LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING
    3.
    发明申请
    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING 审中-公开
    用于电子设备冷却的液体冷却介质

    公开(公告)号:US20150319889A1

    公开(公告)日:2015-11-05

    申请号:US14648015

    申请日:2013-12-17

    IPC分类号: H05K7/20

    摘要: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

    摘要翻译: 用于浸入冷却电子硬件设备的液体冷却介质。 如根据ASTM D92测定的,这样的液体冷却介质的闪点为至少190℃,根据ASTM D445确定,在40℃下的粘度为27厘沲(“cSt”)或更小。 这种液体冷却介质可用于浸入冷却诸如计算机服务器,服务器主板和微处理器的设备。

    Conductor jacket and process for producing same

    公开(公告)号:US11015043B2

    公开(公告)日:2021-05-25

    申请号:US16470726

    申请日:2017-12-18

    IPC分类号: C08L23/06 H01B13/22 C08L23/08

    摘要: The present disclosure provides a process. In an embodiment, the process includes blending a broad molecular weight distribution (MWD) ethylene-based polymer having an 121/12 ratio from 55 to 85 with a narrow MWD ethylene-based polymer having an 121/12 ratio from 20 to 50. The process includes forming a blend component comprising from 20 wt % to 45 wt % of the broad MWD ethylene-based polymer, from 80 wt % to 55 wt % of the narrow MWD ethylene-based polymer, and optional carbon black. The blend component has a density from 0.925 g/cc to 0.955 g/cc and an 121/12 ratio from 30 to 55. The process includes extruding the blend component over a conductor at a rate greater than 1.02 m/s, and forming a conductor jacket having a surface smoothness from 30 μ-inch to 80 μ-inch.

    CABLE WITH POLYMER COMPOSITE CORE
    8.
    发明申请
    CABLE WITH POLYMER COMPOSITE CORE 有权
    电缆与聚合物复合芯

    公开(公告)号:US20160148725A1

    公开(公告)日:2016-05-26

    申请号:US14899798

    申请日:2014-07-07

    摘要: Conductive cores for use in cables, where the conductive core comprises a filled-polymeric-composite material concentrically surrounded by a conductive layer. The filled-polymeric-composite material comprises a polymeric continuous phase having dispersed therein a filler material. Such conductive cores can be employed in various cable designs and further include one or more outer layers, such as dielectric insulation layers, conductive shield layers, and jackets.

    摘要翻译: 用于电缆的导电芯,其中导电芯包括同心地被导电层包围的填充聚合复合材料。 填充聚合物复合材料包括其中分散有填充材料的聚合物连续相。 这种导电芯可以用于各种电缆设计中,并且还包括一个或多个外层,例如电介质绝缘层,导电屏蔽层和护套。

    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING
    9.
    发明申请
    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING 审中-公开
    用于电子设备冷却的液体冷却介质

    公开(公告)号:US20150319887A1

    公开(公告)日:2015-11-05

    申请号:US14649129

    申请日:2013-12-17

    IPC分类号: H05K7/20 C09K5/10

    摘要: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums comprise saturated medium chain triglycerides having fatty acid carbon chain lengths in the range of from 6 to 12 carbon atoms. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

    摘要翻译: 用于浸入冷却电子硬件设备的液体冷却介质。 这种液体冷却介质包括具有6至12个碳原子的脂肪酸碳链长度的饱和中链甘油三酯。 这种液体冷却介质可用于浸入冷却诸如计算机服务器,服务器主板和微处理器的设备。

    Conductor Jacket and Process for Producing Same

    公开(公告)号:US20200087494A1

    公开(公告)日:2020-03-19

    申请号:US16470726

    申请日:2017-12-18

    IPC分类号: C08L23/08 C08L23/06

    摘要: The present disclosure provides a process. In an embodiment, the process includes blending a broad molecular weight distribution (MWD) ethylene-based polymer having an 121/12 ratio from 55 to 85 with a narrow MWD ethylene-based polymer having an 121/12 ratio from 20 to 50. The process includes forming a blend component comprising from 20 wt % to 45 wt % of the broad MWD ethylene-based polymer, from 80 wt % to 55 wt % of the narrow MWD ethylene-based polymer, and optional carbon black. The blend component has a density from 0.925 g/cc to 0.955 g/cc and an 121/12 ratio from 30 to 55. The process includes extruding the blend component over a conductor at a rate greater than 1.02 m/s, and forming a conductor jacket having a surface smoothness from 30 μ-inch to 80 μ-inch.