MULTI-CHANNEL OPTICAL RECEIVER OR TRANSMITTER WITH A BALL LENS
    2.
    发明申请
    MULTI-CHANNEL OPTICAL RECEIVER OR TRANSMITTER WITH A BALL LENS 有权
    多通道光接收器或发射器与球镜

    公开(公告)号:US20160308622A1

    公开(公告)日:2016-10-20

    申请号:US14687702

    申请日:2015-04-15

    IPC分类号: H04B10/60

    CPC分类号: H04B10/676 G02B6/2938

    摘要: Embodiments herein describe an optical receiver that demultiplexes a multi-wavelength optical signal into a plurality of optical signals with respective wavelengths. Stated differently, the various wavelengths in the received optical signal are separated into different optical signals with different wavelengths. In one embodiment, the optical receiver includes a plurality of optical filters that is aligned with a mirror to perform the demultiplexing function. The embodiments herein disclose optical receivers where the optical components performing the demultiplexing function using a ball lens aligned with optical filters.

    摘要翻译: 本文的实施例描述了一种光接收机,其将多波长光信号解复用为具有相应波长的多个光信号。 换句话说,接收到的光信号中的各种波长被分成具有不同波长的不同光信号。 在一个实施例中,光接收器包括与反射镜对准的多个光学滤波器以执行解复用功能。 本文的实施例公开了光接收器,其中光学部件使用与光学滤光器对准的球透镜来执行解复用功能。

    PASSIVE ALIGNMENT WITH OPTICAL FIBERS USING FERRULE MEMBER

    公开(公告)号:US20170285270A1

    公开(公告)日:2017-10-05

    申请号:US15087667

    申请日:2016-03-31

    IPC分类号: G02B6/30 G02B6/36

    摘要: Embodiments described herein include an apparatus for passive alignment of one or more optical fibers with photonic circuitry. Generally, the apparatus includes a substrate that defines a channel configured to receive an engagement portion of a ferrule member. The apparatus further includes deformable and/or non-deformable members within the channel that form alignment faces arranged at opposite ends of the channel. The alignment faces can deform and/or limit the movement of the engagement portion of the ferrule member in order to align the optical fibers along a first dimension. A top surface of the substrate may be configured to engage with one or more lateral surfaces of the ferrule member when the engagement portion is received into the channel, thereby aligning the optical fibers along a second dimension.

    OPTICAL BENCH FOR ALIGNING AN OPTICAL DEVICE
    4.
    发明申请
    OPTICAL BENCH FOR ALIGNING AN OPTICAL DEVICE 有权
    用于对准光学设备的光学底板

    公开(公告)号:US20160306118A1

    公开(公告)日:2016-10-20

    申请号:US14689952

    申请日:2015-04-17

    IPC分类号: G02B6/36 G02B6/32 G02B6/42

    摘要: An optical device may include an optical bench used align a photonic chip to a receptacle. In one embodiment, a surface of the optical bench defines an alignment plane. When a fiber stub in the receptacle is disposed on the surface, an optical path in the stub is parallel with the alignment plane. By disposing the photonic chip on the same surface, the chip and the stub can be aligned such that optical signals can be transmitted between the stub and an optical component (e.g., light source or waveguide) in the photonic chip. In one embodiment, the optical path in the stub and the optical component may have the same height relative to the optical bench. Moreover, the optical device may include a direct thermal connection between the assembly and the heat sink, and thus, have better thermal coupling relative to using thermal pads

    摘要翻译: 光学装置可以包括使光子芯片与插座对准的光学工作台。 在一个实施例中,光学平台的表面限定了对准平面。 当容器中的纤维短截线设置在表面上时,短截线中的光路与对准平面平行。 通过将光子芯片布置在相同的表面上,芯片和短截线可以对准,使得光信号可以在光纤芯片中的短截线和光学部件(例如,光源或波导)之间传输。 在一个实施例中,短截线中的光路和光学部件可以具有相对于光学台的相同的高度。 此外,光学装置可以包括组件和散热器之间的直接热连接,并且因此相对于使用热垫具有更好的热耦合

    OPTICAL TRANSMITTER WITH LINEAR ARRANGMENT AND STACKED LASER PACKAGE AND RF PATH
    5.
    发明申请
    OPTICAL TRANSMITTER WITH LINEAR ARRANGMENT AND STACKED LASER PACKAGE AND RF PATH 有权
    具有线性布置和堆叠激光封装和射频路径的光学发射器

    公开(公告)号:US20160112137A1

    公开(公告)日:2016-04-21

    申请号:US14517414

    申请日:2014-10-17

    IPC分类号: H04B10/50 H04B10/516

    摘要: Described herein is an optical transmitter that includes an RF signal path that is, at least partially, parallel with an optical signal path. In one embodiment, an electrical transmission element, which defines the RF signal path, is disposed between a laser emitting the optical signal and a side wall of a package containing the optical transmitter. Although the RF and optical signals may propagate along different planes within the optical transmitter, both signals are received at an optical modulator. Using the RF signal, the optical modulator modulates the optical signal (e.g., a continuous wave) to generate a modulated optical signal. The optical modulator then outputs the modulated signal to a receptacle coupled to a light carrying medium such as a fiber optic cable.

    摘要翻译: 这里描述的是一种光发射机,其包括至少部分地平行于光信号路径的RF信号路径。 在一个实施例中,限定RF信号路径的电传输元件设置在发射光信号的激光器和包含光发射器的封装的侧壁之间。 尽管RF和光信号可能沿着光发射机内的不同平面传播,但两个信号都在光调制器处被接收。 使用RF信号,光调制器调制光信号(例如,连续波)以产生调制的光信号。 然后光调制器将调制信号输出到耦合到诸如光纤电缆之类的载光介质的插座。

    DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES
    6.
    发明申请
    DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES 审中-公开
    直接打印电路路由到堆叠的光电IC封装

    公开(公告)号:US20160109668A1

    公开(公告)日:2016-04-21

    申请号:US14517477

    申请日:2014-10-17

    IPC分类号: G02B6/42 G02F1/01

    摘要: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.

    摘要翻译: 光发射机可以包括芯片堆叠,其包括使用焊球安装到光子芯片的电IC。 这些焊接连接允许电子IC和光子芯片通信。 此外,发射机可以包括耦合到堆叠的PCB,使得PCB中的电信号被传输到IC和光子芯片(反之亦然)。 代替使用连接到光子芯片的表面上的焊盘的引线键将PCB耦合到堆叠,PCB的至少一部分设置在光子芯片和电气IC之间。 PCB还可以包括用于形成与电IC的直接焊接连接的接合焊盘。 因此,电IC可以包括与PCB和光子芯片两者的直接焊接连接。