DOUBLE PATTERNING METHOD USING TILT-ANGLE DEPOSITION
    1.
    发明申请
    DOUBLE PATTERNING METHOD USING TILT-ANGLE DEPOSITION 有权
    使用倾斜角沉积的双重图案方法

    公开(公告)号:US20130023121A1

    公开(公告)日:2013-01-24

    申请号:US13188248

    申请日:2011-07-21

    IPC分类号: H01L21/306 G03F7/34 G03F7/16

    CPC分类号: H01L21/0272 G03F7/0035

    摘要: Methods for patterning material layers, which may be implemented in forming integrated circuit device features, are disclosed. In an example, a method includes forming a first resist layer over a material layer; forming a second resist layer over the first resist layer; forming an opening that extends through the second resist layer and the first resist layer to expose the material layer, wherein the opening has a substantially constant width in the second resist layer and a tapered width in the first resist layer; and performing a tilt-angle deposition process to form a feature over the exposed material layer.

    摘要翻译: 公开了可以在形成集成电路器件特征中实现的图案化材料层的方法。 在一个实例中,一种方法包括在材料层上形成第一抗蚀剂层; 在所述第一抗蚀剂层上形成第二抗蚀剂层; 形成延伸穿过所述第二抗蚀剂层和所述第一抗蚀剂层以暴露所述材料层的开口,其中所述开口在所述第二抗蚀剂层中具有基本上恒定的宽度,并且所述第一抗蚀剂层中具有锥形宽度; 以及进行倾斜角淀积处理以在所述暴露的材料层上形成特征。

    Double patterning method using tilt-angle deposition
    2.
    发明授权
    Double patterning method using tilt-angle deposition 有权
    使用倾斜角沉积的双重图案化方法

    公开(公告)号:US08709267B2

    公开(公告)日:2014-04-29

    申请号:US13188248

    申请日:2011-07-21

    IPC分类号: H01L21/302

    CPC分类号: H01L21/0272 G03F7/0035

    摘要: Methods for patterning material layers, which may be implemented in forming integrated circuit device features, are disclosed. In an example, a method includes forming a first resist layer over a material layer; forming a second resist layer over the first resist layer; forming an opening that extends through the second resist layer and the first resist layer to expose the material layer, wherein the opening has a substantially constant width in the second resist layer and a tapered width in the first resist layer; and performing a tilt-angle deposition process to form a feature over the exposed material layer.

    摘要翻译: 公开了可以在形成集成电路器件特征中实现的图案化材料层的方法。 在一个实例中,一种方法包括在材料层上形成第一抗蚀剂层; 在所述第一抗蚀剂层上形成第二抗蚀剂层; 形成延伸穿过所述第二抗蚀剂层和所述第一抗蚀剂层以暴露所述材料层的开口,其中所述开口在所述第二抗蚀剂层中具有基本上恒定的宽度,并且所述第一抗蚀剂层中具有锥形宽度; 以及进行倾斜角淀积处理以在所述暴露的材料层上形成特征。

    Multi-nanometer-projection apparatus for lithography, oxidation, inspection, and measurement
    3.
    发明授权
    Multi-nanometer-projection apparatus for lithography, oxidation, inspection, and measurement 有权
    用于光刻,氧化,检查和测量的多纳米投影设备

    公开(公告)号:US08624338B2

    公开(公告)日:2014-01-07

    申请号:US13101443

    申请日:2011-05-05

    申请人: Fei-Gwo Tsai Chwen Yu

    发明人: Fei-Gwo Tsai Chwen Yu

    IPC分类号: H01L29/82

    摘要: An apparatus, method for manufacturing the apparatus, and method for processing a substrate using the apparatus are disclosed. An exemplary apparatus includes a substrate having a plurality of cells, wherein each cell includes a cell structure. The cell structure includes a piezoelectric film portion and a tip disposed over the piezoelectric film portion. The tip is physically coupled with the piezoelectric film portion.

    摘要翻译: 公开了一种用于制造该设备的设备,方法和使用该设备处理衬底的方法。 示例性装置包括具有多个单元的基板,其中每个单元包括单元结构。 电池结构包括压电膜部分和设置在压电膜部分上的尖端。 尖端与压电膜部分物理耦合。

    MULTI-NANOMETER-PROJECTION APPARATUS FOR LITHOGRAPHY, OXIDATION, INSPECTION, AND MEASUREMENT
    4.
    发明申请
    MULTI-NANOMETER-PROJECTION APPARATUS FOR LITHOGRAPHY, OXIDATION, INSPECTION, AND MEASUREMENT 有权
    用于石墨切割,氧化,检验和测量的多纳米投影仪

    公开(公告)号:US20120280333A1

    公开(公告)日:2012-11-08

    申请号:US13101443

    申请日:2011-05-05

    申请人: Fei-Gwo Tsai Chwen Yu

    发明人: Fei-Gwo Tsai Chwen Yu

    IPC分类号: H01L29/84 H01L41/22

    摘要: An apparatus, method for manufacturing the apparatus, and method for processing a substrate using the apparatus are disclosed. An exemplary apparatus includes a substrate having a plurality of cells, wherein each cell includes a cell structure. The cell structure includes a piezoelectric film portion and a tip disposed over the piezoelectric film portion. The tip is physically coupled with the piezoelectric film portion.

    摘要翻译: 公开了一种用于制造该设备的设备,方法和使用该设备处理衬底的方法。 示例性装置包括具有多个单元的基板,其中每个单元包括单元结构。 电池结构包括压电膜部分和设置在压电膜部分上的尖端。 尖端与压电膜部分物理耦合。

    Hybrid multi-layer mask
    5.
    发明授权
    Hybrid multi-layer mask 有权
    混合多层面膜

    公开(公告)号:US08003281B2

    公开(公告)日:2011-08-23

    申请号:US12250338

    申请日:2008-10-13

    IPC分类号: G03F1/00

    CPC分类号: G03F1/00

    摘要: A hybrid mask set for exposing a plurality of layers on a semiconductor substrate to create an integrated circuit device is disclosed. The hybrid mask set includes a first group of one or more multi-layer masks (MLMs) for a first subset of the plurality of layers. Each MLM includes a plurality of different images for different layers, the images being separated by a relatively wide image spacer. The hybrid mask set also includes a first group of one or more production-ready masks for a second subset of the plurality of layers. Each production-ready mask includes a plurality of similar images for a common layer, each image being separated by a relatively narrow scribe street.

    摘要翻译: 公开了一种用于暴露半导体衬底上的多个层以形成集成电路器件的混合掩模组。 混合掩模集合包括用于多个层的第一子集的一个或多个多层掩模(MLM)的第一组。 每个MLM包括用于不同层的多个不同图像,该图像被相对较宽的图像间隔物隔开。 混合掩模集合还包括用于多个层的第二子集的第一组一个或多个生产就绪掩模。 每个生产就绪掩模包括用于公共层的多个相似图像,每个图像由相对狭窄的划线路分隔开。

    Method of the adjustable matching map system in lithography

    公开(公告)号:US07160654B2

    公开(公告)日:2007-01-09

    申请号:US10725810

    申请日:2003-12-02

    申请人: Fei-Gwo Tsai

    发明人: Fei-Gwo Tsai

    IPC分类号: G03C5/00 G03F9/00

    CPC分类号: G03F7/70633 G03F7/0035

    摘要: A method is provided for improving layer to layer overlay of a second layer pattern on a first layer pattern formed in a substrate. A plurality of first reference marks is placed inside a pattern area on a first layer mask which is used to form the first layer pattern. A plurality of second reference marks is placed on a second layer mask which is used to form the second layer pattern and in which one second reference mark is matched with a first reference mark having the same (x,y) coordinates. Reference mark placement in the resulting first and second layer patterns is determined by metrology to determine an x-deviation and a y-deviation for each matched pair of reference marks. A correction algorithm is then used to calculate adjustments in exposure tool settings for improved overlay of the second layer pattern on the first layer pattern in subsequent exposures.

    Method of a floating pattern loading system in mask dry-etching critical dimension control
    7.
    发明申请
    Method of a floating pattern loading system in mask dry-etching critical dimension control 有权
    掩模干蚀刻临界尺寸控制中浮动图案加载系统的方法

    公开(公告)号:US20050089765A1

    公开(公告)日:2005-04-28

    申请号:US10694426

    申请日:2003-10-27

    IPC分类号: G03C5/00 G03F1/14 G03F9/00

    CPC分类号: G03F1/80 G03F1/36

    摘要: The invention calculates an optimum etch recipe for etching a product pattern in an opaque material of a photolithographic exposure mask with the objective of achieving optimum CD performance of the product pattern. If, for this optimum etch recipe, the optimum CD performance cannot be achieved, dummy patterns are added to the mask that is used to etch the opaque material. If this latter approach still cannot achieve optimum CD performance, the product pattern to which the dummy pattern has been added is separated into two patterns such that one of these two patterns provides a Cr loading that assures optimum CD performance of the product pattern.

    摘要翻译: 本发明计算用于蚀刻光刻曝光掩模的不透明材料中的产品图案的最佳蚀刻配方,目的是实现产品图案的最佳CD性能。 如果对于该最佳蚀刻配方,无法实现最佳的CD性能,则将虚拟图案添加到用于蚀刻不透明材料的掩模中。 如果后一种方法仍然不能实现最佳的CD性能,则将虚拟图案添加到其中的产品图案被分成两种图案,使得这两种图案中的一种提供了Cr加载,以确保产品图案的最佳CD性能。

    Dark line CD and XY-CD improvement method of the variable shaped beam lithography in mask or wafer making
    8.
    发明授权
    Dark line CD and XY-CD improvement method of the variable shaped beam lithography in mask or wafer making 有权
    可变形光束光刻在掩模或晶圆制造中的暗线CD和XY-CD改进方法

    公开(公告)号:US06799312B1

    公开(公告)日:2004-09-28

    申请号:US09584428

    申请日:2000-06-05

    IPC分类号: G06F1750

    摘要: This invention provides a method of using an electron beam exposure system having an electron beam with a variable shape to form patterns in a layer of resist on a substrate, a mask substrate or an integrated circuit wafer, while maintaining adequate critical dimension control and beam stability. This is accomplished by setting the electron beam to a fixed square beam with a width set to provide optimum XY critical dimension control for exposing a frame pattern surrounding the original pattern. The frame pattern has a width of a first distance and surrounds the outer perimeter of the original pattern. This provides optimum XY critical dimension control at the outer perimeter of the original pattern. The remainder of the exposure field, which is the exposure field with the original pattern and the frame pattern subtracted away is exposed using an electron beam having a variable size and shape. In one embodiment the exposure of the frame pattern is completed before the exposure of the remainder pattern is carried out. Alternatively, the exposure of the remainder pattern can be completed before the exposure of the frame pattern is carried out. The digital design data for the frame pattern and the remainder of the exposure field is formed using a computer processor and the original design data.

    摘要翻译: 本发明提供一种使用具有可变形状的电子束的电子束曝光系统的方法,以在基板,掩模基板或集成电路晶片上的抗蚀剂层中形成图案,同时保持适当的临界尺寸控制和光束稳定性 。 这是通过将电子束设置为具有设置的宽度的固定方波来实现的,以提供用于曝光围绕原始图案的帧图案的最佳XY临界尺寸控制。 框架图案具有第一距离的宽度并且围绕原始图案的外周边。 这在原始图案的外围提供了最佳的XY临界尺寸控制。 使用具有可变尺寸和形状的电子束来曝光曝光场的剩余部分,其中原始图案和帧图案的曝光场被减去。 在一个实施例中,在执行余下图案的曝光之前完成帧图案的曝光。 或者,可以在执行帧图案的曝光之前完成余数图案的曝光。 使用计算机处理器和原始设计数据形成帧图案的数字设计数据和曝光场的其余部分。

    MULTIPLE TECHNOLOGY NODE MASK
    9.
    发明申请
    MULTIPLE TECHNOLOGY NODE MASK 有权
    多技术节点掩码

    公开(公告)号:US20110113389A1

    公开(公告)日:2011-05-12

    申请号:US13007048

    申请日:2011-01-14

    IPC分类号: G06F17/50

    CPC分类号: G03F1/00

    摘要: A method of fabricating a mask set is provided. The method includes providing mask data associated with a plurality of mask layers. The mask data includes a first pattern associated with a first technology node and a second pattern associated with a second technology node. The method continues with determining to form a multi-technology node mask (MTM) for a first mask layer of the plurality of mask layers. The MTM for the first mask layer is formed, which includes features associated with the first pattern and features associated with the second pattern.

    摘要翻译: 提供了一种制造掩模组的方法。 该方法包括提供与多个掩模层相关联的掩模数据。 掩模数据包括与第一技术节点相关联的第一模式和与第二技术节点相关联的第二模式。 该方法继续确定以形成多个掩模层中的第一掩模层的多技术节点掩码(MTM)。 形成第一掩模层的MTM,其包括与第一图案相关联的特征和与第二图案相关联的特征。

    HYBRID MULTI-LAYER MASK
    10.
    发明申请
    HYBRID MULTI-LAYER MASK 有权
    混合多层面膜

    公开(公告)号:US20100047698A1

    公开(公告)日:2010-02-25

    申请号:US12250338

    申请日:2008-10-13

    IPC分类号: G03F1/14 H01L21/027 G03F7/20

    CPC分类号: G03F1/00

    摘要: A hybrid mask set for exposing a plurality of layers on a semiconductor substrate to create an integrated circuit device is disclosed. The hybrid mask set includes a first group of one or more multi-layer masks (MLMs) for a first subset of the plurality of layers. Each MLM includes a plurality of different images for different layers, the images being separated by a relatively wide image spacer. The hybrid mask set also includes a first group of one or more production-ready masks for a second subset of the plurality of layers. Each production-ready mask includes a plurality of similar images for a common layer, each image being separated by a relatively narrow scribe street.

    摘要翻译: 公开了一种用于暴露半导体衬底上的多个层以形成集成电路器件的混合掩模组。 混合掩模集合包括用于多个层的第一子集的一个或多个多层掩模(MLM)的第一组。 每个MLM包括用于不同层的多个不同图像,该图像被相对较宽的图像间隔物隔开。 混合掩模集合还包括用于多个层的第二子集的第一组一个或多个生产就绪掩模。 每个生产就绪掩模包括用于公共层的多个相似图像,每个图像由相对狭窄的划线路分隔开。