摘要:
A vegetable-based dielectric fluid comprising in weight percent of triglycerides based on the weight of the fluid: A. Greater than 0 to 100% of at least one of C14:1 or C16:1 fatty acids; and at least one of: B. No more than (≦) 10% of C18:1 fatty acids; C. No more than (≦) 12% of one or more polyunsaturated fatty acids; and D. No more than (≦) 7% of one or more saturated fatty acids. The dielectric fluid is a useful transformer oil.
摘要:
A dielectric fluid comprising in weight percent based on the weight of the composition: A. 30 to 70% C18:1 fatty acids; B. 10 to 55% of a mixture of C8 and C10 fatty acids in which the mixture comprises 50 to 70 wt %, based on the weight of the mixture, of C8 fatty acids; C. No more than 13% polyunsaturated fatty acids; and D. No more than 7% of saturated fatty acids of which each contains at least 12 carbon atoms.
摘要:
Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.
摘要:
Conductive cores for use in cables, where the conductive core comprises a filled-polymeric-composite material concentrically surrounded by a conductive layer. The filled-polymeric-composite material comprises a polymeric continuous phase having dispersed therein a filler material. Such conductive cores can be employed in various cable designs and further include one or more outer layers, such as dielectric insulation layers, conductive shield layers, and jackets.
摘要:
Polymeric compositions having a slip agent comprising a silicone and a fatty acid amide. Such polymeric compositions can exhibit lower coefficients of friction when compared to polymeric compositions containing either silicone or fatty acid amide alone. Such polymeric compositions are suitable for use in various articles of manufacture, including, for example, wire and cable jackets.
摘要:
A dielectric fluid comprising in weight percent based on the weight of the composition: A. 30 to 70% C18:1 fatty acids; B. 10 to 55% of a mixture of C8 and C10 fatty acids in which the mixture comprises 50 to 70 wt %, based on the weight of the mixture, of C8 fatty acids; C. No more than 13% polyunsaturated fatty acids; and D. No more than 7% of saturated fatty acids of which each contains at least 12 carbon atoms.
摘要:
The present disclosure provides a process. In an embodiment, the process includes blending a broad molecular weight distribution (MWD) ethylene-based polymer having an 121/12 ratio from 55 to 85 with a narrow MWD ethylene-based polymer having an 121/12 ratio from 20 to 50. The process includes forming a blend component comprising from 20 wt % to 45 wt % of the broad MWD ethylene-based polymer, from 80 wt % to 55 wt % of the narrow MWD ethylene-based polymer, and optional carbon black. The blend component has a density from 0.925 g/cc to 0.955 g/cc and an 121/12 ratio from 30 to 55. The process includes extruding the blend component over a conductor at a rate greater than 1.02 m/s, and forming a conductor jacket having a surface smoothness from 30 μ-inch to 80 μ-inch.
摘要:
Conductive cores for use in cables, where the conductive core comprises a filled-polymeric-composite material concentrically surrounded by a conductive layer. The filled-polymeric-composite material comprises a polymeric continuous phase having dispersed therein a filler material. Such conductive cores can be employed in various cable designs and further include one or more outer layers, such as dielectric insulation layers, conductive shield layers, and jackets.
摘要:
Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums comprise saturated medium chain triglycerides having fatty acid carbon chain lengths in the range of from 6 to 12 carbon atoms. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.
摘要:
The present disclosure provides a process. In an embodiment, the process includes blending a broad molecular weight distribution (MWD) ethylene-based polymer having an 121/12 ratio from 55 to 85 with a narrow MWD ethylene-based polymer having an 121/12 ratio from 20 to 50. The process includes forming a blend component comprising from 20 wt % to 45 wt % of the broad MWD ethylene-based polymer, from 80 wt % to 55 wt % of the narrow MWD ethylene-based polymer, and optional carbon black. The blend component has a density from 0.925 g/cc to 0.955 g/cc and an 121/12 ratio from 30 to 55. The process includes extruding the blend component over a conductor at a rate greater than 1.02 m/s, and forming a conductor jacket having a surface smoothness from 30 μ-inch to 80 μ-inch.