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    Memory cell formation using ion implant isolated conductive metal oxide
    1.
    发明申请
    Memory cell formation using ion implant isolated conductive metal oxide 失效
    使用离子注入隔离导电金属氧化物的存储单元形成

    公开(公告)号：US20100159641A1

    公开(公告)日：2010-06-24

    申请号：US12653851

    申请日：2009-12-18

    申请人： Darrell Rinerson ,  Jonathan Bornstein ,  David Hansen ,  Robin Cheung ,  Steven W. Longcor ,  Rene Meyer ,  Lawrence Schloss

    发明人： Darrell Rinerson ,  Jonathan Bornstein ,  David Hansen ,  Robin Cheung ,  Steven W. Longcor ,  Rene Meyer ,  Lawrence Schloss

    IPC分类号： H01L21/34

    CPC分类号： F01D17/26 ,  F04D29/563 ,  H01L21/02565 ,  H01L27/0688 ,  H01L27/2409 ,  H01L27/2418 ,  H01L27/2472 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1666

    摘要： Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnOX, LaSrCoOX, LaNiOX, etc.) over the bottom electrode. At least one portion of the layer of CMO is configured to act as a memory element without etching, and performing ion implantation on portions of the layer(s) of CMO to create insulating metal oxide (IMO) regions in the layer(s) of CMO. The IMO regions are positioned adjacent to electrically conductive CMO regions in the unetched layer(s) of CMO and the electrically conductive CMO regions are disposed above and in contact with the bottom electrode and form memory elements operative to store non-volatile data as a plurality of conductivity profiles (e.g., resistive states indicative of stored data).

    摘要翻译： 公开了使用离子注入隔离的导电金属氧化物的存储单元形成，包括在未蚀刻的导电金属氧化物层之下形成底部电极，形成未蚀刻的导电金属氧化物层，包括沉积至少一层导电金属氧化物（ CMO）材料（例如，PrCaMnOX，LaSrCoOX，LaNiOX等）。 CMO层的至少一部分被配置为用作存储元件而不进行蚀刻，并且在CMO的层的部分上执行离子注入以在层的一个或多个层中形成绝缘金属氧化物（IMO）区域 CMO。 IMO区域邻近CMO的未蚀刻层中的导电CMO区域定位，并且导电CMO区域设置在底部电极的上方并与底部电极接触，并且形成用于将非易失性数据存储为多个的存储元件 （例如，表示存储数据的电阻状态）。

    Memory cell formation using ion implant isolated conductive metal oxide
    2.
    发明授权
    Memory cell formation using ion implant isolated conductive metal oxide 失效
    使用离子注入隔离导电金属氧化物的存储单元形成

    公开(公告)号：US08003511B2

    公开(公告)日：2011-08-23

    申请号：US12653851

    申请日：2009-12-18

    申请人： Darrell Rinerson ,  Jonathan Bornstein ,  Robin Cheung ,  David Hansen ,  Steven W. Longcor ,  Rene Meyer ,  Lawrence Schloss

    发明人： Darrell Rinerson ,  Jonathan Bornstein ,  Robin Cheung ,  David Hansen ,  Steven W. Longcor ,  Rene Meyer ,  Lawrence Schloss

    IPC分类号： H01L21/44

    CPC分类号： F01D17/26 ,  F04D29/563 ,  H01L21/02565 ,  H01L27/0688 ,  H01L27/2409 ,  H01L27/2418 ,  H01L27/2472 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1666

    摘要： Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnOX, LaSrCoOX, LaNiOX, etc.) over the bottom electrode. At least one portion of the layer of CMO is configured to act as a memory element without etching, and performing ion implantation on portions of the layer(s) of CMO to create insulating metal oxide (IMO) regions in the layer(s) of CMO. The IMO regions are positioned adjacent to electrically conductive CMO regions in the unetched layer(s) of CMO and the electrically conductive CMO regions are disposed above and in contact with the bottom electrode and form memory elements operative to store non-volatile data as a plurality of conductivity profiles (e.g., resistive states indicative of stored data).

    摘要翻译： 公开了使用离子注入隔离的导电金属氧化物的存储单元形成，包括在未蚀刻的导电金属氧化物层之下形成底部电极，形成未蚀刻的导电金属氧化物层，包括沉积至少一层导电金属氧化物（ CMO）材料（例如，PrCaMnOX，LaSrCoOX，LaNiOX等）。 CMO层的至少一部分被配置为用作存储元件而不进行蚀刻，并且在CMO的层的部分上执行离子注入以在层的一个或多个层中形成绝缘金属氧化物（IMO）区域 CMO。 IMO区域邻近CMO的未蚀刻层中的导电CMO区域定位，并且导电CMO区域设置在底部电极的上方并与底部电极接触，并且形成用于将非易失性数据存储为多个的存储元件 （例如，表示存储数据的电阻状态）。

    Memory device using ion implant isolated conductive metal oxide
    3.
    发明授权
    Memory device using ion implant isolated conductive metal oxide 有权
    使用离子注入隔离导电金属氧化物的存储器件

    公开(公告)号：US08268667B2

    公开(公告)日：2012-09-18

    申请号：US13215895

    申请日：2011-08-23

    申请人： Darrell Rinerson ,  Robin Cheung ,  David Hansen ,  Steven Longcor ,  Rene Meyer ,  Jonathan Bornstein ,  Lawrence Schloss

    发明人： Darrell Rinerson ,  Robin Cheung ,  David Hansen ,  Steven Longcor ,  Rene Meyer ,  Jonathan Bornstein ,  Lawrence Schloss

    IPC分类号： H01L21/00

    CPC分类号： F01D17/26 ,  F04D29/563 ,  H01L21/02565 ,  H01L27/0688 ,  H01L27/2409 ,  H01L27/2418 ,  H01L27/2472 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1666

    摘要： Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnOx, LaSrCoOx, LaNiOx, etc.) over the bottom electrode. At least one portion of the layer of CMO is configured to act as a memory element without etching, and performing ion implantation on portions of the layer(s) of CMO to create insulating metal oxide (IMO) regions in the layer(s) of CMO. The IMO regions are positioned adjacent to electrically conductive CMO regions in the unetched layer(s) of CMO and the electrically conductive CMO regions are disposed above and in contact with the bottom electrode and form memory elements operative to store non-volatile data as a plurality of conductivity profiles (e.g., resistive states indicative of stored data).

    摘要翻译： 公开了使用离子注入隔离的导电金属氧化物的存储单元形成，包括在未蚀刻的导电金属氧化物层之下形成底部电极，形成未蚀刻的导电金属氧化物层，包括沉积至少一层导电金属氧化物（ CMO）材料（例如，PrCaMnOx，LaSrCoOx，LaNiOx等）。 CMO层的至少一部分被配置为用作存储元件而不进行蚀刻，并且在CMO的层的部分上执行离子注入以在层的一个或多个层中形成绝缘金属氧化物（IMO）区域 CMO。 IMO区域邻近CMO的未蚀刻层中的导电CMO区域定位，并且导电CMO区域设置在底部电极的上方并与底部电极接触并且形成用于将非易失性数据存储为多个的存储元件 （例如，表示存储数据的电阻状态）。

    Continuous plane of thin-film materials for a two-terminal cross-point memory
    5.
    发明授权
    Continuous plane of thin-film materials for a two-terminal cross-point memory 失效
    用于两端交叉点存储器的薄膜材料的连续平面

    公开(公告)号：US07742323B2

    公开(公告)日：2010-06-22

    申请号：US11881474

    申请日：2007-07-26

    申请人： Darrell Rinerson ,  Jonathan Bornstein ,  Robin Cheung ,  David Hansen ,  Travis Byonghyop Oh

    发明人： Darrell Rinerson ,  Jonathan Bornstein ,  Robin Cheung ,  David Hansen ,  Travis Byonghyop Oh

    IPC分类号： G11C11/00

    CPC分类号： H01L27/101 ,  H01L27/2418 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1641 ,  H01L45/165 ,  Y10S257/903

    摘要： A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper.

    摘要翻译： 公开了一种包括多个基本平坦的薄膜层或多个共形薄膜层的存储器件的结构。 薄膜层形成与第一和第二包覆导体电串联的存储元件，并且可操作以将数据存储为多个电导率分布。 施加在第一和第二包层导体上的选择电压用于在存储器件上执行数据操作。 存储器件可以可选地包括与存储元件和第一和第二包层导体串联电的非欧姆器件。 为了形成存储元件，存储器件的制造不需要蚀刻多个薄膜层。 存储元件可以包括具有选择性结晶的多晶部分和非晶部分的CMO层。 包层导体可以包括由铜制成的芯材料。

    Continuous plane of thin-film materials for a two-terminal cross-point memory
    6.
    发明授权
    Continuous plane of thin-film materials for a two-terminal cross-point memory 有权
    用于两端交叉点存储器的薄膜材料的连续平面

    公开(公告)号：US08237142B2

    公开(公告)日：2012-08-07

    申请号：US12932642

    申请日：2011-03-01

    申请人： Robin Cheung ,  Jonathan Bornstein ,  David Hansen ,  Travis Byonghyop Oh ,  Darrell Rinerson

    发明人： Robin Cheung ,  Jonathan Bornstein ,  David Hansen ,  Travis Byonghyop Oh ,  Darrell Rinerson

    IPC分类号： H01L29/02 ,  H01L29/06

    CPC分类号： H01L27/101 ,  H01L27/2418 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1641 ,  H01L45/165

    摘要： A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper.

    摘要翻译： 公开了一种包括多个基本平坦的薄膜层或多个共形薄膜层的存储器件的结构。 薄膜层形成与第一和第二包覆导体电串联的存储元件，并且可操作以将数据存储为多个电导率分布。 施加在第一和第二包层导体上的选择电压用于在存储器件上执行数据操作。 存储器件可以可选地包括与存储元件和第一和第二包层导体串联电的非欧姆器件。 为了形成存储元件，存储器件的制造不需要蚀刻多个薄膜层。 存储元件可以包括具有选择性结晶的多晶部分和非晶部分的CMO层。 包层导体可以包括由铜制成的芯材料。

    Continuous plane of thin-film materials for a two-terminal cross-point memory
    9.
    发明申请
    Continuous plane of thin-film materials for a two-terminal cross-point memory 审中-公开
    用于两端交叉点存储器的薄膜材料的连续平面

    公开(公告)号：US20110133147A1

    公开(公告)日：2011-06-09

    申请号：US12931773

    申请日：2011-02-09

    申请人： Robin Cheung ,  Darrell Rinerson ,  Travis Byonghyop Oh ,  Jon Bornstein ,  David Hansen

    发明人： Robin Cheung ,  Darrell Rinerson ,  Travis Byonghyop Oh ,  Jon Bornstein ,  David Hansen

    IPC分类号： H01L29/02

    CPC分类号： H01L27/101 ,  H01L27/2418 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1641 ,  H01L45/165 ,  Y10S257/903

    摘要： A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper.

    摘要翻译： 公开了一种包括多个基本平坦的薄膜层或多个共形薄膜层的存储器件的结构。 薄膜层形成与第一和第二包覆导体电串联的存储元件，并且可操作以将数据存储为多个电导率分布。 施加在第一和第二包层导体上的选择电压用于在存储器件上执行数据操作。 存储器件可以可选地包括与存储元件和第一和第二包层导体串联电的非欧姆器件。 为了形成存储元件，存储器件的制造不需要蚀刻多个薄膜层。 存储元件可以包括具有选择性结晶的多晶部分和非晶部分的CMO层。 包层导体可以包括由铜制成的芯材料。