公开(公告)号：US12144142B2

公开(公告)日：2024-11-12

申请号：US17858616

申请日：2022-07-06

Applicant: Crestron Electronics, Inc.

Inventor： Mark LaBosco ,  Sanjay Upsani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US12178004B2

公开(公告)日：2024-12-24

申请号：US18638846

申请日：2024-04-18

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US20240032235A1

公开(公告)日：2024-01-25

申请号：US17868941

申请日：2022-07-20

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US20240015920A1

公开(公告)日：2024-01-11

申请号：US17858462

申请日：2022-07-06

Applicant: Crestron Electronics Inc.

Inventor： Mark LaBosco ,  Sanjay Upasani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20154 ,  G06F1/206 ,  H05K7/20418 ,  H05K7/20145 ,  H05K7/20127

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US12137533B2

公开(公告)日：2024-11-05

申请号：US17858462

申请日：2022-07-06

Applicant: Crestron Electronics Inc.

Inventor： Mark LaBosco ,  Sanjay Upasani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US20240015922A1

公开(公告)日：2024-01-11

申请号：US17858616

申请日：2022-07-06

Applicant: Crestron Electronics, Inc.

Inventor： Mark LaBosco ,  Sanjay Upsani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20154 ,  G06F1/206 ,  H05K7/20145 ,  H05K7/20127 ,  H05K7/20445 ,  H05K7/20209

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US20240414875A1

公开(公告)日：2024-12-12

申请号：US18812755

申请日：2024-08-22

Applicant: Crestron Electronics, Inc.

Inventor： Mark LaBosco ,  Sanjay Upsani ,  Edward Joy ,  Dario Pagano ,  Alec Magrini

IPC: H05K7/20 ,  G06F1/20

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

公开(公告)号：US20240268064A1

公开(公告)日：2024-08-08

申请号：US18638846

申请日：2024-04-18

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：US12016153B2

公开(公告)日：2024-06-18

申请号：US17868941

申请日：2022-07-20

Applicant: Crestron Electronics, Inc.

Inventor： Edward Joy ,  Albert Pedoeem ,  Kriss Replogle ,  Charles Magrino

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20209 ,  H05K7/20409

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

公开(公告)号：USD864962S1

公开(公告)日：2019-10-29

申请号：US29628644

申请日：2017-12-06

Applicant: Crestron Electronics, Inc.

Designer： Sae Jhun ,  Wendy Feldstein ,  Edward Joy