公开(公告)号：US20120298283A1

公开(公告)日：2012-11-29

申请号：US13454477

申请日：2012-04-24

申请人： Masayuki Yamamoto ,  Chouhei Okuno

发明人： Masayuki Yamamoto ,  Chouhei Okuno

IPC分类号： B29C65/50

CPC分类号： H01L21/67132 ,  B29C65/50

摘要： A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

摘要翻译： 工件从晶片接收容器卸载。 第一识别传感器检测工件的前表面，并且确定半导体晶片或间隔件是工件。 在工件是晶片的情况下，第一鉴别传感器还确定保护带是否在工件的前表面上。 在确定保护带不在前表面上的情况下，第二鉴别传感器检测晶片的背面，以鉴别保护带的存在与否。

公开(公告)号：US20100038009A1

公开(公告)日：2010-02-18

申请号：US12539476

申请日：2009-08-11

申请人： Chouhei Okuno ,  Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/00 ,  B32B37/00 ,  B32B41/00

CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T156/10 ,  Y10T156/12

摘要： A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape.

摘要翻译： 在半导体晶片的表面上方提供保护带，并且通过滚动接合辊并将接合辊压靠在保护带上而与半导体晶片的表面接合。 然后沿着半导体晶片的外周切出接合的保护带。 随后，用压力构件按压保护带，使保护带的表面变平。

公开(公告)号：US20090133815A1

公开(公告)日：2009-05-28

申请号：US12252249

申请日：2008-10-15

申请人： Chouhei Okuno ,  Masayuki Yamamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto

IPC分类号： B65C9/18 ,  B32B37/10 ,  B65C9/26

CPC分类号： B65C9/1884 ,  Y10T156/17

摘要： A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a statewhere part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label.

摘要翻译： 接收器底座从标签的从剥离纸的折回部分向前馈送的前端部分的下方接收并向下延伸，使得标签保持在预定的向前和向下倾斜的姿势。 在将标签的后端的一部分接合并保持在剥离纸上的状态下分离和供给标签的过程中，具有向前和向下倾斜的向下吸引表面的吸头接近顶部 标签的表面被分离以吸取标签。

公开(公告)号：US08679289B2

公开(公告)日：2014-03-25

申请号：US13274394

申请日：2011-10-17

申请人： Chouhei Okuno ,  Masayuki Yamamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/6838 ,  Y10T156/1105 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/15 ,  Y10T156/1906 ,  Y10T156/1944 ,  Y10T156/1978

摘要： A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

摘要翻译： 第一保持台吸附保持在其后表面上的晶片的环形突起以围绕后研磨区域。 具有与环形突起的内壁相邻的外周壁的第二保持台插入到环形突起内的平坦部分中，用于将分离的粘合带连接到晶片的表面上的保护带，同时 平坦部分是抽吸的。 此后，胶带被分离。 因此，粘合带与保护带一起与晶片的表面分离。

公开(公告)号：US20110236171A1

公开(公告)日：2011-09-29

申请号：US13050151

申请日：2011-03-17

申请人： Masayuki Yamamoto ,  Chouhei Okuno

发明人： Masayuki Yamamoto ,  Chouhei Okuno

IPC分类号： B65G47/91

CPC分类号： H01L21/6838 ,  H01L21/67092 ,  H01L21/67132

摘要： Two or more pads having through holes formed therein concentrically at given pitches are provided on a U-shaped holding arm. Compressed air is sprayed from the pad to a protection sheet to generate negative pressure between a holding surface of the holding arm and the protection sheet for suspendingly holding a wafer with the protection sheet floating, or the pad suction-holds and transports a rear face of the wafer having an exposed circuit surface.

摘要翻译： 在U形保持臂上设置两个或更多个具有以给定间距同心形成的通孔的垫。 压缩空气从衬垫喷射到保护片以在保持臂的保持表面和保护片之间产生负压，用于将保护片悬浮的悬浮保持晶片，或者垫吸住保持并输送 晶片具有暴露的电路表面。

公开(公告)号：US20110232820A1

公开(公告)日：2011-09-29

申请号：US13050007

申请日：2011-03-17

申请人： Masayuki Yamamoto ,  Chouhei Okuno

发明人： Masayuki Yamamoto ,  Chouhei Okuno

IPC分类号： H05K3/00 ,  B32B37/02 ,  B32B37/12 ,  B32B37/14

CPC分类号： H01L21/67132 ,  Y10T156/10 ,  Y10T156/12

摘要： A frame transport unit places a ring frame on a frame holding section of a holding table, and a holding arm suspendingly holds a protection sheet to place it on a wafer holding table. The holding arm suction-holds a wafer to place it on the protection sheet such that a circuit surface of the wafer is directed downward. An adhesive tape is joined to the wafer and the ring frame suction-held via the protection sheet.

摘要翻译： 框架传送单元将框架放置在保持台的框架保持部上，并且保持臂悬挂地保持保护片以将其放置在晶片保持台上。 保持臂抽吸 - 保持晶片将其放置在保护片上，使得晶片的电路表面指向下方。 胶带与晶片接合，环形框架通过保护片吸住。

公开(公告)号：US20110120641A1

公开(公告)日：2011-05-26

申请号：US12911813

申请日：2010-10-26

申请人： Masayuki Yamamoto ,  Chouhei Okuno

发明人： Masayuki Yamamoto ,  Chouhei Okuno

IPC分类号： B29C65/00 ,  B32B38/04

CPC分类号： H01L21/67132 ,  Y10T156/12

摘要： Upper and lower housings nip a supporting adhesive tape that is exposed between an outer periphery of a wafer and a ring frame, thereby forming a chamber. Here, the adhesive tape having a larger width than a diameter of the ring frame divides the chamber into the upper and lower housings to form two spaces. Pressure difference occurs between both spaces such that the lower housing has a reduced pressure than the upper housing for joining the adhesive tape to the wafer.

摘要翻译： 上部和下部壳体夹持在晶片的外周和环形框架之间露出的支撑胶带，从而形成一个室。 这里，具有比环形框架的直径大的宽度的胶带将室分成上下壳体以形成两个空间。 在两个空间之间产生压力差，使得下部壳体具有比上部壳体减小的压力，用于将粘合带连接到晶片。

公开(公告)号：US09159598B2

公开(公告)日：2015-10-13

申请号：US13454477

申请日：2012-04-24

申请人： Masayuki Yamamoto ,  Chouhei Okuno

发明人： Masayuki Yamamoto ,  Chouhei Okuno

IPC分类号： B29C65/50 ,  H01L21/67

CPC分类号： H01L21/67132 ,  B29C65/50

摘要： A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

摘要翻译： 工件从晶片接收容器卸载。 第一识别传感器检测工件的前表面，并且确定半导体晶片或间隔件是工件。 在工件是晶片的情况下，第一鉴别传感器还确定保护带是否在工件的前表面上。 在确定保护带不在前表面上的情况下，第二鉴别传感器检测晶片的背面，以鉴别保护带的存在与否。

公开(公告)号：US20120090763A1

公开(公告)日：2012-04-19

申请号：US13274394

申请日：2011-10-17

申请人： Chouhei Okuno ,  Masayuki Yamamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/6838 ,  Y10T156/1105 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/15 ,  Y10T156/1906 ,  Y10T156/1944 ,  Y10T156/1978

摘要： A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

摘要翻译： 第一保持台吸附保持在其后表面上的晶片的环形突起以围绕后研磨区域。 具有与环形突起的内壁相邻的外周壁的第二保持台插入到环形突起内的平坦部分中，用于将分离的粘合带连接到晶片的表面上的保护带，同时 平坦部分是抽吸的。 此后，胶带被分离。 因此，粘合带与保护带一起与晶片的表面分离。

公开(公告)号：US07922857B2

公开(公告)日：2011-04-12

申请号：US12252249

申请日：2008-10-15

申请人： Chouhei Okuno ,  Masayuki Yamamoto

发明人： Chouhei Okuno ,  Masayuki Yamamoto

IPC分类号： B65C9/26

CPC分类号： B65C9/1884 ,  Y10T156/17

摘要： A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a state where part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label.

摘要翻译： 接收器底座从标签的从剥离纸的折回部分向前馈送的前端部分的下方接收并向下延伸，使得标签保持在预定的向前和向下倾斜的姿势。 在将标签的后端的一部分接合并保持在剥离纸上的状态下分离和供给标签的过程中，具有向前和向下倾斜的向下吸引表面的吸头接近于 标签的顶表面被分离以吸取标签。