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公开(公告)号：US20050093121A1
公开(公告)日：2005-05-05
申请号：US10707865
申请日：2004-01-20
申请人： Da-Jung Chen , Che-Hung Lin , Chin-Hsiung Liao , Cheng-Chieh Hsu
发明人： Da-Jung Chen , Che-Hung Lin , Chin-Hsiung Liao , Cheng-Chieh Hsu
IPC分类号： H01L23/433 , H01L23/495 , H01L23/52
CPC分类号： H01L23/4334 , H01L23/49575 , H01L24/48 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package comprising a substrate, a lead frame, a chip, a set of bonded wires, a heat sink and a packaging material is provided. The substrate has a first metallic layer, a second metallic layer and a conductor. The first metallic layer is formed on a first surface of the substrate and the second metallic layer is formed on a second surface of the substrate. The conductor is formed on a lateral surface of the substrate. The first metallic layer is electrically connected to the second metallic layer through the conductor. The lead frame is attached on the first surface of the substrate and is electrically connected to the first metallic layer. The chip has a back surface attached to the lead frame or the first surface of the substrate. The chip is connected with the lead frame through the bonding wires. The heat sink is attached on the second surface of the substrate and electrically connected with the second metallic layer. The packaging material encapsulates the chip, the bonded wires and the lead frame.
摘要翻译： 提供了包括基板，引线框架，芯片，一组接合线，散热器和封装材料的芯片封装。 基板具有第一金属层，第二金属层和导体。 第一金属层形成在基板的第一表面上，第二金属层形成在基板的第二表面上。 导体形成在基板的侧表面上。 第一金属层通过导体与第二金属层电连接。 引线框架安装在基板的第一表面上并与第一金属层电连接。 芯片具有附接到引线框架或基板的第一表面的后表面。 芯片通过接合线与引线框架连接。 散热器安装在基板的第二表面上并与第二金属层电连接。 封装材料封装芯片，接合线和引线框架。
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公开(公告)号：US6130477A
公开(公告)日：2000-10-10
申请号：US270807
申请日：1999-03-17
CPC分类号： H01L23/36 , H01L23/34 , H01L24/50 , H01L2924/07802 , H01L2924/12042 , H01L2924/14
摘要： A thin enhanced TAB BGA package includes an IC chip, a substrate having a center opening and one side laid with a metallic circuitry which has a plurality of inner leads extending to the center opening, a plurality of metallic solder balls attached to the substrate at one side and coupling with the metallic circuitry, and a heat dissipating member adhering partly to the a side of the chip and partly to the substrate for heat dissipating, positioning and supporting the IC chip and the substrate. The IC chip has a another side exposed to ambience to add heat dissipating effect. The heat dissipating member has about same thickness as the substrate. Hence the ball grid array package may be made of a small size and thin thickness. The adhering of heat dissipating member to the chip and substrate may be done at the same process of bonding the inner leads to the IC chip. Thus the thin enhanced TAB BGA package of this invention may be produced at low cost without additional equipment or process.
摘要翻译： 薄增强TAB BGA封装包括IC芯片，具有中心开口的基板和一侧铺设有金属电路的基板，金属电路具有延伸到中心开口的多个内引线，多个金属焊球在一个基板上附接 并且与金属电路耦合，以及散热构件，部分地粘附到芯片的一侧，部分地粘附到基板上，用于散热，定位和支撑IC芯片和基板。 IC芯片具有另一面暴露于氛围以增加散热效果。 散热构件具有与衬底大致相同的厚度。 因此，球栅阵列封装可以由小尺寸和薄的厚度制成。 散热构件对芯片和基板的附着可以在将内引线连接到IC芯片的相同过程中进行。 因此，本发明的薄增强TAB BGA封装可以以低成本生产，而无需额外的设备或工艺。
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公开(公告)号：US07896690B1
公开(公告)日：2011-03-01
申请号：US12889413
申请日：2010-09-24
申请人： Cheng-Chieh Hsu , Chung-Ping Feng
发明人： Cheng-Chieh Hsu , Chung-Ping Feng
IPC分类号： H01R11/00
CPC分类号： H01R31/06 , H01R13/111 , H01R13/514 , H01R13/6271
摘要： Disclosed herein is an electrical connector, which includes a first base, a second base and a cover. The first base includes a first recess and a first conductor. The first recess is positioned on an upper surface of the first base. The first conductor extends into the first recess through a lateral surface of the first base. The second base, has a structure similar to the first base, and includes a second recess and a second conductor. The cover includes a body, a first convex ring, a second convex ring and a metallic connector. When the cover engages with both the first and second bases, the first and second convex rings respectively engages with the first and second recesses, and thus forming two enclosed space.
摘要翻译： 本文公开了一种电连接器，其包括第一基座，第二基座和盖。 第一基座包括第一凹部和第一导体。 第一凹部位于第一基座的上表面上。 第一导体通过第一基座的侧表面延伸到第一凹槽中。 第二基座具有类似于第一基座的结构，并且包括第二凹部和第二导体。 盖包括主体，第一凸环，第二凸环和金属连接器。 当盖与第一和第二基座接合时，第一和第二凸环分别与第一和第二凹部接合，从而形成两个封闭空间。
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公开(公告)号：US06215180B1
公开(公告)日：2001-04-10
申请号：US09270808
申请日：1999-03-17
IPC分类号： H01L2334
CPC分类号： H01L23/564 , H01L23/36 , H01L23/3675 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A dual-sided heat dissipating structure for BGA package includes a step-shaped first heat dissipating member adhering to an active side of the chip and a dish-shaped perforated second heat dissipating member adhering to a non-active side of the chip so that heat generated in the chip may be dissipated more effectively. The step surface first heat dissipating member may also serve as a press mold to enable bonding of inner leads of the substrate to the bonding pads of the chip be done along with adhering of the first heat dissipating member to the chip at same process in the mean time without additional process or equipment. The perforated second heat dissipating member enables moisture escaping from the package to avoid pop corn effect resulting from IR Reflow test. The package may be made at a thin thickness and low cost.
摘要翻译： 用于BGA封装的双面散热结构包括附着在芯片的有源侧的阶梯状的第一散热构件和附着在芯片的非活动侧的碟形的穿孔的第二散热构件，使得热量 在芯片中产生的可以更有效地消散。 台阶表面第一散热构件也可以用作压模以使得可以将衬底的内引线与芯片的焊盘接合，同时将第一散热构件以平均值相同的方式粘附到芯片 时间没有额外的过程或设备。 穿孔的第二散热构件使得水分从包装中逸出，以避免IR回流测试产生的流行玉米效应。 该封装可以以薄的厚度和低成本制成。
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