LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING
    3.
    发明申请
    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING 审中-公开
    用于电子设备冷却的液体冷却介质

    公开(公告)号:US20150319889A1

    公开(公告)日:2015-11-05

    申请号:US14648015

    申请日:2013-12-17

    Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

    Abstract translation: 用于浸入冷却电子硬件设备的液体冷却介质。 如根据ASTM D92测定的,这样的液体冷却介质的闪点为至少190℃,根据ASTM D445确定,在40℃下的粘度为27厘沲(“cSt”)或更小。 这种液体冷却介质可用于浸入冷却诸如计算机服务器,服务器主板和微处理器的设备。

    Conductor Jacket and Process for Producing Same

    公开(公告)号:US20200087494A1

    公开(公告)日:2020-03-19

    申请号:US16470726

    申请日:2017-12-18

    Abstract: The present disclosure provides a process. In an embodiment, the process includes blending a broad molecular weight distribution (MWD) ethylene-based polymer having an 121/12 ratio from 55 to 85 with a narrow MWD ethylene-based polymer having an 121/12 ratio from 20 to 50. The process includes forming a blend component comprising from 20 wt % to 45 wt % of the broad MWD ethylene-based polymer, from 80 wt % to 55 wt % of the narrow MWD ethylene-based polymer, and optional carbon black. The blend component has a density from 0.925 g/cc to 0.955 g/cc and an 121/12 ratio from 30 to 55. The process includes extruding the blend component over a conductor at a rate greater than 1.02 m/s, and forming a conductor jacket having a surface smoothness from 30 μ-inch to 80 μ-inch.

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