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公开(公告)号：US07289328B2
公开(公告)日：2007-10-30
申请号：US11021500
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译： 实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。 示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。 第二部分具有动力系统和散热装置。 散热装置具有多个延伸部，电力系统具有多个通过孔。 当多个延伸部延伸穿过电力系统的多个通孔并且通过设置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。
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公开(公告)号：US07072185B1
公开(公告)日：2006-07-04
申请号：US11021527
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/189 , G06F1/20 , H01L23/3677 , H01L2924/0002 , H05K1/0204 , H05K1/0263 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
摘要翻译： 实施例包括用于具有至少一个通过孔的系统板的电子模块的装置，方法和系统。 可连接到具有通孔的系统板的示例性电子模块包括耦合到系统板的一侧的第一部分。 第一部分具有多个处理器的印刷电路板（PCB）。 电子模块的第二部分耦合到系统板的第二相对侧。 第二部分具有电耦合到第一部分的电力系统板。 第二部分还包括延伸穿过系统板的通孔的散热装置。
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公开(公告)号：US07280364B2
公开(公告)日：2007-10-09
申请号：US10996722
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/184 , G06F1/185 , G06F1/20 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
摘要翻译： 一个实施例包括具有耦合到第二PCB的第一印刷电路板（PCB）的电子组件。 第二PCB具有至少两个处理器并且设置在第一PCB上方。 散热装置设置在第二PCB的上方，从两个处理器散热，并提供一个气流路径。 电力系统与散热装置相邻并且在气流路径的路径中。
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公开(公告)号：US07327569B2
公开(公告)日：2008-02-05
申请号：US11011328
申请日：2004-12-13
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/189 , G06F1/20 , H01L25/105 , H01L25/162 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译： 实施例包括用于系统板的处理器模块的装置，方法和系统。 电子模块可拆卸地连接到系统板。 电子模块具有第一和第二部分。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置在处理器和系统板之间延伸。 第二部分连接在第一部分的顶部，并且具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。
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公开(公告)号：US07791889B2
公开(公告)日：2010-09-07
申请号：US11059189
申请日：2005-02-16
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H05K1/0203 , H05K1/0262 , H05K1/0263 , H05K2201/0979 , H05K2201/10545 , H05K2201/10689 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.
摘要翻译： 一个实施例包括具有第一印刷电路板（PCB）和第二PCB的电子组件。 第二PCB具有至少两个处理器，并且耦合到并布置在第一PCB的第一侧上。 散热装置将散热物从处理器中散出。 第一和第二功率模块耦合到第一PCB的第二侧并且布置在第一PCB的第二侧上，第一和第二功率模块为第二PCB上的两个处理器提供冗余电力。
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公开(公告)号：US07280365B2
公开(公告)日：2007-10-09
申请号：US11061156
申请日：2005-02-18
申请人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H05K1/0203 , H05K1/0263 , H05K2201/066 , H05K2201/0979 , H05K2201/10189
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
摘要翻译： 一个实施例包括具有第一印刷电路板（PCB）和具有至少两个处理器的第二PCB的电子组件。 第二PCB耦合到并设置在第一PCB上方。 散热装置将散热物从处理器中散出。 第一和第二电源模块向第二PCB提供电源，并且是分离的和冗余的电源，使得在第一电源模块故障时，第二电源模块可为两个电源模块向第二个PCB提供电力。
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公开(公告)号：US07064955B2
公开(公告)日：2006-06-20
申请号：US10996477
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/184 , G06F1/185 , G06F1/20 , G06F1/263 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K2201/0979 , H05K2201/10189 , H05K2201/1056 , Y10T307/505 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.
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公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07254027B2
公开(公告)日：2007-08-07
申请号：US11021504
申请日：2004-12-21
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译： 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。
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