OPTICAL TRANSMITTER WITH LINEAR ARRANGMENT AND STACKED LASER PACKAGE AND RF PATH
    3.
    发明申请
    OPTICAL TRANSMITTER WITH LINEAR ARRANGMENT AND STACKED LASER PACKAGE AND RF PATH 有权
    具有线性布置和堆叠激光封装和射频路径的光学发射器

    公开(公告)号:US20160112137A1

    公开(公告)日:2016-04-21

    申请号:US14517414

    申请日:2014-10-17

    Abstract: Described herein is an optical transmitter that includes an RF signal path that is, at least partially, parallel with an optical signal path. In one embodiment, an electrical transmission element, which defines the RF signal path, is disposed between a laser emitting the optical signal and a side wall of a package containing the optical transmitter. Although the RF and optical signals may propagate along different planes within the optical transmitter, both signals are received at an optical modulator. Using the RF signal, the optical modulator modulates the optical signal (e.g., a continuous wave) to generate a modulated optical signal. The optical modulator then outputs the modulated signal to a receptacle coupled to a light carrying medium such as a fiber optic cable.

    Abstract translation: 这里描述的是一种光发射机,其包括至少部分地平行于光信号路径的RF信号路径。 在一个实施例中,限定RF信号路径的电传输元件设置在发射光信号的激光器和包含光发射器的封装的侧壁之间。 尽管RF和光信号可能沿着光发射机内的不同平面传播,但两个信号都在光调制器处被接收。 使用RF信号,光调制器调制光信号(例如,连续波)以产生调制的光信号。 然后光调制器将调制信号输出到耦合到诸如光纤电缆之类的载光介质的插座。

    DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES
    4.
    发明申请
    DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES 审中-公开
    直接打印电路路由到堆叠的光电IC封装

    公开(公告)号:US20160109668A1

    公开(公告)日:2016-04-21

    申请号:US14517477

    申请日:2014-10-17

    Abstract: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.

    Abstract translation: 光发射机可以包括芯片堆叠,其包括使用焊球安装到光子芯片的电IC。 这些焊接连接允许电子IC和光子芯片通信。 此外,发射机可以包括耦合到堆叠的PCB,使得PCB中的电信号被传输到IC和光子芯片(反之亦然)。 代替使用连接到光子芯片的表面上的焊盘的引线键将PCB耦合到堆叠,PCB的至少一部分设置在光子芯片和电气IC之间。 PCB还可以包括用于形成与电IC的直接焊接连接的接合焊盘。 因此,电IC可以包括与PCB和光子芯片两者的直接焊接连接。

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