公开(公告)号：US20170044672A1

公开(公告)日：2017-02-16

申请号：US15336836

申请日：2016-10-28

申请人： CUPTRONIC TECHNOLOGY LTD

发明人： Björn ATTHOFF ,  Sven GÖTHE

IPC分类号： C23C18/18 ,  C23C18/40 ,  B05D3/06 ,  C25D5/10 ,  C25D5/54 ,  B05D1/28 ,  C23C18/16 ,  C25D3/38

摘要： There is disclosed a method for application of a metal on a substrate, comprising the steps: a) contacting at least a part of the surface of the substrate with at least one selected from: i) at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, and ii) a polymer comprising at least one charged group. The contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate. Subsequently a metal layer is produced on the surface. Advantages include that the compactness of the applied metal layer increases compared to similar methods according to the prior art.

摘要翻译： 公开了一种在衬底上施加金属的方法，包括以下步骤：a）使至少一部分衬底的表面与选自以下的至少一种接触：i）至少一种引发剂和可聚合单元与 经历化学反应以形成聚合物的能力，所述聚合物包含至少一个带电基团，和ii）包含至少一个带电基团的聚合物。 接触是通过将焊盘与包含至少一种物质的板接触并随后使焊盘与衬底的表面接触，从而将至少一种物质转移到衬底的表面来实现的。 随后在表面上产生金属层。 优点包括与现有技术的类似方法相比，施加的金属层的紧密度增加。

公开(公告)号：US20150056410A1

公开(公告)日：2015-02-26

申请号：US14533126

申请日：2014-11-05

申请人： Cuptronic Technology Ltd.

发明人： Sven GÖTHE ,  Björn ATTHOFF

IPC分类号： B05D7/00 ,  B05D5/00 ,  C08J7/04 ,  B05D3/06

CPC分类号： B05D7/548 ,  B05D3/06 ,  B05D5/00 ,  C08J7/045 ,  C08J2355/02 ,  C08J2369/00 ,  C08J2433/02 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1844 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  Y10T428/24355

摘要： A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

摘要翻译： 在基材表面上施用金属的方法包括在基材表面上涂覆溶剂，可聚合单体和光引发剂的混合物，其中光引发剂与单体和溶剂一起不形成两相，即它形成 无定形混合物，无任何晶体。 单体能够聚合成包含至少一个羧基的聚合物。 然后蒸发溶剂。 通过照射施加的干燥混合物诱导聚合。 离子被施加并还原成金属，此后可以沉积更多的金属。 该方法可用于工业过程中，2D和3D表面均可镀金属。 对标准接枝化学品和/或含有卤素原子的聚合物敏感的材料可以被涂覆。