公开(公告)号：US20050023654A1

公开(公告)日：2005-02-03

申请号：US10797807

申请日：2004-03-10

申请人： Dalson Seng Kim ,  Jeffrey Fook ,  Lee Kuan

发明人： Dalson Seng Kim ,  Jeffrey Fook ,  Lee Kuan

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L23/495 ,  B33Y70/00 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A semiconductor component includes a chip on board leadframe, a semiconductor die back bonded and wire bonded to the leadframe, an encapsulant on the die and an area array of terminal contacts on the leadframe. The leadframe includes leadfingers, interconnect bonding sites for wire bonding the die, terminal bonding sites for the terminal contacts, and bus bars which electrically connect selected leadfingers to one another. The interconnect bonding sites are located on the leadframe relative to the bus bars such that shorting to the bus bars by wire interconnects is eliminated. A method for fabricating the component includes the steps of attaching the die to the leadframe, bonding the wire interconnects to the die and to the interconnect bonding sites, forming the encapsulant, and then forming the terminal contacts on the terminal bonding sites.

摘要翻译： 半导体部件包括：芯片上的引线框架，半导体管芯接合和引线接合引线框架，芯片上的密封剂和引线框架上的端子触点的区域阵列。 引线框架包括引线端子，用于引线接合管芯的互连结合部位，用于端子触头的端子接合部位和将所选择的引线彼此电连接的母线。 互连结合位置相对于母线位于引线框架上，从而消除了通过线互连对母线的短路。 一种用于制造该部件的方法包括以下步骤：将裸片连接到引线框架，将导线互连件连接到管芯和互连接合部位，形成密封剂，然后在端子接合位置形成端子触点。