公开(公告)号：US20240088814A1

公开(公告)日：2024-03-14

申请号：US18511618

申请日：2023-11-16

Applicant: DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  JTEKT CORPORATION

Inventor： Hiroki TOMIZAWA ,  Nobuyori NAKAJIMA ,  Tomoaki YOSHIMI ,  Toyohiro HAYASHI ,  Yosuke YAMASHITA ,  Shintaro TAKAYAMA ,  Yuuta KAJISAWA ,  Yuji FUJITA

IPC: H02P27/06 ,  B62D5/04 ,  H02J9/06

CPC classification number: H02P27/06 ,  B62D5/0484 ,  H02J9/062 ,  B62D5/006

Abstract: When a DC power source fails, the following controls are performed. The normal control is resumed when an inverter input voltage recovers before a standby period elapses after a power failure time. A power source relay is turned off when the standby period elapses without recovery of the voltage. The power source relay is turned on again when a power source relay off period has elapsed from a turn-off time. The normal control is resumed when the inverter input voltage recovers at the turn-on time. The normal control is resumed when the inverter input voltage recovers before the power source relay on period elapses from the turn-on time. The power source relay is turned off, and driving of the actuator is stopped, when the power source relay on period passes without recovery of the voltage.

公开(公告)号：US20150187732A1

公开(公告)日：2015-07-02

申请号：US14578561

申请日：2014-12-22

Applicant: DENSO CORPORATION

Inventor： Tomoaki YOSHIMI ,  Takayuki UCHIDA

IPC: H01L25/065 ,  H01L23/42 ,  H01L23/367 ,  H01L23/053 ,  H01L23/24

CPC classification number: H01L23/367 ,  H01L23/053 ,  H01L23/24 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

Abstract: In an electronic control device, semiconductor modules are disposed in a power region of a substrate, and on a surface of a substrate adjacent to a housing to radiate heat from rear surfaces to the housing through a heat radiation layer. Therefore, a heat radiation performance improves. Further, a first distance from an end surface of a power region corresponding part corresponding to the power region to the substrate is shorter than a second distance from an end surface of a control region corresponding part corresponding to a control region of the substrate to the substrate. Therefore, a closed circuit bridged by parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part. A noise generated from the semiconductor modules is returned to noise sources through the closed circuit without affecting the control region.

Abstract translation: 在电子控制装置中，半导体模块设置在基板的功率区域中，并且在与壳体相邻的基板的表面上，通过散热层从后表面向壳体辐射热量。 因此，散热性能提高。 此外，从与功率区域对应的功率区域对应部分的端面到基板的第一距离比距离对应于基板的控制区域到基板的控制区域对应部分的端面的第二距离短 。 因此，主要在功率区域和功率区域对应部分的区域中形成由寄生电容桥接的闭路。 从半导体模块产生的噪声通过闭路返回到噪声源，而不影响控制区域。

公开(公告)号：US20240088758A1

公开(公告)日：2024-03-14

申请号：US18511606

申请日：2023-11-16

Applicant: DENSO CORPORATION

Inventor： Tomoaki YOSHIMI ,  Yasufumi MATSUO ,  Kunihiko MATSUDA

IPC: H02K11/30 ,  H02K5/22

CPC classification number: H02K11/30 ,  H02K5/225

Abstract: A drive device includes a motor with two sets of motor windings and a control unit. The control unit has a board on which an electronic component related to energization control of the motor windings are mounted, a connector unit, and a cover member that covers control components including the board, and is provided on one side in a axial direction of the motor. The connector unit has two main connectors and at least one sub connector used for connection with an outside, and these openings are provided so as to face a side opposite to the motor. The main connectors are connected with a power supply and a communication network. The sub connector has an opening separate from that of the main connector and is connected to a separate member.

公开(公告)号：US20140254103A1

公开(公告)日：2014-09-11

申请号：US14190682

申请日：2014-02-26

Applicant: DENSO CORPORATION

Inventor： Tomoaki YOSHIMI ,  Shinsuke Oota

IPC: H05K7/20

CPC classification number: H05K7/2089 ,  H05K7/209

Abstract: A substrate of an electronic control unit has a control region on which a control component is disposed and a power region on which a power component is disposed. Substrate-fixing portions of a housing project from a bottom portion, and the substrate is fixed to the substrate-fixing portions. A heat radiating portion extends from the bottom portion. Semiconductor modules are fixed to a first outer surface and a second outer surface of the heat radiating portion, the first outer surface being on a side opposite to the power component. The heat radiating portion is located between the semiconductor modules and the power component. Therefore, heat interference between the semiconductor modules and the power component is reduced, and a heat radiation performance improves.

Abstract translation: 电子控制单元的基板具有设置有控制部件的控制区域和配置有功率部件的功率区域。 壳体的基板固定部从底部伸出，基板固定在基板固定部上。 散热部从底部延伸。 半导体模块固定在散热部分的第一外表面和第二外表面上，第一外表面位于与功率部件相对的一侧。 散热部分位于半导体模块和功率部件之间。 因此，半导体模块和功率部件之间的热干扰降低，散热性能提高。