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    Ultrasound transducer with improved acoustic performance
    3.
    发明授权
    Ultrasound transducer with improved acoustic performance 有权
    超声波换能器具有改善的声学性能

    公开(公告)号：US08207652B2

    公开(公告)日：2012-06-26

    申请号：US12485226

    申请日：2009-06-16

    申请人： Charles Edward Baumgartner ,  Jean-Francois Gelly ,  Lowell Smith ,  Charles G. Woychik ,  Frederic Lanteri ,  Stephen Edwardsen ,  Robert S. Lewandowski

    发明人： Charles Edward Baumgartner ,  Jean-Francois Gelly ,  Lowell Smith ,  Charles G. Woychik ,  Frederic Lanteri ,  Stephen Edwardsen ,  Robert S. Lewandowski

    IPC分类号： H01L41/08

    CPC分类号： G10K11/002 ,  A61B8/4483 ,  A61B8/483

    摘要： A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.

    摘要翻译： 公开了一种通过减少声谱内的伪像来改善超声换能器的声学性能的系统。 该系统包括具有声学元件阵列的声学层，耦合到声学层并且具有大于声学层的声学阻抗的声阻抗的解映射层，以及耦合到分离层的中介层，并且包括衬底和 多个导电元件。 内插层形成为具有低于分配层的声阻抗的声阻抗。 超声波换能器还包括耦合到插入层的集成电路，并通过分配层和插入层电连接到声学元件阵列。

    Method of manufacturing ultrasound transducer device having acoustic backing
    6.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号：US20050046311A1

    公开(公告)日：2005-03-03

    申请号：US10960871

    申请日：2004-10-06

    申请人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    发明人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    IPC分类号： G01N29/24 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  B81B3/00 ,  G01H11/06 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/187 ,  H01L41/193 ,  H02N2/00 ,  H04R1/32 ,  H04R17/00 ,  H04R19/00

    CPC分类号： B06B1/0292 ,  B06B1/0685 ,  B06B1/0688 ,  G01H11/06 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译： 一种超声波换能器装置，包括：微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征，例如突片或凹口，用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄，以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配，以便防止在向后传播的任何声能的界面处的反射，即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Image-based probe guidance system
    7.
    发明申请
    Image-based probe guidance system 审中-公开
    基于图像的探针引导系统

    公开(公告)号：US20070066880A1

    公开(公告)日：2007-03-22

    申请号：US11223354

    申请日：2005-09-09

    申请人： Warren Lee ,  Mir Seyed-Bolorforosh ,  Douglas Wildes ,  Lowell Smith ,  Kai Thomenius

    发明人： Warren Lee ,  Mir Seyed-Bolorforosh ,  Douglas Wildes ,  Lowell Smith ,  Kai Thomenius

    IPC分类号： A61B5/05

    CPC分类号： A61B8/12 ,  A61B5/06 ,  A61B5/062 ,  A61B5/067

    摘要： A system for guiding probe is presented. The system includes a probe configured to acquire image data representative of a region of interest. Additionally, the system includes an imaging system in operative association with the probe and configured to facilitate guiding the probe to a desirable location based on the acquired image data and indications of change in position of the probe.

    摘要翻译： 介绍了一种引导探针的系统。 该系统包括被配置为获取表示感兴趣区域的图像数据的探针。 另外，该系统包括与探头可操作地相关联的成像系统，并且被配置为便于基于所获取的图像数据和探针的位置变化的指示来将探针引导到期望的位置。

    Ultrasound transducer with additional sensors
    8.
    发明申请
    Ultrasound transducer with additional sensors 审中-公开
    超声波换能器附加传感器

    公开(公告)号：US20060004290A1

    公开(公告)日：2006-01-05

    申请号：US10881986

    申请日：2004-06-30

    申请人： Lowell Smith ,  Rayette Fisher ,  David Mills ,  Charles Baumgartner

    发明人： Lowell Smith ,  Rayette Fisher ,  David Mills ,  Charles Baumgartner

    IPC分类号： A61B8/14

    CPC分类号： A61B8/4483 ,  A61B8/00 ,  G01S7/52079 ,  G01S15/899

    摘要： The present technique provides for the manufacture and/or use of an ultrasound probe configured to acquire non-imaging data in addition to imaging data. In particular, the ultrasound probe includes a micro-machined ultrasound transducer formed on the surface of a substrate using micro-electric mechanical systems techniques or other techniques associated with semiconductor processing. Non-imaging sensors are formed on the substrate, either on the surface or the interior, or on a substrate proximate to the substrate upon which the transducer is formed. The non-imaging sensors may be used to acquire non-imaging data in conjunction with the acquisition of imaging data by the transducer.

    摘要翻译： 本技术提供了除了成像数据之外还配置成获取非成像数据的超声波探头的制造和/或使用。 特别地，超声波探头包括使用微电子机械系统技术或与半导体处理相关的其它技术在基板的表面上形成的微加工的超声换能器。 非成像传感器形成在衬底上，无论是在表面还是内部，或者在靠近形成换能器的衬底的衬底上。 非成像传感器可以用于通过换能器获取成像数据来获取非成像数据。