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公开(公告)号：US09842752B2
公开(公告)日：2017-12-12
申请号：US13923955
申请日：2013-06-21
IPC分类号： H01L21/67 , H01J37/317 , H01L21/265 , H05B3/00
CPC分类号： H01L21/67115 , H01J37/3171 , H01J2237/2001 , H01L21/26506 , H01L21/67201 , H01L21/67213 , H05B3/0047
摘要： A semiconductor manufacturing system or process, such as an ion implantation system, apparatus and method, including a component or step for heating a semiconductor workpiece are provided. An optical heat source emits light energy to heat the workpiece. The optical heat source is configured to provide minimal or reduced emission of non-visible wavelengths of light energy and emit light energy at a wavelength in a maximum energy light absorption range of the workpiece.
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公开(公告)号：US20150037983A1
公开(公告)日：2015-02-05
申请号：US13923955
申请日：2013-06-21
IPC分类号： H01L21/324 , H01J37/16 , H01L21/67 , H01J37/317
CPC分类号： H01L21/67115 , H01J37/3171 , H01J2237/2001 , H01L21/26506 , H01L21/67201 , H01L21/67213 , H05B3/0047
摘要： A semiconductor manufacturing system or process, such as an ion implantation system, apparatus and method, including a component or step for heating a semiconductor workpiece are provided. An optical heat source emits light energy to heat the workpiece. The optical heat source is configured to provide minimal or reduced emission of non-visible wavelengths of light energy and emit light energy at a wavelength in a maximum energy light absorption range of the workpiece.
摘要翻译： 提供了半导体制造系统或工艺，例如离子注入系统，装置和方法，包括用于加热半导体工件的部件或步骤。 光学热源发射光能以加热工件。 光学热源被配置为提供最小或减少的不可见波长的光能的发射，并在工件的最大能量光吸收范围内的波长处发射光能。
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3.发明申请公开(公告)号：US20070164237A1
公开(公告)日：2007-07-19
申请号：US11334265
申请日：2006-01-18
申请人： David Bernhardt
发明人： David Bernhardt
IPC分类号： H01J37/317
CPC分类号： H01J37/3172 , H01J37/248 , H01J2237/2487 , H01J2237/30411
摘要： An improved HE LINAC-based ion implantation system is disclosed utilizing direct digital synthesis (DDS) techniques to obtain precise frequency and phase control and automated electrode voltage phase calibration. The DDS controller may be used on a multi-stage linear accelerator based implanter to digitally synchronize the frequency and phase of the electric fields to each electrode within each stage of the accelerator. The DDS controller includes digital phase synthesis (DPS) circuits for modulating the phase of the electric field to the electrodes, and a master oscillator that uses digital frequency synthesis or DFS to digitally synthesize a master frequency and phase applied to each of the DPS circuits. Also disclosed are methods for automatically phase and amplitude calibrating the RF electrode voltages of the stages.
摘要翻译： 公开了一种改进的基于HE LINAC的离子注入系统，其利用直接数字合成（DDS）技术来获得精确的频率和相位控制以及自动电极电压相位校准。 DDS控制器可以用在基于多级线性加速器的注入器上，以将加速器的每个阶段内的电场的频率和相位数字地同步到每个电极。 DDS控制器包括用于调制电极相位的数字相位合成（DPS）电路，以及使用数字频率合成或DFS的主振荡器来数字地合成施加到每个DPS电路的主频率和相位。 还公开了用于自动相位和幅度校准级的RF电极电压的方法。
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公开(公告)号：US20070008105A1
公开(公告)日：2007-01-11
申请号：US11147973
申请日：2005-06-08
申请人： Kevin Verrier , David Bernhardt , Jerry Negrotti , Donald Polner
发明人： Kevin Verrier , David Bernhardt , Jerry Negrotti , Donald Polner
IPC分类号： G08B19/00
CPC分类号： H01L21/67259 , H01L21/68
摘要： Method and apparatus for use in setting up workpiece treatment or processing equipment. A disclosed system processes silicon wafers that are treated during processing steps in producing semiconductor integrated circuits. The processing equipment includes a wafer support that supports a wafer in a treatment region during wafer processing. A housing provides a controlled environment within the housing interior for processing the wafer on the wafer support. A mechanical transfer system transports wafers to and from the support. A wafer simulator is used to simulate wafer movement and includes a pressure sensor for monitoring contact between the simulator and the wafer transfer and support equipment. In one illustrated embodiment the wafer simulator is generally circular and includes three equally spaced pressure sensors for monitoring contact with wafer transport and support equipment.
摘要翻译： 用于设置工件处理或加工设备的方法和装置。 所公开的系统处理在制造半导体集成电路的处理步骤期间处理的硅晶片。 处理设备包括在晶片处理期间在处理区域中支撑晶片的晶片支撑件。 壳体在壳体内部提供受控的环境，用于在晶片支撑件上处理晶片。 机械传输系统将晶片传送到支撑件和从支撑件传送晶片。 使用晶片模拟器来模拟晶片移动，并且包括用于监测模拟器与晶片转移和支撑设备之间的接触的压力传感器。 在一个所示实施例中，晶片模拟器通常是圆形的并且包括三个等间隔的压力传感器，用于监测与晶片输送和支撑设备的接触。
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公开(公告)号：US20060121998A1
公开(公告)日：2006-06-08
申请号：US11004651
申请日：2004-12-03
申请人： David Bernhardt
发明人： David Bernhardt
IPC分类号： A63B43/00
CPC分类号： A63B37/0002
摘要： A finger grip has a resilient transparent tubular body which is adapted to be inserted into a finger hole of a bowling ball. The insert has a generally cylindrical inner wall surface with a pair of opposing gripping surfaces at each end of the insert. Thus, the insert provides four gripping members in a single insert.
摘要翻译： 手指握持件具有弹性的透明管状体，其适于插入保龄球的指孔中。 插入件具有大致圆柱形的内壁表面，在插入件的每个端部具有一对相对的夹持表面。 因此，插入件在单个插入件中提供四个夹紧构件。
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