公开(公告)号：US20020029894A1

公开(公告)日：2002-03-14

申请号：US09987855

申请日：2001-11-16

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01L023/02

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

公开(公告)号：US20010007285A1

公开(公告)日：2001-07-12

申请号：US09804149

申请日：2001-03-13

申请人： Dai Nippon Insatsu Kabushiki Kaisha

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H05K005/06

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。 半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。 通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。