Abstract:
Provided is a surface processing apparatus and a surface processing method for a SiC substrate using anodization. The surface processing apparatus for the SiC substrate includes a surface processing pad and a power supply device. The surface processing pad includes a grinding wheel layer. The grinding wheel layer is disposed facing a workpiece surface of the SiC substrate. The power supply device passes a pulsed current having a period greater than 0.01 seconds and less than or equal to 20 seconds for anodizing the workpiece surface to be processed by the grinding wheel layer through the SiC substrate as an anode in the presence of an electrolyte.
Abstract:
In an electrical discharge machine that applies a voltage between an electrode and a workpiece to generate electrical discharge, an electrode holder holds the electrode. An ultrasonic motor has a fingertip that comes into contact with electrode holder, and moves electrode holder in a driving direction by moving the fingertip in an annular manner at an ultrasonic-range frequency. A roller bearing guides the movement of the electrode holder in the driving direction. A control circuit controls a position of the electrode in the driving direction by driving the ultrasonic motor, and moves the electrode holder based on an abnormality occurring in resistance against the movement of the electrode holder in the driving direction such that the electrode holder is moved by a movement distance equivalent to when the largest roller element among a plurality of roller elements of the roller bearing rolls and rotates once without sliding or longer.
Abstract:
The present invention provides a method of working a high hardness material including the steps of heating the high hardness material, working the high hardness material by using a polishing tool, cooling the polishing tool at a position which is different from a worked part, and washing the polishing tool at a position which is different from the worked part.