公开(公告)号：US20020029894A1

公开(公告)日：2002-03-14

申请号：US09987855

申请日：2001-11-16

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01L023/02

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

公开(公告)号：US20020132931A1

公开(公告)日：2002-09-19

申请号：US10098488

申请日：2002-03-18

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA, SHINJUKU-KU JAPAN

发明人： Masayoshi Okubo ,  Shinya Sakaguchi ,  Atsushi Takamatsu ,  Hiroharu Sasaki ,  Kazuyoshi Tsuneta

IPC分类号： C08F008/14

CPC分类号： C08L51/003 ,  C08F265/04 ,  C08F265/06 ,  C09D151/003

摘要： A resin composition for an aqueous paint containing different phase structure emulsion particles obtained by multi-stage emulsion polymerization as a binder, wherein the different phase structure emulsion particles have an outermost phase formed by an emulsion polymer of an ethylenic unsaturated monomer, having a glass transition temperature of from null500null C. to 10null C., and satisfy the following conditions (1) to (3): (1) the emulsion polymer forming the outermost phase contains from 1 to 20 mass % of an ethylenic unsaturated monomer having at least one of a polyethylene glycol chain and a polypropylene glycol chain, p1 (2) at least one phase of inner phases from the outermost phase of the different phase structure emulsion particles comprises an emulsion polymer of an ethylenic unsaturated monomer having a glass transition temperature of from 30null C. to 110null C., and (3) the binder has a minimum film-forming temperature of at most 100null C.

摘要翻译： 一种含有通过多级乳液聚合作为粘合剂获得的不同相结构乳液颗粒的水性涂料用树脂组合物，其中，所述不同相结构乳液颗粒具有由具有玻璃化转变温度的烯属不饱和单体的乳液聚合物形成的最外相 温度为-500℃至10℃，满足以下条件（1）至（3）：（1）形成最外相的乳液聚合物含有1至20质量％的具有 聚乙二醇链和聚丙二醇链中的至少一种，p1（2）来自不同相结构乳液颗粒的最外相的内相的至少一相包含具有玻璃化转变温度的烯属不饱和单体的乳液聚合物 为30℃〜110℃，（3）粘结剂的成膜温度为100℃以下。

公开(公告)号：US20010007285A1

公开(公告)日：2001-07-12

申请号：US09804149

申请日：2001-03-13

申请人： Dai Nippon Insatsu Kabushiki Kaisha

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H05K005/06

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。 半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。 通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

公开(公告)号：US20040029731A1

公开(公告)日：2004-02-12

申请号：US10635675

申请日：2003-08-07

申请人： Dai Nippon Insatsu Kabushiki Kaisha

发明人： Katsuyuki Oshima ,  Jitsuhiko Ando ,  Masanori Torii

IPC分类号： B41M005/20

CPC分类号： B41M5/42 ,  B41M5/38228 ,  B41M5/405 ,  B41M5/423 ,  B41M5/443 ,  B41M5/46 ,  B41M7/0027 ,  B41M7/0072 ,  B41M7/009 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24802 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/265 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31768 ,  Y10T428/31786 ,  Y10T428/31801 ,  Y10T428/31855 ,  Y10T428/31928 ,  Y10T428/31935 ,  Y10T428/31971

摘要： The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.

公开(公告)号：US20020187899A1

公开(公告)日：2002-12-12

申请号：US10112932

申请日：2002-04-02

申请人： Dai Nippon Insatsu Kabushiki Kaisha

发明人： Masanori Akada ,  Noritaka Egashira ,  Shunsuke Mukasa ,  Takao Suzuki ,  Hideo Hosoi ,  Yoshikazu Ito ,  Jumpei Kanto ,  Mitsuru Takeda ,  Masaki Kutsukake ,  Yasuo Otatsume

IPC分类号： B41M005/38

CPC分类号： B41M5/38257 ,  B41M5/0256 ,  B41M5/42 ,  B41M7/0027 ,  B44C1/1716 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24868

摘要： The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

公开(公告)号：US20010046592A1

公开(公告)日：2001-11-29

申请号：US09885094

申请日：2001-06-21

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA

发明人： Katsuyuki Oshima ,  Jitsuhiko Ando ,  Masanori Torii

IPC分类号： B32B003/00 ,  B32B027/14

CPC分类号： B41M5/42 ,  B41M5/38228 ,  B41M5/405 ,  B41M5/423 ,  B41M5/443 ,  B41M5/46 ,  B41M7/0027 ,  B41M7/0072 ,  B41M7/009 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24802 ,  Y10T428/24876 ,  Y10T428/24893 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/265 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31768 ,  Y10T428/31786 ,  Y10T428/31801 ,  Y10T428/31855 ,  Y10T428/31928 ,  Y10T428/31935 ,  Y10T428/31971

摘要： The present invention relates to a heat transfer cover film characterized in that a specific transparent resin layer (2) is releasably provided on a substrate film (1). This transparent resin layer (2) can be easily laminated on the surface of the resulting image (7Y, 7M and 7C) by heat transfer means, making it possible to provide expeditious provision of image representations which are improved in terms of such properties as durability, gloss and color development and is curl-free.

摘要翻译： 本发明涉及一种传热覆盖膜，其特征在于，将特定的透明树脂层（2）可剥离地设置在基底膜（1）上。 这种透明树脂层（2）可以通过传热装置容易地层压在所得图像（7Y，7M和7C）的表面上，使得可以提供快速提供图像表示，其在诸如耐久性 ，光泽和颜色发展，无卷曲。

公开(公告)号：US20010020973A1

公开(公告)日：2001-09-13

申请号：US09260017

申请日：1999-03-02

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA

发明人： MASANORI AKADA ,  YOSHIKAZU ITO ,  JUMPEI KANTO ,  MITSURU TAKEDA ,  MASAKI KUTSUKAKE ,  NORITAKA EGASHIRA ,  SHUNSUKE MUKASA ,  TAKAO SUZUKI ,  HIDEO HOSOI ,  YASUO OTATSUME

IPC分类号： B41J002/325 ,  B41J031/00

CPC分类号： B41M5/38257 ,  B41M5/0256 ,  B41M5/42 ,  B41M7/0027 ,  B44C1/1716 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24868

摘要： The present invention relates to image-formation on any selected kind of objective body. The characterizing features reside in such that, based upon fed image data, required images are formed on an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique, and then, by the use of said sheet with said images thus formed thereon, the formed images thereon are transferringly applied on the objective body. By adopting the above measures, the objective body can be formed sharply and clearly with any desired images, irrespective of kind and configuration thereof, with such superior results of highly improved unity and solidability between the formed images and the objective body to be decorated with.

摘要翻译： 本发明涉及任何选定种类的物体上的图像形成。 特征特征在于，基于馈送的图像数据，所需的图像形成在用于图像转移服务的图像转印片材上，并且依赖于升华图像转印技术，然后通过使用所述片材与 所以形成在其上的图像，其上形成的图像被转印地施加在物体上。 通过采用上述措施，可以用任何所需的图像，无论其种类和结构如何，都可以清楚地和清楚地形成目标体，同时具有如此优异的结果，即，所形成的图像与要装饰的目标体之间的一体性和可固化性具有高度的改善。