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公开(公告)号：US09560741B2
公开(公告)日：2017-01-31
申请号：US14511397
申请日：2014-10-10
Applicant: Curtiss-Wright Controls, Inc.
Inventor： Michael Rose , Robert Sullivan
CPC classification number: H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
Abstract translation: 电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开 从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。 空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。 反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。
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公开(公告)号：US09986634B2
公开(公告)日：2018-05-29
申请号：US15381301
申请日：2016-12-16
Applicant: Curtiss-Wright Controls, Inc.
Inventor： Michael Rose , Robert Sullivan
CPC classification number: H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
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公开(公告)号：US20150114706A1
公开(公告)日：2015-04-30
申请号：US14511397
申请日：2014-10-10
Applicant: Curtiss-Wright Controls, Inc.
Inventor： Michael Rose , Robert Sullivan
CPC classification number: H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
Abstract translation: 电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开 从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。 空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。 反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。
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公开(公告)号：US20170181270A1
公开(公告)日：2017-06-22
申请号：US15381301
申请日：2016-12-16
Applicant: Curtiss-Wright Controls, Inc.
Inventor： Michael Rose , Robert Sullivan
CPC classification number: H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
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