公开(公告)号：US11683907B2

公开(公告)日：2023-06-20

申请号：US17375045

申请日：2021-07-14

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20145 ,  H05K7/20445

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：US20210345521A1

公开(公告)日：2021-11-04

申请号：US17375045

申请日：2021-07-14

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：US20240015920A1

公开(公告)日：2024-01-11

申请号：US17858462

申请日：2022-07-06

Applicant: Crestron Electronics Inc.

Inventor： Mark LaBosco ,  Sanjay Upasani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20154 ,  G06F1/206 ,  H05K7/20418 ,  H05K7/20145 ,  H05K7/20127

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US20230301015A1

公开(公告)日：2023-09-21

申请号：US18201826

申请日：2023-05-25

Applicant: Crestron Electronics, Inc.

Inventor： William P. Rehak ,  Albert Pedoeem ,  Alec J. Magrini ,  Sanjay Upasani

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20445 ,  H05K7/20145

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

公开(公告)号：US09407033B2

公开(公告)日：2016-08-02

申请号：US14601161

申请日：2015-01-20

Applicant: Crestron Electronics, Inc.

Inventor： Kian-Mun Kong ,  George Feldstein ,  Wendy Feldstein ,  Dhirendra Patel ,  Sanjay Upasani

IPC: H01R13/648 ,  H01R13/52 ,  H01R103/00 ,  H01R24/78

CPC classification number: H01R13/5227 ,  H01R24/78 ,  H01R2103/00

Abstract: A touch screen device includes an electric power receptacle configured for being spill resistant. The electric power receptacle provides a fluidly isolated environment for each contact thereby allowing the electric power receptacle to pass a dielectric withstand test.

Abstract translation: 触摸屏装置包括被配置为防溢出的电力插座。 电力插座为每个触点提供流体隔离的环境，从而允许电力插座通过绝缘耐受试验。

公开(公告)号：US20220030742A1

公开(公告)日：2022-01-27

申请号：US17497042

申请日：2021-10-08

Applicant: Crestron Electronics, Inc.

Inventor： William P Rehak ,  Albert Pedoeem ,  Alec J Magrini ,  Sanjay Upasani

IPC: H05K7/20

Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

公开(公告)号：US20200008317A1

公开(公告)日：2020-01-02

申请号：US16534398

申请日：2019-08-07

Applicant: Crestron Electronics, Inc.

Inventor： Albert Pedoeem ,  Kriss Replogle ,  Sanjay Upasani ,  Don Florczak

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

公开(公告)号：USD729179S1

公开(公告)日：2015-05-12

申请号：US29480288

申请日：2014-01-24

Applicant: Crestron Electronics, Inc.

Designer： King Woo Cheung ,  Wendy Feldstein ,  Dhirendra Patel ,  Sanjay Upasani ,  George Feldstein ,  William Cowles

公开(公告)号：US12137533B2

公开(公告)日：2024-11-05

申请号：US17858462

申请日：2022-07-06

Applicant: Crestron Electronics Inc.

Inventor： Mark LaBosco ,  Sanjay Upasani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US11930615B2

公开(公告)日：2024-03-12

申请号：US18201826

申请日：2023-05-25

Applicant: Crestron Electronics, Inc.

Inventor： William P Rehak ,  Albert Pedoeem ,  Alec J Magrini ,  Sanjay Upasani

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20145 ,  H05K7/20445

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.