公开(公告)号：US20160104653A1

公开(公告)日：2016-04-14

申请号：US14894637

申请日：2014-06-03

申请人： DENSO CORPORATION

发明人： Norihisa IMAIZUMI ,  Yuuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Kengo OKA ,  Tasuke FUKUDA ,  Keitarou NAKAMA

IPC分类号： H01L23/31 ,  H01L23/498

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

摘要： In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

摘要翻译： 在基材中，一个表面和另一个表面之间的至少一个侧面是与模制树脂一起切割的切割表面。 与基板一起切割的模制树脂设置有与切割表面齐平的表面。 构成与切割表面齐平的表面的模制树脂的一部分具有与切割面平齐且平行于基板的一个表面的表面接合的表面; 该部分比密封电子部件的部分薄。 因此，用与基板的一个表面平行的表面接触的切割刀片切割模制树脂。

公开(公告)号：US20160133539A1

公开(公告)日：2016-05-12

申请号：US14893987

申请日：2014-05-29

申请人： DENSO CORPORATION

发明人： Kengo OKA ,  Yuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Tasuke FUKUDA

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

摘要翻译： 模具包装体包括具有第一表面和与第一表面相对设置的第二表面的基板，以突出方式布置在第一表面上的布线部分，模塑树脂和树脂膜。 模制树脂部分地密封基板的第一表面和布线部分，并与布线部分相交。 树脂膜设置在基板的第一表面和模制树脂的端部之间，并且密封布线部分和邻近布线部分的基板的第一表面。 树脂膜包括设置在模制树脂内部的第一部分和设置在模制树脂外部的第二部分。 第二部分的上表面比第一部分的上表面低，并且具有比第一部分的上表面少的凹凸部分。