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Patent Agency Ranking
1.发明公开公开(公告)号：US20240015920A1
公开(公告)日：2024-01-11
申请号：US17858462
申请日：2022-07-06
Applicant: Crestron Electronics Inc.
Inventor： Mark LaBosco , Sanjay Upasani , Edward Joy , Dario Pagano , Alec Magrini
CPC classification number: H05K7/20154 , G06F1/206 , H05K7/20418 , H05K7/20145 , H05K7/20127
Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
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公开(公告)号：US12144142B2
公开(公告)日：2024-11-12
申请号：US17858616
申请日：2022-07-06
Applicant: Crestron Electronics, Inc.
Inventor： Mark LaBosco , Sanjay Upsani , Edward Joy , Dario Pagano , Alec Magrini
Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
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公开(公告)号：US12137533B2
公开(公告)日：2024-11-05
申请号：US17858462
申请日：2022-07-06
Applicant: Crestron Electronics Inc.
Inventor： Mark LaBosco , Sanjay Upasani , Edward Joy , Dario Pagano , Alec Magrini
Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
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4.发明公开公开(公告)号：US20240015922A1
公开(公告)日：2024-01-11
申请号：US17858616
申请日：2022-07-06
Applicant: Crestron Electronics, Inc.
Inventor： Mark LaBosco , Sanjay Upsani , Edward Joy , Dario Pagano , Alec Magrini
CPC classification number: H05K7/20154 , G06F1/206 , H05K7/20145 , H05K7/20127 , H05K7/20445 , H05K7/20209
Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
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公开(公告)号：US20240414875A1
公开(公告)日：2024-12-12
申请号：US18812755
申请日：2024-08-22
Applicant: Crestron Electronics, Inc.
Inventor： Mark LaBosco , Sanjay Upsani , Edward Joy , Dario Pagano , Alec Magrini
Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
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