摘要:
An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.
摘要:
A first one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer beneath a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench. A second one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer formed in a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a first dielectric material lining the interior surface and a second dielectric material filling the lined trench. The second logic element further comprises a dielectric layer formed over a portion of the first layer and contacting the first dielectric material lining the trench at a merge location; and an electrode extending over a portion of both the dielectric layer and the filled trench. The second logic element is configured so that a predetermined voltage or higher applied between the electrode and the first layer causes a breakdown near the merge location.
摘要:
A differential receiver for sensing small input voltage swings by using a built in reference voltage obtained by a difference in threshold voltage between a differential pair of closely spaced transistors. The difference in threshold voltage can be produced by different values of ion implantation of the gates of the transistor pair with the same material, or by dosages using different materials. The difference in threshold voltage can also be obtained by using different transistor channel lengths. The threshold voltages can also be modulated by the control of the transistor substrate voltages using a voltage control substrate means.
摘要:
A processor with a memory send/received control circuit including a bus drive circuit and a detector circuit connected via control bus line to the control input of the memory. A data input line, or output line, or data input/output line is connected between the processor and the memory. A transmission line stub having a length that is incrementally variable is connected to the memory control input side of the control line 14. The impedance Z0 of the transmission line stub is equal to that of the control line and is open circuited at the end which results in voltage doubling to achieve high speed synchronization between control signals and data signals and to ensure valid data at high clock rates.
摘要:
A very low power logic circuit family which advantageously provides 1) retained high performance, 2) significantly reduced power dissipation, and 3) enhanced noise immunity. In a first set of embodiments, dual rail complementary logic signals are utilized to improve circuit immunity to external noise and to reduce noise generated by the logic circuit itself. A receiver portion of the present invention comprises two input FETs having cross coupling of the two gates to the two sources. In one preferred embodiment, both receiver and driver portions are connected in a repeater with all N channel drivers. A second set of embodiments have a single sided input in an unbalanced receiver comprising cross coupled source to gate N channel and cross coupled drain to gate P channel output transistors.
摘要:
Method for forming a first one time, voltage programmable logic element in a semiconductor substrate of first conductivity type, forming a first layer beneath a surface of the substrate, the first layer having a second conductivity type. A trench is formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench.
摘要:
Methods and apparatus for blowing and sensing antifuses are provided. Specifically, in a first aspect, a method is provided for changing the state of one of a plurality of antifuses by selecting one of the bank of antifuses and applying a high voltage to change the state of the selected antifuse. In second and third aspects, apparatus are provided for performing the method of the first aspect. In a fourth aspect, a method is provided for boosting a voltage that includes the steps of generating a first voltage within a first stage storage mechanism of a first stage voltage booster circuit, generating a second voltage equaling about twice the first voltage within a first and a second, second stage storage mechanism of a second stage voltage booster circuit, and generating about thrice the first voltage based on the second voltage of the second stage voltage booster circuit. In a fifth aspect, apparatus are provided for performing the method of the fourth aspect.
摘要:
A method and structure for decoding n input signals and their complements to one of m output signals is provided. A capacitive network is provided having m output nodes. The output nodes are precharged to a given voltage value. N input signals and their complements are provided each having either a high value or a low value. At least one but less than all of the output nodes are discharged to a value less than the given voltage but greater than ground in output patterns responsive to given input patterns of the true and complement values of the input signals. The output patterns of the discharged nodes is such as to provide one and only one discharged or one and only one undischarged node for any given pattern of input signals. Preferably the capacitive network includes NMOS inversion capacitors.
摘要:
A method and apparatus for using multi-level signals in a gain cell is shown. The method involves of first, storing a value of a multi-level signal in the gain cell. A stepping waveform is then applied to the gain cell and the gain cell outputs a conduction signal when the level of the stepping waveform corresponds to the value of the multilevel signal that is stored within the gain cell. Finally, the value of the multi-level signal is determined through the conduction signal and the corresponding level of the stepping waveform. The gain cell includes an input device, a storage device and a level comparator, which responds to the stepping waveform generated from a stepping signal generator and outputs the conduction signal for determining the value of the multi-level signal stored in the storage device.
摘要:
An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum lithographic feature size is formed on a composite substrate such as a silicon-on-insulator wafer by etching a contact through an insulator to a support semiconductor layer, preferably in combination with formation of a capacitor-like structure reaching to or into the support layer. The anti-fuse may be programmed either by the selected location of conductor formation and/or damaging a dielectric of the capacitor-like structure. An insulating collar is used to surround a portion of either the conductor or the capacitor-like structure to confine damage to the desired location. Heating effects voltage and noise due to programming currents are effectively isolated to the bulk silicon layer, permitting programming during normal operation of the device. Thus the potential for self-repair without interruption of operation is realized.