公开(公告)号：US20100220450A1

公开(公告)日：2010-09-02

申请号：US12778456

申请日：2010-05-12

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H05K1/00

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US07829390B2

公开(公告)日：2010-11-09

申请号：US12292497

申请日：2008-11-20

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件，以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US20100123238A1

公开(公告)日：2010-05-20

申请号：US12292497

申请日：2008-11-20

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/50 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件，以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US20100055840A1

公开(公告)日：2010-03-04

申请号：US12230531

申请日：2008-08-29

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H05K1/144 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/187 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/403 ,  H05K2203/1316 ,  H01L2924/00

摘要： A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved.

公开(公告)号：US07960847B2

公开(公告)日：2011-06-14

申请号：US12778456

申请日：2010-05-12

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L23/28 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件，以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US07953375B2

公开(公告)日：2011-05-31

申请号：US12149411

申请日：2008-05-01

申请人： Chung-Er Huang ,  Sheng-Wen Chen

发明人： Chung-Er Huang ,  Sheng-Wen Chen

IPC分类号： H04B1/44

CPC分类号： H01Q1/243 ,  H01Q21/30

摘要： A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path.

摘要翻译： 提供了一种具有用于处理第一RF信号的双重系统和属于不同通信系统的第二RF信号的通信模块。 通信模块包括第一连接端口和信号分配电路。 第一连接端口耦合到外部电路，并且信号分配电路耦合到第一连接端口，并且在通信模块内部的第一系统路径和第二系统路径之间。 无论外部电路是由双频天线还是由两个单频天线组成，信号分配电路控制沿着第一连接端口和第一系统路径之间的路径传输的第一RF信号，并控制第二RF信号发送 沿着第一连接端口和第二系统路径之间的路径之间的路径。

公开(公告)号：US07680615B2

公开(公告)日：2010-03-16

申请号：US12010454

申请日：2008-01-25

申请人： Chung-Er Huang ,  Chih-Hao Liao

发明人： Chung-Er Huang ,  Chih-Hao Liao

IPC分类号： G01D18/00 ,  G06F7/38

CPC分类号： G01R31/2834 ,  G01R31/2822 ,  G01R31/3193

摘要： A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved.

摘要翻译： 具有共享金色校准表的并行测试系统包括：存储单元，多个测试平台和服务器。 存储单元用于存储金色校准表，测试平台用于分别使用金色校准表来测试待测器件（DUT）。 服务器连接到存储单元和测试平台，将黄金校准表发送到测试平台，然后累积记录测试平台后产生的校准数据，分别测试DUT，使服务器进一步执行加权 对校准数据进行算术运算，以更新黄金校准表。 因此，可以实现加速金色校准表的收敛速度的目的。

公开(公告)号：US20090179327A1

公开(公告)日：2009-07-16

申请号：US12007716

申请日：2008-01-15

申请人： Chung-Er Huang ,  Chih-Hao Liao

发明人： Chung-Er Huang ,  Chih-Hao Liao

IPC分类号： H01L23/488 ,  H01L21/58

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14

摘要： A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing.

摘要翻译： 一种应用于表面安装工艺的包装结构，包括：具有包装表面的芯片模块; 以及形成在芯片模块的封装表面上的预固化层。 如上所述，该结构用于保护晶片的外表面。 预固化层通过对胶合材料进行预固化而形成，并且胶合材料均匀地填充在包装表面上的连接突起之间的空间。 预固化后的是在将连接突起安装到基板上的连接过程中后固化，从而提高连接强度。 此外，包装过程的速度也在增加。

公开(公告)号：US20090051044A1

公开(公告)日：2009-02-26

申请号：US11987147

申请日：2007-11-28

申请人： Chung-Er Huang ,  Yueh-Cheng Lee

发明人： Chung-Er Huang ,  Yueh-Cheng Lee

IPC分类号： H01L23/31 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer-level packaging method is shown below: providing an un-cut wafer having a front side and a back side. A plurality of cutting lines is formed on the front side of the wafer so as to define the positions of each chip module such as a wireless module. The next step is providing an extendible film attached onto the back side of the wafer. Next is dicing the wafer along the cutting line to separate each chip module and expending the extendible film so that a gap is formed between each chip module. At last, filling a packaging compound onto the front side and the lateral side of the chip module produces a packaged structure. As mentioned above, the structure is employed for protecting the external surface of the chip.

摘要翻译： 晶片级封装方法如下所示：提供具有正面和背面的未切割晶片。 多个切割线形成在晶片的前侧，以便限定诸如无线模块的每个芯片模块的位置。 下一步是提供附着在晶片背面的可延伸膜。 接下来，沿着切割线切割晶片以分离每个芯片模块并且扩展可扩展膜，使得在每个芯片模块之间形成间隙。 最后，将包装化合物填充到芯片模块的前侧和侧面产生封装结构。 如上所述，该结构用于保护芯片的外表面。

公开(公告)号：US20090137217A1

公开(公告)日：2009-05-28

申请号：US11987026

申请日：2007-11-27

申请人： Chung-Er Huang ,  Sheng-Wen Chen

发明人： Chung-Er Huang ,  Sheng-Wen Chen

IPC分类号： H04B1/04

CPC分类号： H03F3/24 ,  H03F2200/465 ,  H04B2001/0416

摘要： A communication transmission system is applied to an application device and includes a power detection circuit, and a radio frequency module. The power detection circuit is used for detecting the power on the output port of the communication transmission system, and for producing a feedback signal. The radio frequency module is connected to the power detection circuit for receiving the feedback signal so as to adjust its output power. In addition, the power detection circuit is built to be independent of the RF module for directly detecting the power on the output port of the communication transmission system which represents the actual power of the application device, thereby achieving the purpose of outputting a more stable and accurate output power through the RF module.

摘要翻译： 通信传输系统应用于应用设备，并且包括功率检测电路和射频模块。 功率检测电路用于检测通信传输系统的输出端口的电力，并用于产生反馈信号。 射频模块连接到功率检测电路，用于接收反馈信号，以调整其输出功率。 此外，功率检测电路被构建为独立于RF模块，用于直接检测表示应用设备的实际功率的通信传输系统的输出端口上的电源，从而实现输出更稳定和 通过RF模块精确输出功率。