公开(公告)号：US20040266069A1

公开(公告)日：2004-12-30

申请号：US10894675

申请日：2004-07-20

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L021/50

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

摘要翻译： 一种封装具有第一和第二表面的制品的方法，包括将制品定位在载体上，使得第一表面的至少一部分接触载体。 承载制品的载体的一部分然后定位在模具内，并且在模具和载体之间形成密封件。 然后用密封材料填充模具以在物品和载体之间形成密封。

公开(公告)号：US20020076859A1

公开(公告)日：2002-06-20

申请号：US09989477

申请日：2001-11-20

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

摘要翻译： 一种封装具有第一和第二表面的制品的方法，包括将制品定位在载体上，使得第一表面的至少一部分接触载体。 承载制品的载体的一部分然后定位在模具内，并且在模具和载体之间形成密封件。 然后用密封材料填充模具以在物品和载体之间形成密封。

公开(公告)号：US20150061657A1

公开(公告)日：2015-03-05

申请号：US14470387

申请日：2014-08-27

申请人： DENSO CORPORATION

发明人： Tomoyuki TAKIGUCHI ,  Ninh Duc HOANG ,  Yoshiyuki KONO ,  Takehito MIZUNUMA

IPC分类号： G01B7/30 ,  B29C45/14 ,  B29C45/26 ,  G01R33/07 ,  G01B7/00

CPC分类号： B29C45/14655 ,  B29C2045/14672 ,  B29K2905/00 ,  B29K2995/0097 ,  B29L2031/3406 ,  F02D41/28 ,  F02D2200/0404 ,  G01D5/145 ,  G01R33/07

摘要： A position detector apparatus includes a detector part, wiring, a resin part, a resin body, a terminal, and a lead frame. The resin part has a thickness at a wiring side portion of the detector part that is greater than a thickness on a side opposite to the wiring side portion. Therefore, when injection-molding the resin part, due to a thickness change of the resin part, the detector part is pressed against a metal mold and a position of the detecting part is fixed. Further, the resin body has a thick-resin portion and a thin-resin portion. The thickness of the thin-resin portion allows a predetermined amount of dislocation of the detector part. Therefore, if the detector part is exposed, water is prevented from intruding the lead frame and the terminal.

摘要翻译： 位置检测器装置包括检测器部分，布线，树脂部分，树脂体，端子和引线框架。 树脂部分在检测器部分的布线侧部分的厚度大于与布线侧部分相反的一侧的厚度。 因此，当注射成型树脂部件时，由于树脂部件的厚度变化，检测器部分被压在金属模具上，并且检测部件的位置被固定。 此外，树脂体具有厚树脂部分和薄树脂部分。 薄树脂部分的厚度允许检测器部分的预定量的位错。 因此，如果检测器部分被暴露，则防止水侵入引线框架和端子。

公开(公告)号：US06605331B1

公开(公告)日：2003-08-12

申请号：US09388045

申请日：1999-09-01

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： B32B302

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

公开(公告)号：US09944002B2

公开(公告)日：2018-04-17

申请号：US14470387

申请日：2014-08-27

申请人： DENSO CORPORATION

发明人： Tomoyuki Takiguchi ,  Ninh Duc Hoang ,  Yoshiyuki Kono ,  Takehito Mizunuma

IPC分类号： B29C45/14 ,  G01D5/14 ,  F02D41/28 ,  G01R33/07 ,  B29L31/34

CPC分类号： B29C45/14655 ,  B29C2045/14672 ,  B29K2905/00 ,  B29K2995/0097 ,  B29L2031/3406 ,  F02D41/28 ,  F02D2200/0404 ,  G01D5/145 ,  G01R33/07

摘要： A position detector apparatus includes a detector part, wiring, a resin part, a resin body, a terminal, and a lead frame. The resin part has a thickness at a wiring side portion of the detector part that is greater than a thickness on a side opposite to the wiring side portion. Therefore, when injection-molding the resin part, due to a thickness change of the resin part, the detector part is pressed against a metal mold and a position of the detecting part is fixed. Further, the resin body has a thick-resin portion and a thin-resin portion. The thickness of the thin-resin portion allows a predetermined amount of dislocation of the detector part. Therefore, if the detector part is exposed, water is prevented from intruding the lead frame and the terminal.

公开(公告)号：US20170200878A1

公开(公告)日：2017-07-13

申请号：US15471324

申请日：2017-03-28

申请人： NICHIA CORPORATION

发明人： Mayumi FUKUDA

IPC分类号： H01L33/62 ,  H01L33/32 ,  H01L33/60 ,  H01L33/48 ,  H01L33/56

CPC分类号： H01L33/62 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L33/005 ,  H01L33/32 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A package includes a first electrode, a second electrode, a wall, and a flange. The polarity of the second electrode is different from that of the first electrode, and at least one of the first electrode and the second electrode has an outer lead component that has a recess formed at a distal end. The wall fixes the first electrode and the second electrode, constitutes a side wall of a bottomed concave component in which at least part of a bottom surface of the bottomed concave component is constituted by the first electrode and the second electrode, and has the outer lead component protruded therefrom. The flange protrudes outward from the wall, and is provided with the same thickness as the outer lead component, on two sides of the outer lead component in plan view where the recess is not formed.

公开(公告)号：US07655508B2

公开(公告)日：2010-02-02

申请号：US10894675

申请日：2004-07-20

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

摘要翻译： 一种封装具有第一和第二表面的制品的方法，包括将制品定位在载体上，使得第一表面的至少一部分接触载体。 承载制品的载体的一部分然后定位在模具内，并且在模具和载体之间形成密封件。 然后用密封材料填充模具以在物品和载体之间形成密封。

公开(公告)号：US06951981B2

公开(公告)日：2005-10-04

申请号：US10321977

申请日：2002-12-17

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

摘要翻译： 封装具有第一和第二表面的制品的方法包括将与制品的第一表面形成密封关系的第一模制部分定位并且将第二模制部分定位成邻近制品的第二表面。 首先填充第一模制部分，从而迫使制品的第二表面与第二模制部分密封接合。 然后填充第二模制部分。

公开(公告)号：US20030086994A1

公开(公告)日：2003-05-08

申请号：US10321977

申请日：2002-12-17

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： B29C045/14 ,  B32B001/04 ,  B29C070/72

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14672 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

摘要翻译： 封装具有第一和第二表面的制品的方法包括将与制品的第一表面形成密封关系的第一模制部分定位并且将第二模制部分定位成邻近制品的第二表面。 首先填充第一模制部分，从而迫使制品的第二表面与第二模制部分密封接合。 然后填充第二模制部分。

公开(公告)号：US6143581A

公开(公告)日：2000-11-07

申请号：US255554

申请日：1999-02-22

申请人： Mark S. Johnson ,  Todd O. Bolken

发明人： Mark S. Johnson ,  Todd O. Bolken

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  B29C45/14418 ,  B29C45/14655 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  B29C2045/14672 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/1352 ,  Y10T428/23 ,  Y10T428/239

摘要： A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.