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公开(公告)号：US11079028B2
公开(公告)日：2021-08-03
申请号：US16805982
申请日：2020-03-02
申请人： DENSO CORPORATION
发明人： Koji Hashimoto , Naohito Seko , Ryo Sano
IPC分类号： F16K11/087 , F16K5/20 , F01P7/14 , F16K31/12 , F16K5/06
摘要： A sleeve member of a movable unit has a first pressure receiving surface and a second pressure receiving surface. The first pressure receiving surface receives a first fluid pressure in an axial direction opposite to a biasing force of a spring, when a valve member closes a seat opening portion. The second pressure receiving surface receives a second fluid pressure in the same axial direction to a direction of the biasing force of the spring, when the valve member closes the seat opening portion. A first surface area and a second surface area are made to be equal to each other. Each of the first and the second surface areas is an area of a projected portion on a virtual plane perpendicular to the axial direction. Each of the projected portions is obtained when each of the first and the second pressure receiving surfaces is projected to the virtual plane.
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公开(公告)号：US09926893B2
公开(公告)日：2018-03-27
申请号：US15068747
申请日：2016-03-14
申请人： DENSO CORPORATION
发明人： Koji Hashimoto
摘要： An exhaust gas recirculation device includes a housing including an inner wall defining an intake passage through which an intake air passes. The housing includes an outlet opening of an EGR gas provided in the inner wall, and a throttle valve positioned in the intake passage and generating a negative pressure at the outlet opening. The housing includes an intake air guide device provided in the housing and guiding the intake air, which has passed between the throttle valve and the inner wall of the housing, toward an axial center area of the intake passage. At least a part of the intake air guide device is positioned on an upstream side of the intake air with respect to the outlet opening.
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公开(公告)号：US09458777B2
公开(公告)日：2016-10-04
申请号：US14074827
申请日：2013-11-08
申请人： DENSO CORPORATION
CPC分类号： F02D41/0065 , F02D41/0077 , F02D41/2464 , F02D41/2477 , F02D2250/16 , F02M26/05 , F02M26/06 , F02M26/21 , F02M26/25 , F02M26/48 , F02M26/64 , Y02T10/47
摘要： A valve is configured to control an opening in a passage. A valve angle sensor is configured to send an electric signal according to a rotation angle of the valve. In a storing process, an actual measurement value of a valve angle at a mechanical full open position is stored as an actual full open valve angle. In a first setting process, a first output value at a mechanical full close position is set. In a second setting process, a second output value at the stored actual full open valve angle is set. The output characteristic is set as an angle to output value relation according to the first output value and the second output value.
摘要翻译： 阀构造成控制通道中的开口。 阀角传感器构造成根据阀的旋转角发送电信号。 在存储过程中，将机械全开位置处的阀角的实际测量值存储为实际全开阀角度。 在第一设定处理中，设定机械全关闭位置的第一输出值。 在第二设定处理中，设定存储的实际全开阀角度的第二输出值。 根据第一输出值和第二输出值将输出特性设定为与输出值关系的角度。
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公开(公告)号：US20140202436A1
公开(公告)日：2014-07-24
申请号：US14074827
申请日：2013-11-08
申请人： DENSO CORPORATION
IPC分类号： F02D41/00
CPC分类号： F02D41/0065 , F02D41/0077 , F02D41/2464 , F02D41/2477 , F02D2250/16 , F02M26/05 , F02M26/06 , F02M26/21 , F02M26/25 , F02M26/48 , F02M26/64 , Y02T10/47
摘要： A valve is configured to control an opening in a passage. A valve angle sensor is configured to send an electric signal according to a rotation angle of the valve. In a storing process, an actual measurement value of a valve angle at a mechanical full open position is stored as an actual full open valve angle. In a first setting process, a first output value at a mechanical full close position is set. In a second setting process, a second output value at the stored actual full open valve angle is set. The output characteristic is set as an angle to output value relation according to the first output value and the second output value.
摘要翻译： 阀构造成控制通道中的开口。 阀角传感器构造成根据阀的旋转角发送电信号。 在存储过程中，将机械全开位置处的阀角的实际测量值存储为实际全开阀角度。 在第一设定处理中，设定机械全关闭位置的第一输出值。 在第二设定处理中，设定存储的实际全开阀角度的第二输出值。 根据第一输出值和第二输出值将输出特性设定为与输出值关系的角度。
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公开(公告)号：US09236276B2
公开(公告)日：2016-01-12
申请号：US14357862
申请日：2012-11-16
申请人： DENSO CORPORATION
IPC分类号： H01L21/56 , H01L21/268 , H01L23/31 , H01L29/84
CPC分类号： H01L21/56 , H01L21/268 , H01L23/3107 , H01L29/84 , H01L2924/0002 , H01L2924/1815 , H01L2924/00
摘要： In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.
摘要翻译： 在半导体器件的制造方法中，用树脂密封半导体芯片，然后施加激光以除去树脂，使得半导体芯片的一部分露出。 该半导体芯片由具有比树脂低的激光吸收性并且不被激光熔化的材料制成。 激光器具有穿过半导体芯片的波长并且在半导体芯片中具有比在树脂中更低的吸收率。 将激光从与半导体芯片的一个板表面相邻的一侧施加到树脂上，使得密封该一个板表面的树脂被升华和去除，并且至少一部分树脂密封该板的另一个 随后通过半导体芯片的激光使表面升华和去除。
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公开(公告)号：US09169906B2
公开(公告)日：2015-10-27
申请号：US13736207
申请日：2013-01-08
申请人： DENSO CORPORATION
CPC分类号： F16H25/00 , F02M26/54 , F02M26/70 , Y02T10/121 , Y10T74/2107
摘要： A link apparatus includes a cam plate, a lever and an accommodation member. The cam plate has a cam groove. The lever has a roller engaged with the cam groove and a pin which is inserted through a center of the roller so that the roller is rotatably supported on the pin. The accommodation member accommodates the cam plate and the lever. The accommodation member and the pin have a distance “A” therebetween. The roller has a thickness “B” along an axial direction of the pin. The value of the distance “A” is smaller than the value of the thickness “B”.
摘要翻译： 连杆装置包括凸轮板，杠杆和收纳构件。 凸轮板具有凸轮槽。 杠杆具有与凸轮槽接合的辊和穿过辊的中心插入的销，使得辊可旋转地支撑在销上。 容纳构件容纳凸轮板和杠杆。 住宿构件和销之间具有距离“A”。 辊沿销的轴向具有厚度“B”。 距离“A”的值小于厚度“B”的值。
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公开(公告)号：US20140315356A1
公开(公告)日：2014-10-23
申请号：US14357862
申请日：2012-11-16
申请人： DENSO CORPORATION
IPC分类号： H01L21/56 , H01L21/268
CPC分类号： H01L21/56 , H01L21/268 , H01L23/3107 , H01L29/84 , H01L2924/0002 , H01L2924/1815 , H01L2924/00
摘要： In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.
摘要翻译： 在半导体器件的制造方法中，用树脂密封半导体芯片，然后施加激光以除去树脂，使得半导体芯片的一部分露出。 该半导体芯片由具有比树脂低的激光吸收性并且不被激光熔化的材料制成。 激光器具有穿过半导体芯片的波长并且在半导体芯片中具有比在树脂中更低的吸收率。 将激光从与半导体芯片的一个板表面相邻的一侧施加到树脂上，使得密封该一个板表面的树脂被升华和去除，并且至少一部分树脂密封该板的另一个 随后通过半导体芯片的激光使表面升华和去除。
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