rate.
摘要:
Disclosed is a method for producing 3,3,3-trifluoropropyne, which is characterized in that a base is reacted with (Z)-1-halogeno-3,3,3-trifluoropropene represented by formula [1]. It is possible by this production method to obtain 3,3,3-trifluoropropyne with high yield. Furthermore, since waste disposal is also easy, it is a production method that is industrially advantageous.
摘要:
A cleaning processing system for applying a cleaning processing to a substrate such as a semiconductor wafer comprises a cleaning processing section including a plurality of process units each serving to apply a predetermined treatment to a wafer W and a loading/unloading section 2 for loading and unloading the wafer W into and out of the cleaning processing section. The cleaning processing section includes four scrub cleaning units consisting of two scrub cleaning units arranged side by side and two additional cleaning units stacked on the two scrub cleaning units arranged side by side, respectively, so as to form upper and lower stages of the scrub cleaning units, a wafer inversion unit for turning the wafer W upside down, a wafer transit unit having the wafer W disposed thereon temporarily for performing the transfer of the wafer W to and from the transfer section, and a main wafer transfer mechanism capable of gaining access to all of these units and performing the transfer of the wafer W between different units.
摘要:
Disclosed is a method of purifying (Z)-1-chloro-3,3,3-trifluoropropene of the formula [1], comprising: distilling a mixture containing (Z)-1-chloro-3,3,3-trifluoropropene and 1-chloro-1,3,3,3-tetrafluoropropane (CF3CH2CHClF), wherein the distilling is performed by extractive distillation of the mixture in the coexistence of at least one kind of compound selected from the group consisting of halogenated hydrocarbons of the formula [2], halogenated unsaturated hydrocarbons, nitriles, ketones, carbonates, ethers, esters and alcohols as an extractant [Chem. 8] CFnCl3-nCHXCClFmH2-m [2] where X represents a hydrogen atom (H), a fluorine atom (F) or a chlorine atom (Cl); n represents an integer of 0 to 3; and m represents an integer of 0 to 2.
摘要:
There is provided an azeotrope or azeotrope-like composition containing (A) 1,1,2,2-tetrafluoro-1-methoxyethane and (B) a compound formed of at least one selected from the group consisting of (Z)-1-chloro-3,3,3-trifluoropropene, 2-bromo-3,3,3-trifluoropropene, and (E)-2-bromo-1,3,3,3-tetrafluoropropene.
摘要:
Disclosed herein is a processing system for applying a cleaning processing to a substrate such as a semiconductor wafer which includes a cleaning processing section including a plurality of process units each serving to apply a predetermined treatment to a wafer and a loading/unloading section 2 The cleaning processing section includes four scrub cleaning units consisting of two scrub cleaning units arranged side by side and two additional cleaning units stacked on the two scrub cleaning units arranged side by side, respectively, so as to form upper and lower stages of the scrub cleaning units, a wafer inversion unit for turning the wafer upside down, a wafer transit unit having the wafer disposed thereon temporarily for performing the transfer of the wafer to and from the transfer section, and a main wafer transfer mechanism.
摘要:
A substrate dual-side processing apparatus has a processor to apply a specific process to a front surface and a rear surface of a substrate, a reversing unit to reverse the substrate and a substrate-transfer mechanism to transfer the substrate between the processor and the reversing unit. The reversing unit has a holder for holding the substrate when the substrate is being transferred to and from the substrate-transfer mechanism and a rotating mechanism for rotating the substrate, thus the substrate being reversed while held by the holders. The reversing unit may have a pair of holders for holding the substrate at the front and rear surfaces, a drive mechanism for driving the pair of holders so that the holders become close to or apart from each other and a rotating mechanism for rotating the substrate, thus the substrate being reversed while held by the holders.
摘要:
A drive unit 42 for driving a brush 8 is provided on a tip of a rotatable arm 26. The drive unit 42 includes a motor 61 for driving the processing member 24 having a brush 58 for rotation and an adjustment mechanism 45 for adjusting a force to urge the processing member 24 against a wafer W. With no intermediary of a flexible transmitting means, such as a belt, the processing member 24 is securely joined to the motor 61 through a shaft 55 and driven by the motor 61 directly. The adjustment mechanism 45 is constituted by an electromagnetic actuator which includes a stationary element 46 and a movable element 48 capable of elevating along the stationary element 46. The motor 61 is coupled to the armature 48. The adjustment mechanism 45 controls the position of the processing member 24 with respect to the upward and downward direction as well as the force to urge the processing member 24 against a wafer W.
摘要:
A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection. An AND processing part further performs processing of a logical product of the cross-references of both the variables and outputs a result thereof to an analysis result display part.