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5 条记录 (耗时 0.018 秒)

    Contextual visual dataspaces
    3.
    发明授权
    Contextual visual dataspaces 有权

    公开(公告)号：US11025865B1

    公开(公告)日：2021-06-01

    申请号：US13163558

    申请日：2011-06-17

    申请人： Swarup S. Medasani ,  Yuri Owechko ,  Kyungnam Kim ,  Alexander Krayner

    发明人： Swarup S. Medasani ,  Yuri Owechko ,  Kyungnam Kim ,  Alexander Krayner

    IPC分类号： H04N7/18

    摘要： A method is disclosed. The method receives a two dimensional or a three dimensional computer generated representation of an area, receives a plurality of images of the area captured by one or more video cameras, detects a first moving object in the plurality of images, generates a computer representation of the first moving object, correlates the images of the area captured by the one or more video cameras with the two dimensional or three dimensional computer generated representation of the area, and displays the computer representation of the first moving object in the two dimensional or the three dimensional computer generated representation of the area.

    Multilayer wiring board and multilayer wiring package
    4.
    发明授权
    Multilayer wiring board and multilayer wiring package 有权
    多层布线板和多层布线封装

    公开(公告)号：US06372999B1

    公开(公告)日：2002-04-16

    申请号：US09295037

    申请日：1999-04-20

    申请人： William D. Bjorndahl ,  M. David Saferstein ,  Alexander Krayner ,  Cindy S. Fietze ,  Kenneth C. Selk ,  Rene R. Martinez ,  William E. McMullen

    发明人： William D. Bjorndahl ,  M. David Saferstein ,  Alexander Krayner ,  Cindy S. Fietze ,  Kenneth C. Selk ,  Rene R. Martinez ,  William E. McMullen

    IPC分类号： H01R1204

    CPC分类号： H05K3/103 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/10287

    摘要： A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair 18,19,18′,19 of reinforced resin layers sandwiching the signal carrying wires 20,20′. The board 10 can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board 10. Applications include digital, high-speed digital and RF interconnects.

    摘要翻译： 多层布线板10包括具有多层增强树脂材料12,18,19,26,18'，19'，26'的基板，设置在至少一个主表面上的图案化导电层28,28' 基板，至少部分地设置在基板上的多个通孔30,32,34,36以及多个信号承载线20,20'。 信号承载线20,20'设置在增强树脂材料层12,18,19,26,18'，19'，26'的至少两层之间。 信号承载线20,20'可以嵌入在树脂层21,21'中，树脂层21,21'夹在强化树脂材料层之间的一对18,19,18'，19之间。 增强树脂材料12,18,19,26,18'，19优选为纤维增强树脂材料，例如玻璃纤维增​​强环氧树脂或聚酰亚胺材料。 在一些应用中，可以在基材的主表面和增强的基体的对18,19,18'，19之间提供约束芯22,24,22'，24'，例如铜/钼/铜层压板 夹着信号承载线20,20'的树脂层。 板10可用于多层布线封装，其中多个集成电路芯片安装在板10的主表面上。应用包括数字，高速数字和RF互连。

    Apparatus for Manufacture of Flat Bread and Method for Manufacture the Same
    5.
    发明申请
    Apparatus for Manufacture of Flat Bread and Method for Manufacture the Same 审中-公开
    平面面包制造装置及其制造方法

    公开(公告)号：US20120156346A1

    公开(公告)日：2012-06-21

    申请号：US12973442

    申请日：2010-12-20

    申请人： Ashot Grigoryan ,  Alexander Krayner

    发明人： Ashot Grigoryan ,  Alexander Krayner

    IPC分类号： H05B3/68 ,  A21D8/06

    CPC分类号： A21D8/06 ,  A21D13/42

    摘要： A device and method for heating a food product are disclosed. The device contains a support member for supporting a food product in a first position and a second position, a heating mechanism associated with the support member and positioned to heat the support member when the support member is in the first position and in the second position, and another heating mechanism positioned to heat the food product when the food product is in the second position.

    摘要翻译： 公开了一种用于加热食品的装置和方法。 该装置包括用于在第一位置和第二位置支撑食品的支撑构件，与支撑构件相关联并定位成当支撑构件处于第一位置并处于第二位置时加热支撑构件的加热机构， 以及另一加热机构，其定位成当食品处于第二位置时加热食品。